Global Epoxy Molding Compounds for Semiconductor Encapsulation Supply, Demand and Key Producers, 2023-2029
Page: 124
Published Date: 23 Jan 2023
Category: Chemical & Material
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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Description
The global Epoxy Molding Compounds for Semiconductor Encapsulation market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).
This report studies the global Epoxy Molding Compounds for Semiconductor Encapsulation production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Epoxy Molding Compounds for Semiconductor Encapsulation, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Epoxy Molding Compounds for Semiconductor Encapsulation that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Epoxy Molding Compounds for Semiconductor Encapsulation total production and demand, 2018-2029, (MT)
Global Epoxy Molding Compounds for Semiconductor Encapsulation total production value, 2018-2029, (USD Million)
Global Epoxy Molding Compounds for Semiconductor Encapsulation production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (MT)
Global Epoxy Molding Compounds for Semiconductor Encapsulation consumption by region & country, CAGR, 2018-2029 & (MT)
U.S. VS China: Epoxy Molding Compounds for Semiconductor Encapsulation domestic production, consumption, key domestic manufacturers and share
Global Epoxy Molding Compounds for Semiconductor Encapsulation production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (MT)
Global Epoxy Molding Compounds for Semiconductor Encapsulation production by Type, production, value, CAGR, 2018-2029, (USD Million) & (MT)
Global Epoxy Molding Compounds for Semiconductor Encapsulation production by Application production, value, CAGR, 2018-2029, (USD Million) & (MT)
This reports profiles key players in the global Epoxy Molding Compounds for Semiconductor Encapsulation market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI and Eternal Materials, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Epoxy Molding Compounds for Semiconductor Encapsulation market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (MT) and average price (US$/MT) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.
Global Epoxy Molding Compounds for Semiconductor Encapsulation Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Epoxy Molding Compounds for Semiconductor Encapsulation Market, Segmentation by Type
Normal Epoxy Molding Compound
Green Epoxy Molding Compound
Global Epoxy Molding Compounds for Semiconductor Encapsulation Market, Segmentation by Application
Lead Frame Package
Area Alley Package
Electronic Control Unit (ECU)
Companies Profiled:
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
Key Questions Answered
1. How big is the global Epoxy Molding Compounds for Semiconductor Encapsulation market?
2. What is the demand of the global Epoxy Molding Compounds for Semiconductor Encapsulation market?
3. What is the year over year growth of the global Epoxy Molding Compounds for Semiconductor Encapsulation market?
4. What is the production and production value of the global Epoxy Molding Compounds for Semiconductor Encapsulation market?
5. Who are the key producers in the global Epoxy Molding Compounds for Semiconductor Encapsulation market?
6. What are the growth factors driving the market demand?
Table of Contents
1 Supply Summary
1.1 Epoxy Molding Compounds for Semiconductor Encapsulation Introduction
1.2 World Epoxy Molding Compounds for Semiconductor Encapsulation Supply & Forecast
1.2.1 World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value (2018 & 2022 & 2029)
1.2.2 World Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2029)
1.2.3 World Epoxy Molding Compounds for Semiconductor Encapsulation Pricing Trends (2018-2029)
1.3 World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Region (Based on Production Site)
1.3.1 World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Region (2018-2029)
1.3.2 World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Region (2018-2029)
1.3.3 World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Region (2018-2029)
1.3.4 North America Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2029)
1.3.5 Europe Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2029)
1.3.6 China Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2029)
1.3.7 Japan Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2029)
1.4 Market Drivers, Restraints and Trends
1.4.1 Epoxy Molding Compounds for Semiconductor Encapsulation Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Epoxy Molding Compounds for Semiconductor Encapsulation Major Market Trends
1.5 Influence of COVID-19 and Russia-Ukraine War
1.5.1 Influence of COVID-19
1.5.2 Influence of Russia-Ukraine War
2.1 World Epoxy Molding Compounds for Semiconductor Encapsulation Demand (2018-2029)
2.2 World Epoxy Molding Compounds for Semiconductor Encapsulation Consumption by Region
2.2.1 World Epoxy Molding Compounds for Semiconductor Encapsulation Consumption by Region (2018-2023)
2.2.2 World Epoxy Molding Compounds for Semiconductor Encapsulation Consumption Forecast by Region (2024-2029)
2.3 United States Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029)
2.4 China Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029)
2.5 Europe Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029)
2.6 Japan Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029)
2.7 South Korea Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029)
2.8 ASEAN Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029)
2.9 India Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029)
3.1 World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Manufacturer (2018-2023)
3.2 World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Manufacturer (2018-2023)
3.3 World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Manufacturer (2018-2023)
3.4 Epoxy Molding Compounds for Semiconductor Encapsulation Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
3.5.1 Global Epoxy Molding Compounds for Semiconductor Encapsulation Industry Rank of Major Manufacturers
3.5.2 Global Concentration Ratios (CR4) for Epoxy Molding Compounds for Semiconductor Encapsulation in 2022
3.5.3 Global Concentration Ratios (CR8) for Epoxy Molding Compounds for Semiconductor Encapsulation in 2022
3.6 Epoxy Molding Compounds for Semiconductor Encapsulation Market: Overall Company Footprint Analysis
3.6.1 Epoxy Molding Compounds for Semiconductor Encapsulation Market: Region Footprint
3.6.2 Epoxy Molding Compounds for Semiconductor Encapsulation Market: Company Product Type Footprint
3.6.3 Epoxy Molding Compounds for Semiconductor Encapsulation Market: Company Product Application Footprint
3.7 Competitive Environment
3.7.1 Historical Structure of the Industry
3.7.2 Barriers of Market Entry
3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations
4.1 United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Comparison
4.1.1 United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Comparison (2018 & 2022 & 2029)
4.1.2 United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share Comparison (2018 & 2022 & 2029)
4.2 United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Production Comparison
4.2.1 United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Production Comparison (2018 & 2022 & 2029)
4.2.2 United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share Comparison (2018 & 2022 & 2029)
4.3 United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Consumption Comparison
4.3.1 United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Consumption Comparison (2018 & 2022 & 2029)
4.3.2 United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Consumption Market Share Comparison (2018 & 2022 & 2029)
4.4 United States Based Epoxy Molding Compounds for Semiconductor Encapsulation Manufacturers and Market Share, 2018-2023
4.4.1 United States Based Epoxy Molding Compounds for Semiconductor Encapsulation Manufacturers, Headquarters and Production Site (States, Country)
4.4.2 United States Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Value (2018-2023)
4.4.3 United States Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2023)
4.5 China Based Epoxy Molding Compounds for Semiconductor Encapsulation Manufacturers and Market Share
4.5.1 China Based Epoxy Molding Compounds for Semiconductor Encapsulation Manufacturers, Headquarters and Production Site (Province, Country)
4.5.2 China Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Value (2018-2023)
4.5.3 China Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2023)
4.6 Rest of World Based Epoxy Molding Compounds for Semiconductor Encapsulation Manufacturers and Market Share, 2018-2023
4.6.1 Rest of World Based Epoxy Molding Compounds for Semiconductor Encapsulation Manufacturers, Headquarters and Production Site (State, Country)
4.6.2 Rest of World Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Value (2018-2023)
4.6.3 Rest of World Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2023)
5.1 World Epoxy Molding Compounds for Semiconductor Encapsulation Market Size Overview by Type: 2018 VS 2022 VS 2029
5.2 Segment Introduction by Type
5.2.1 Normal Epoxy Molding Compound
5.2.2 Green Epoxy Molding Compound
5.3 Market Segment by Type
5.3.1 World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Type (2018-2029)
5.3.2 World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Type (2018-2029)
5.3.3 World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Type (2018-2029)
6.1 World Epoxy Molding Compounds for Semiconductor Encapsulation Market Size Overview by Application: 2018 VS 2022 VS 2029
6.2 Segment Introduction by Application
6.2.1 Lead Frame Package
6.2.2 Area Alley Package
6.2.3 Electronic Control Unit (ECU)
6.3 Market Segment by Application
6.3.1 World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Application (2018-2029)
6.3.2 World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Application (2018-2029)
6.3.3 World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Application (2018-2029)
7.1 Sumitomo Bakelite
7.1.1 Sumitomo Bakelite Details
7.1.2 Sumitomo Bakelite Major Business
7.1.3 Sumitomo Bakelite Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.1.4 Sumitomo Bakelite Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.1.5 Sumitomo Bakelite Recent Developments/Updates
7.1.6 Sumitomo Bakelite Competitive Strengths & Weaknesses
7.2 Hitachi Chemical
7.2.1 Hitachi Chemical Details
7.2.2 Hitachi Chemical Major Business
7.2.3 Hitachi Chemical Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.2.4 Hitachi Chemical Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.2.5 Hitachi Chemical Recent Developments/Updates
7.2.6 Hitachi Chemical Competitive Strengths & Weaknesses
7.3 Chang Chun Group
7.3.1 Chang Chun Group Details
7.3.2 Chang Chun Group Major Business
7.3.3 Chang Chun Group Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.3.4 Chang Chun Group Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.3.5 Chang Chun Group Recent Developments/Updates
7.3.6 Chang Chun Group Competitive Strengths & Weaknesses
7.4 Hysol Huawei Electronics
7.4.1 Hysol Huawei Electronics Details
7.4.2 Hysol Huawei Electronics Major Business
7.4.3 Hysol Huawei Electronics Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.4.4 Hysol Huawei Electronics Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.4.5 Hysol Huawei Electronics Recent Developments/Updates
7.4.6 Hysol Huawei Electronics Competitive Strengths & Weaknesses
7.5 Panasonic
7.5.1 Panasonic Details
7.5.2 Panasonic Major Business
7.5.3 Panasonic Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.5.4 Panasonic Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.5.5 Panasonic Recent Developments/Updates
7.5.6 Panasonic Competitive Strengths & Weaknesses
7.6 Kyocera
7.6.1 Kyocera Details
7.6.2 Kyocera Major Business
7.6.3 Kyocera Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.6.4 Kyocera Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.6.5 Kyocera Recent Developments/Updates
7.6.6 Kyocera Competitive Strengths & Weaknesses
7.7 KCC
7.7.1 KCC Details
7.7.2 KCC Major Business
7.7.3 KCC Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.7.4 KCC Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.7.5 KCC Recent Developments/Updates
7.7.6 KCC Competitive Strengths & Weaknesses
7.8 Samsung SDI
7.8.1 Samsung SDI Details
7.8.2 Samsung SDI Major Business
7.8.3 Samsung SDI Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.8.4 Samsung SDI Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.8.5 Samsung SDI Recent Developments/Updates
7.8.6 Samsung SDI Competitive Strengths & Weaknesses
7.9 Eternal Materials
7.9.1 Eternal Materials Details
7.9.2 Eternal Materials Major Business
7.9.3 Eternal Materials Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.9.4 Eternal Materials Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.9.5 Eternal Materials Recent Developments/Updates
7.9.6 Eternal Materials Competitive Strengths & Weaknesses
7.10 Jiangsu Zhongpeng New Material
7.10.1 Jiangsu Zhongpeng New Material Details
7.10.2 Jiangsu Zhongpeng New Material Major Business
7.10.3 Jiangsu Zhongpeng New Material Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.10.4 Jiangsu Zhongpeng New Material Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.10.5 Jiangsu Zhongpeng New Material Recent Developments/Updates
7.10.6 Jiangsu Zhongpeng New Material Competitive Strengths & Weaknesses
7.11 Shin-Etsu Chemical
7.11.1 Shin-Etsu Chemical Details
7.11.2 Shin-Etsu Chemical Major Business
7.11.3 Shin-Etsu Chemical Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.11.4 Shin-Etsu Chemical Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.11.5 Shin-Etsu Chemical Recent Developments/Updates
7.11.6 Shin-Etsu Chemical Competitive Strengths & Weaknesses
7.12 Hexion
7.12.1 Hexion Details
7.12.2 Hexion Major Business
7.12.3 Hexion Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.12.4 Hexion Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.12.5 Hexion Recent Developments/Updates
7.12.6 Hexion Competitive Strengths & Weaknesses
7.13 Nepes
7.13.1 Nepes Details
7.13.2 Nepes Major Business
7.13.3 Nepes Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.13.4 Nepes Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.13.5 Nepes Recent Developments/Updates
7.13.6 Nepes Competitive Strengths & Weaknesses
7.14 Tianjin Kaihua Insulating Material
7.14.1 Tianjin Kaihua Insulating Material Details
7.14.2 Tianjin Kaihua Insulating Material Major Business
7.14.3 Tianjin Kaihua Insulating Material Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.14.4 Tianjin Kaihua Insulating Material Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.14.5 Tianjin Kaihua Insulating Material Recent Developments/Updates
7.14.6 Tianjin Kaihua Insulating Material Competitive Strengths & Weaknesses
7.15 HHCK
7.15.1 HHCK Details
7.15.2 HHCK Major Business
7.15.3 HHCK Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.15.4 HHCK Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.15.5 HHCK Recent Developments/Updates
7.15.6 HHCK Competitive Strengths & Weaknesses
7.16 Scienchem
7.16.1 Scienchem Details
7.16.2 Scienchem Major Business
7.16.3 Scienchem Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.16.4 Scienchem Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.16.5 Scienchem Recent Developments/Updates
7.16.6 Scienchem Competitive Strengths & Weaknesses
7.17 Beijing Sino-tech Electronic Material
7.17.1 Beijing Sino-tech Electronic Material Details
7.17.2 Beijing Sino-tech Electronic Material Major Business
7.17.3 Beijing Sino-tech Electronic Material Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
7.17.4 Beijing Sino-tech Electronic Material Epoxy Molding Compounds for Semiconductor Encapsulation Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.17.5 Beijing Sino-tech Electronic Material Recent Developments/Updates
7.17.6 Beijing Sino-tech Electronic Material Competitive Strengths & Weaknesses
8.1 Epoxy Molding Compounds for Semiconductor Encapsulation Industry Chain
8.2 Epoxy Molding Compounds for Semiconductor Encapsulation Upstream Analysis
8.2.1 Epoxy Molding Compounds for Semiconductor Encapsulation Core Raw Materials
8.2.2 Main Manufacturers of Epoxy Molding Compounds for Semiconductor Encapsulation Core Raw Materials
8.3 Midstream Analysis
8.4 Downstream Analysis
8.5 Epoxy Molding Compounds for Semiconductor Encapsulation Production Mode
8.6 Epoxy Molding Compounds for Semiconductor Encapsulation Procurement Model
8.7 Epoxy Molding Compounds for Semiconductor Encapsulation Industry Sales Model and Sales Channels
8.7.1 Epoxy Molding Compounds for Semiconductor Encapsulation Sales Model
8.7.2 Epoxy Molding Compounds for Semiconductor Encapsulation Typical Customers
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
Table of Figures
List of Tables
Table 1. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Region (2018, 2022 and 2029) & (USD Million)
Table 2. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Region (2018-2023) & (USD Million)
Table 3. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Region (2024-2029) & (USD Million)
Table 4. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share by Region (2018-2023)
Table 5. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share by Region (2024-2029)
Table 6. World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Region (2018-2023) & (MT)
Table 7. World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Region (2024-2029) & (MT)
Table 8. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share by Region (2018-2023)
Table 9. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share by Region (2024-2029)
Table 10. World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Region (2018-2023) & (US$/MT)
Table 11. World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Region (2024-2029) & (US$/MT)
Table 12. Epoxy Molding Compounds for Semiconductor Encapsulation Major Market Trends
Table 13. World Epoxy Molding Compounds for Semiconductor Encapsulation Consumption Growth Rate Forecast by Region (2018 & 2022 & 2029) & (MT)
Table 14. World Epoxy Molding Compounds for Semiconductor Encapsulation Consumption by Region (2018-2023) & (MT)
Table 15. World Epoxy Molding Compounds for Semiconductor Encapsulation Consumption Forecast by Region (2024-2029) & (MT)
Table 16. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Manufacturer (2018-2023) & (USD Million)
Table 17. Production Value Market Share of Key Epoxy Molding Compounds for Semiconductor Encapsulation Producers in 2022
Table 18. World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Manufacturer (2018-2023) & (MT)
Table 19. Production Market Share of Key Epoxy Molding Compounds for Semiconductor Encapsulation Producers in 2022
Table 20. World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Manufacturer (2018-2023) & (US$/MT)
Table 21. Global Epoxy Molding Compounds for Semiconductor Encapsulation Company Evaluation Quadrant
Table 22. World Epoxy Molding Compounds for Semiconductor Encapsulation Industry Rank of Major Manufacturers, Based on Production Value in 2022
Table 23. Head Office and Epoxy Molding Compounds for Semiconductor Encapsulation Production Site of Key Manufacturer
Table 24. Epoxy Molding Compounds for Semiconductor Encapsulation Market: Company Product Type Footprint
Table 25. Epoxy Molding Compounds for Semiconductor Encapsulation Market: Company Product Application Footprint
Table 26. Epoxy Molding Compounds for Semiconductor Encapsulation Competitive Factors
Table 27. Epoxy Molding Compounds for Semiconductor Encapsulation New Entrant and Capacity Expansion Plans
Table 28. Epoxy Molding Compounds for Semiconductor Encapsulation Mergers & Acquisitions Activity
Table 29. United States VS China Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Comparison, (2018 & 2022 & 2029) & (USD Million)
Table 30. United States VS China Epoxy Molding Compounds for Semiconductor Encapsulation Production Comparison, (2018 & 2022 & 2029) & (MT)
Table 31. United States VS China Epoxy Molding Compounds for Semiconductor Encapsulation Consumption Comparison, (2018 & 2022 & 2029) & (MT)
Table 32. United States Based Epoxy Molding Compounds for Semiconductor Encapsulation Manufacturers, Headquarters and Production Site (States, Country)
Table 33. United States Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Value, (2018-2023) & (USD Million)
Table 34. United States Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share (2018-2023)
Table 35. United States Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2023) & (MT)
Table 36. United States Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share (2018-2023)
Table 37. China Based Epoxy Molding Compounds for Semiconductor Encapsulation Manufacturers, Headquarters and Production Site (Province, Country)
Table 38. China Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Value, (2018-2023) & (USD Million)
Table 39. China Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share (2018-2023)
Table 40. China Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2023) & (MT)
Table 41. China Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share (2018-2023)
Table 42. Rest of World Based Epoxy Molding Compounds for Semiconductor Encapsulation Manufacturers, Headquarters and Production Site (States, Country)
Table 43. Rest of World Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Value, (2018-2023) & (USD Million)
Table 44. Rest of World Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share (2018-2023)
Table 45. Rest of World Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2023) & (MT)
Table 46. Rest of World Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share (2018-2023)
Table 47. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Type, (USD Million), 2018 & 2022 & 2029
Table 48. World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Type (2018-2023) & (MT)
Table 49. World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Type (2024-2029) & (MT)
Table 50. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Type (2018-2023) & (USD Million)
Table 51. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Type (2024-2029) & (USD Million)
Table 52. World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Type (2018-2023) & (US$/MT)
Table 53. World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Type (2024-2029) & (US$/MT)
Table 54. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Application, (USD Million), 2018 & 2022 & 2029
Table 55. World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Application (2018-2023) & (MT)
Table 56. World Epoxy Molding Compounds for Semiconductor Encapsulation Production by Application (2024-2029) & (MT)
Table 57. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Application (2018-2023) & (USD Million)
Table 58. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Application (2024-2029) & (USD Million)
Table 59. World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Application (2018-2023) & (US$/MT)
Table 60. World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Application (2024-2029) & (US$/MT)
Table 61. Sumitomo Bakelite Basic Information, Manufacturing Base and Competitors
Table 62. Sumitomo Bakelite Major Business
Table 63. Sumitomo Bakelite Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 64. Sumitomo Bakelite Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 65. Sumitomo Bakelite Recent Developments/Updates
Table 66. Sumitomo Bakelite Competitive Strengths & Weaknesses
Table 67. Hitachi Chemical Basic Information, Manufacturing Base and Competitors
Table 68. Hitachi Chemical Major Business
Table 69. Hitachi Chemical Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 70. Hitachi Chemical Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 71. Hitachi Chemical Recent Developments/Updates
Table 72. Hitachi Chemical Competitive Strengths & Weaknesses
Table 73. Chang Chun Group Basic Information, Manufacturing Base and Competitors
Table 74. Chang Chun Group Major Business
Table 75. Chang Chun Group Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 76. Chang Chun Group Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 77. Chang Chun Group Recent Developments/Updates
Table 78. Chang Chun Group Competitive Strengths & Weaknesses
Table 79. Hysol Huawei Electronics Basic Information, Manufacturing Base and Competitors
Table 80. Hysol Huawei Electronics Major Business
Table 81. Hysol Huawei Electronics Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 82. Hysol Huawei Electronics Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 83. Hysol Huawei Electronics Recent Developments/Updates
Table 84. Hysol Huawei Electronics Competitive Strengths & Weaknesses
Table 85. Panasonic Basic Information, Manufacturing Base and Competitors
Table 86. Panasonic Major Business
Table 87. Panasonic Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 88. Panasonic Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 89. Panasonic Recent Developments/Updates
Table 90. Panasonic Competitive Strengths & Weaknesses
Table 91. Kyocera Basic Information, Manufacturing Base and Competitors
Table 92. Kyocera Major Business
Table 93. Kyocera Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 94. Kyocera Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 95. Kyocera Recent Developments/Updates
Table 96. Kyocera Competitive Strengths & Weaknesses
Table 97. KCC Basic Information, Manufacturing Base and Competitors
Table 98. KCC Major Business
Table 99. KCC Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 100. KCC Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 101. KCC Recent Developments/Updates
Table 102. KCC Competitive Strengths & Weaknesses
Table 103. Samsung SDI Basic Information, Manufacturing Base and Competitors
Table 104. Samsung SDI Major Business
Table 105. Samsung SDI Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 106. Samsung SDI Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 107. Samsung SDI Recent Developments/Updates
Table 108. Samsung SDI Competitive Strengths & Weaknesses
Table 109. Eternal Materials Basic Information, Manufacturing Base and Competitors
Table 110. Eternal Materials Major Business
Table 111. Eternal Materials Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 112. Eternal Materials Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 113. Eternal Materials Recent Developments/Updates
Table 114. Eternal Materials Competitive Strengths & Weaknesses
Table 115. Jiangsu Zhongpeng New Material Basic Information, Manufacturing Base and Competitors
Table 116. Jiangsu Zhongpeng New Material Major Business
Table 117. Jiangsu Zhongpeng New Material Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 118. Jiangsu Zhongpeng New Material Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 119. Jiangsu Zhongpeng New Material Recent Developments/Updates
Table 120. Jiangsu Zhongpeng New Material Competitive Strengths & Weaknesses
Table 121. Shin-Etsu Chemical Basic Information, Manufacturing Base and Competitors
Table 122. Shin-Etsu Chemical Major Business
Table 123. Shin-Etsu Chemical Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 124. Shin-Etsu Chemical Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 125. Shin-Etsu Chemical Recent Developments/Updates
Table 126. Shin-Etsu Chemical Competitive Strengths & Weaknesses
Table 127. Hexion Basic Information, Manufacturing Base and Competitors
Table 128. Hexion Major Business
Table 129. Hexion Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 130. Hexion Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 131. Hexion Recent Developments/Updates
Table 132. Hexion Competitive Strengths & Weaknesses
Table 133. Nepes Basic Information, Manufacturing Base and Competitors
Table 134. Nepes Major Business
Table 135. Nepes Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 136. Nepes Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 137. Nepes Recent Developments/Updates
Table 138. Nepes Competitive Strengths & Weaknesses
Table 139. Tianjin Kaihua Insulating Material Basic Information, Manufacturing Base and Competitors
Table 140. Tianjin Kaihua Insulating Material Major Business
Table 141. Tianjin Kaihua Insulating Material Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 142. Tianjin Kaihua Insulating Material Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 143. Tianjin Kaihua Insulating Material Recent Developments/Updates
Table 144. Tianjin Kaihua Insulating Material Competitive Strengths & Weaknesses
Table 145. HHCK Basic Information, Manufacturing Base and Competitors
Table 146. HHCK Major Business
Table 147. HHCK Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 148. HHCK Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 149. HHCK Recent Developments/Updates
Table 150. HHCK Competitive Strengths & Weaknesses
Table 151. Scienchem Basic Information, Manufacturing Base and Competitors
Table 152. Scienchem Major Business
Table 153. Scienchem Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 154. Scienchem Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 155. Scienchem Recent Developments/Updates
Table 156. Beijing Sino-tech Electronic Material Basic Information, Manufacturing Base and Competitors
Table 157. Beijing Sino-tech Electronic Material Major Business
Table 158. Beijing Sino-tech Electronic Material Epoxy Molding Compounds for Semiconductor Encapsulation Product and Services
Table 159. Beijing Sino-tech Electronic Material Epoxy Molding Compounds for Semiconductor Encapsulation Production (MT), Price (US$/MT), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 160. Global Key Players of Epoxy Molding Compounds for Semiconductor Encapsulation Upstream (Raw Materials)
Table 161. Epoxy Molding Compounds for Semiconductor Encapsulation Typical Customers
Table 162. Epoxy Molding Compounds for Semiconductor Encapsulation Typical Distributors
List of Figure
Figure 1. Epoxy Molding Compounds for Semiconductor Encapsulation Picture
Figure 2. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value: 2018 & 2022 & 2029, (USD Million)
Figure 3. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value and Forecast (2018-2029) & (USD Million)
Figure 4. World Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2029) & (MT)
Figure 5. World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price (2018-2029) & (US$/MT)
Figure 6. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share by Region (2018-2029)
Figure 7. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share by Region (2018-2029)
Figure 8. North America Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2029) & (MT)
Figure 9. Europe Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2029) & (MT)
Figure 10. China Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2029) & (MT)
Figure 11. Japan Epoxy Molding Compounds for Semiconductor Encapsulation Production (2018-2029) & (MT)
Figure 12. Epoxy Molding Compounds for Semiconductor Encapsulation Market Drivers
Figure 13. Factors Affecting Demand
Figure 14. World Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029) & (MT)
Figure 15. World Epoxy Molding Compounds for Semiconductor Encapsulation Consumption Market Share by Region (2018-2029)
Figure 16. United States Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029) & (MT)
Figure 17. China Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029) & (MT)
Figure 18. Europe Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029) & (MT)
Figure 19. Japan Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029) & (MT)
Figure 20. South Korea Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029) & (MT)
Figure 21. ASEAN Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029) & (MT)
Figure 22. India Epoxy Molding Compounds for Semiconductor Encapsulation Consumption (2018-2029) & (MT)
Figure 23. Producer Shipments of Epoxy Molding Compounds for Semiconductor Encapsulation by Manufacturer Revenue ($MM) and Market Share (%): 2022
Figure 24. Global Four-firm Concentration Ratios (CR4) for Epoxy Molding Compounds for Semiconductor Encapsulation Markets in 2022
Figure 25. Global Four-firm Concentration Ratios (CR8) for Epoxy Molding Compounds for Semiconductor Encapsulation Markets in 2022
Figure 26. United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share Comparison (2018 & 2022 & 2029)
Figure 27. United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share Comparison (2018 & 2022 & 2029)
Figure 28. United States VS China: Epoxy Molding Compounds for Semiconductor Encapsulation Consumption Market Share Comparison (2018 & 2022 & 2029)
Figure 29. United States Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share 2022
Figure 30. China Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share 2022
Figure 31. Rest of World Based Manufacturers Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share 2022
Figure 32. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Type, (USD Million), 2018 & 2022 & 2029
Figure 33. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share by Type in 2022
Figure 34. Normal Epoxy Molding Compound
Figure 35. Green Epoxy Molding Compound
Figure 36. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share by Type (2018-2029)
Figure 37. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share by Type (2018-2029)
Figure 38. World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Type (2018-2029) & (US$/MT)
Figure 39. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value by Application, (USD Million), 2018 & 2022 & 2029
Figure 40. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share by Application in 2022
Figure 41. Lead Frame Package
Figure 42. Area Alley Package
Figure 43. Electronic Control Unit (ECU)
Figure 44. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Market Share by Application (2018-2029)
Figure 45. World Epoxy Molding Compounds for Semiconductor Encapsulation Production Value Market Share by Application (2018-2029)
Figure 46. World Epoxy Molding Compounds for Semiconductor Encapsulation Average Price by Application (2018-2029) & (US$/MT)
Figure 47. Epoxy Molding Compounds for Semiconductor Encapsulation Industry Chain
Figure 48. Epoxy Molding Compounds for Semiconductor Encapsulation Procurement Model
Figure 49. Epoxy Molding Compounds for Semiconductor Encapsulation Sales Model
Figure 50. Epoxy Molding Compounds for Semiconductor Encapsulation Sales Channels, Direct Sales, and Distribution
Figure 51. Methodology
Figure 52. Research Process and Data Source
Research Methodology
Client Requirements
Review and analyze client requirements
Discussion of all the project requirements and queries
Flexibility Check
Project Feasibility Analysis
Finalizing tentative research programme
Structuring project proposal with scope, timeline, and costs
Analyzing Market Dynamics
Determination of key drivers, restraints, challenge, and opportunity
Identifies market needs and trends
Market Size Estimation & Forecast
Estimation of historical data based on secondary and primary data
Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)
Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies
Consideration of geography, region-specific product/service demand for region segments
Consideration of product utilization rates, product demand outlook for segments by application or end-user.
Data Source
Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports,
paid database, press releases, blogs, newsletters,and GIR repositories.
Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts
to verify insights.
Validation
and
triangulation of
secondary and primary source.
Collection of data
Cumulating and collating the essential qualitative and quantitative data
Generation of report in client requested format by research analysts
Reviews by expert analysts
Final quality check
Clarifying queries
Receiving feedback
Ensuring satisfaction
01 Identification of data
This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
-
02 Evaluation of Market Dynamic
This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
-
03 Collection of Data
This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
-
04 Collaboration of Data
This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis
This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.
Companies Mentioned
Sumitomo Bakelite Hitachi Chemical Chang Chun Group Hysol Huawei Electronics Panasonic Kyocera KCC Samsung SDI Eternal Materials Jiangsu Zhongpeng New Material Shin-Etsu Chemical Hexion Nepes Tianjin Kaihua Insulating Material HHCK Scienchem Beijing Sino-tech Electronic Material
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12 Oct 2021
Chemical & Material
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