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Electronics & Semiconductor

Total: 130699 records, 13070 pages

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Global Linear Pluggable Optics (LPO) Supply, Demand and Key Producers, 2024-2030

date 12 Apr 2024

date Electronics & Semiconductor

new_biaoQian Linear Pluggable Optics (LPO)

Linear Pluggable Optics (LPO) is a term used in the context of optical networking to describe a form factor and interface standard for high-speed optical transceivers. LPO modules are designed to provide flexible and modular optical connectivity in networking equipment, such as switches and routers. The concept of LPO emerged as a response to the need for a compact, hot-swappable, and interoperable form factor for high-speed optical transceivers. LPO modules are typically small in size and feature a pluggable design that allows for easy installation and removal without interrupting network operation. LPO modules are commonly used in data centers, telecommunications networks, and other high-bandwidth applications where flexible and scalable optical connectivity is essential. They offer a modular approach to optical networking, allowing for easy upgrades, replacement, and scalability as network bandwidth requirements evolve.

USD4480.00

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Global Semiconductor Wafer Supply, Demand and Key Producers, 2024-2030

date 12 Apr 2024

date Electronics & Semiconductor

new_biaoQian Semiconductor Wafer

A wafer, also known as substrate or slice, is a thin disk-like round material on which semiconductors are grown. In simple words, a wafer acts as the base to manufacture semiconductors. The first stage in the semiconductor manufacturing process is to produce a wafer. All the semiconductor manufacturing processes operate on the wafer surface to build the end product “chip” or integrated circuit (IC).

USD4480.00

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Global Active and Passive Electronic Component Supply, Demand and Key Producers, 2024-2030

date 12 Apr 2024

date Electronics & Semiconductor

new_biaoQian Active and Passive Electronic Component

Active and Passive Electronic Components are two major categories within the electronics industry, each playing a crucial role in electronic circuit design.

USD4480.00

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Global Active and Passive Electronic Component Market 2024 by Company, Regions, Type and Application, Forecast to 2030

date 12 Apr 2024

date Electronics & Semiconductor

new_biaoQian Active and Passive Electronic Component

Active and Passive Electronic Components are two major categories within the electronics industry, each playing a crucial role in electronic circuit design.

USD3480.00

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Global PCB Laser Drilling Machines Supply, Demand and Key Producers, 2024-2030

date 12 Apr 2024

date Electronics & Semiconductor

new_biaoQian PCB Laser Drilling Machines

A PCB laser drilling machine is a piece of equipment specifically used in the electronics manufacturing industry for precision laser drilling in printed circuit boards (PCBs). These machines utilize laser technology to create tiny and precise holes in PCBs to meet the manufacturing needs of high-density circuit boards and microelectronic devices. These devices play a key role in PCB manufacturing for the electronics industry, supporting a variety of applications including the creation of vias, fabrication of microvias, and implementation of precision circuit designs.

USD4480.00

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Global MEMS Acoustic Sensors Supply, Demand and Key Producers, 2024-2030

date 12 Apr 2024

date Electronics & Semiconductor

new_biaoQian MEMS Acoustic Sensors

MEMS Acoustic Sensor or MEMS microphone is a tiny device that employs a pressure-sensitive diaphragm etched on a semiconductor, generally less than 1 millimeter, that can be incorporated directly onto an electronic chip and commonly uses a small thin membrane fabricated on the chip to detect sound. A MEMS microphone is composed by a diaphragm vibrating between two holed back-plates. MEMS microphones target all audio applications where small size, high sound quality, reliability and affordability are key requirements.

USD4480.00

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Global DBC Ceramic Substrate Supply, Demand and Key Producers, 2024-2030

date 12 Apr 2024

date Electronics & Semiconductor

new_biaoQian DBC Ceramic Substrate

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate. DBC (Direct Bonded Copper) substrates are mainly used in IGBT modules.

USD4480.00

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Global Backlight Module Supply, Demand and Key Producers, 2024-2030

date 12 Apr 2024

date Electronics & Semiconductor

new_biaoQian Backlight Module

The global Backlight Module market size is expected to reach $ 5650 million by 2030, rising at a market growth of 3.7% CAGR during the forecast period (2024-2030).

USD4480.00

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Global InGaAs Photodiodes and Arrays Supply, Demand and Key Producers, 2024-2030

date 12 Apr 2024

date Electronics & Semiconductor

new_biaoQian InGaAs Photodiodes and Arrays

InGaAs photodiodes are sensitive to wavelengths over a wide spectral range and are available as image sensors, linear/area arrays, photodiode/amplifier combination devices, etc.

USD4480.00

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Global GaN-on-Si Wafer Supply, Demand and Key Producers, 2024-2030

date 12 Apr 2024

date Electronics & Semiconductor

new_biaoQian GaN-on-Si Wafer

Gallium nitride (GaN) is used as the wide band gap material for next generation power semiconductors and high frequency devices. Gallium Nitride on Silicon wafers are used for both Power and 5F/RF application, D-mode GaN-on-Si HEMT & E-mode GaN-on-Si HEMT, etc. Currently the key size is 6 inch GaN Si wafer, and the 8 inch GaN Si wafer will grow faster.

USD4480.00

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industry 12 Apr 2024

industry Electronics & Semiconductor

new_biaoQian Linear Pluggable Optics (LPO)

Linear Pluggable Optics (LPO) is a term used in the context of optical networking to describe a form factor and interface standard for high-speed optical transceivers. LPO modules are designed to provide flexible and modular optical connectivity in networking equipment, such as switches and routers. The concept of LPO emerged as a response to the need for a compact, hot-swappable, and interoperable form factor for high-speed optical transceivers. LPO modules are typically small in size and feature a pluggable design that allows for easy installation and removal without interrupting network operation. LPO modules are commonly used in data centers, telecommunications networks, and other high-bandwidth applications where flexible and scalable optical connectivity is essential. They offer a modular approach to optical networking, allowing for easy upgrades, replacement, and scalability as network bandwidth requirements evolve.

USD4480.00

addToCart

Add To Cart

industry 12 Apr 2024

industry Electronics & Semiconductor

new_biaoQian Semiconductor Wafer

A wafer, also known as substrate or slice, is a thin disk-like round material on which semiconductors are grown. In simple words, a wafer acts as the base to manufacture semiconductors. The first stage in the semiconductor manufacturing process is to produce a wafer. All the semiconductor manufacturing processes operate on the wafer surface to build the end product “chip” or integrated circuit (IC).

USD4480.00

addToCart

Add To Cart

industry 12 Apr 2024

industry Electronics & Semiconductor

new_biaoQian Active and Passive Electronic Component

Active and Passive Electronic Components are two major categories within the electronics industry, each playing a crucial role in electronic circuit design.

USD4480.00

addToCart

Add To Cart

industry 12 Apr 2024

industry Electronics & Semiconductor

new_biaoQian Active and Passive Electronic Component

Active and Passive Electronic Components are two major categories within the electronics industry, each playing a crucial role in electronic circuit design.

USD3480.00

addToCart

Add To Cart

industry 12 Apr 2024

industry Electronics & Semiconductor

new_biaoQian PCB Laser Drilling Machines

A PCB laser drilling machine is a piece of equipment specifically used in the electronics manufacturing industry for precision laser drilling in printed circuit boards (PCBs). These machines utilize laser technology to create tiny and precise holes in PCBs to meet the manufacturing needs of high-density circuit boards and microelectronic devices. These devices play a key role in PCB manufacturing for the electronics industry, supporting a variety of applications including the creation of vias, fabrication of microvias, and implementation of precision circuit designs.

USD4480.00

addToCart

Add To Cart

industry 12 Apr 2024

industry Electronics & Semiconductor

new_biaoQian MEMS Acoustic Sensors

MEMS Acoustic Sensor or MEMS microphone is a tiny device that employs a pressure-sensitive diaphragm etched on a semiconductor, generally less than 1 millimeter, that can be incorporated directly onto an electronic chip and commonly uses a small thin membrane fabricated on the chip to detect sound. A MEMS microphone is composed by a diaphragm vibrating between two holed back-plates. MEMS microphones target all audio applications where small size, high sound quality, reliability and affordability are key requirements.

USD4480.00

addToCart

Add To Cart

industry 12 Apr 2024

industry Electronics & Semiconductor

new_biaoQian DBC Ceramic Substrate

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate. DBC (Direct Bonded Copper) substrates are mainly used in IGBT modules.

USD4480.00

addToCart

Add To Cart

industry 12 Apr 2024

industry Electronics & Semiconductor

new_biaoQian Backlight Module

The global Backlight Module market size is expected to reach $ 5650 million by 2030, rising at a market growth of 3.7% CAGR during the forecast period (2024-2030).

USD4480.00

addToCart

Add To Cart

industry 12 Apr 2024

industry Electronics & Semiconductor

new_biaoQian InGaAs Photodiodes and Arrays

InGaAs photodiodes are sensitive to wavelengths over a wide spectral range and are available as image sensors, linear/area arrays, photodiode/amplifier combination devices, etc.

USD4480.00

addToCart

Add To Cart

industry 12 Apr 2024

industry Electronics & Semiconductor

new_biaoQian GaN-on-Si Wafer

Gallium nitride (GaN) is used as the wide band gap material for next generation power semiconductors and high frequency devices. Gallium Nitride on Silicon wafers are used for both Power and 5F/RF application, D-mode GaN-on-Si HEMT & E-mode GaN-on-Si HEMT, etc. Currently the key size is 6 inch GaN Si wafer, and the 8 inch GaN Si wafer will grow faster.

USD4480.00

addToCart

Add To Cart

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