Global Semiconductor & IC Packaging Supply, Demand and Key Producers, 2023-2029

Global Semiconductor & IC Packaging Supply, Demand and Key Producers, 2023-2029

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Published Date: 15 Aug 2023

Category: Packaging

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  • sp_icon1 sp_icon1_b Description
  • sp_icon2 sp_icon2_b Table of Contents
  • sp_icon3 sp_icon3_b Table of Figures
  • sp_icon4 sp_icon4_b Research Methodology
  • sp_icon1 sp_icon1_b Companies Mentioned
  • sp_icon1 sp_icon1_b Related Reports
  • sp_icon1 sp_icon1_b Product Tags
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Description

The global Semiconductor & IC Packaging market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

This report studies the global Semiconductor & IC Packaging demand, key companies, and key regions.

This report is a detailed and comprehensive analysis of the world market for Semiconductor & IC Packaging, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor & IC Packaging that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Semiconductor & IC Packaging total market, 2018-2029, (USD Million)
Global Semiconductor & IC Packaging total market by region & country, CAGR, 2018-2029, (USD Million)
U.S. VS China: Semiconductor & IC Packaging total market, key domestic companies and share, (USD Million)
Global Semiconductor & IC Packaging revenue by player and market share 2018-2023, (USD Million)
Global Semiconductor & IC Packaging total market by Type, CAGR, 2018-2029, (USD Million)
Global Semiconductor & IC Packaging total market by Application, CAGR, 2018-2029, (USD Million).

This reports profiles major players in the global Semiconductor & IC Packaging market based on the following parameters – company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, J-devices, UTAC, JECT and ChipMOS, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Semiconductor & IC Packaging market.

Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global Semiconductor & IC Packaging Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Semiconductor & IC Packaging Market, Segmentation by Type
DIP
SOP
QFP
QFN
BGA
CSP
Others

Global Semiconductor & IC Packaging Market, Segmentation by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics

Companies Profiled:
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Kyocera
Unisem
NantongFujitsu Microelectronics
Hana Micron
Walton Advanced Engineering
Signetics
Intel Corp
LINGSEN

Key Questions Answered
1. How big is the global Semiconductor & IC Packaging market?
2. What is the demand of the global Semiconductor & IC Packaging market?
3. What is the year over year growth of the global Semiconductor & IC Packaging market?
4. What is the total value of the global Semiconductor & IC Packaging market?
5. Who are the major players in the global Semiconductor & IC Packaging market?
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Table of Contents

1 Supply Summary
1.1 Semiconductor & IC Packaging Introduction
1.2 World Semiconductor & IC Packaging Market Size & Forecast (2018 & 2022 & 2029)
1.3 World Semiconductor & IC Packaging Total Market by Region (by Headquarter Location)
1.3.1 World Semiconductor & IC Packaging Market Size by Region (2018-2029), (by Headquarter Location)
1.3.2 United States Semiconductor & IC Packaging Market Size (2018-2029)
1.3.3 China Semiconductor & IC Packaging Market Size (2018-2029)
1.3.4 Europe Semiconductor & IC Packaging Market Size (2018-2029)
1.3.5 Japan Semiconductor & IC Packaging Market Size (2018-2029)
1.3.6 South Korea Semiconductor & IC Packaging Market Size (2018-2029)
1.3.7 ASEAN Semiconductor & IC Packaging Market Size (2018-2029)
1.3.8 India Semiconductor & IC Packaging Market Size (2018-2029)
1.4 Market Drivers, Restraints and Trends
1.4.1 Semiconductor & IC Packaging Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Semiconductor & IC Packaging Major Market Trends

2 Demand Summary
2.1 World Semiconductor & IC Packaging Consumption Value (2018-2029)
2.2 World Semiconductor & IC Packaging Consumption Value by Region
2.2.1 World Semiconductor & IC Packaging Consumption Value by Region (2018-2023)
2.2.2 World Semiconductor & IC Packaging Consumption Value Forecast by Region (2024-2029)
2.3 United States Semiconductor & IC Packaging Consumption Value (2018-2029)
2.4 China Semiconductor & IC Packaging Consumption Value (2018-2029)
2.5 Europe Semiconductor & IC Packaging Consumption Value (2018-2029)
2.6 Japan Semiconductor & IC Packaging Consumption Value (2018-2029)
2.7 South Korea Semiconductor & IC Packaging Consumption Value (2018-2029)
2.8 ASEAN Semiconductor & IC Packaging Consumption Value (2018-2029)
2.9 India Semiconductor & IC Packaging Consumption Value (2018-2029)

3 World Semiconductor & IC Packaging Companies Competitive Analysis
3.1 World Semiconductor & IC Packaging Revenue by Player (2018-2023)
3.2 Industry Rank and Concentration Rate (CR)
3.2.1 Global Semiconductor & IC Packaging Industry Rank of Major Players
3.2.2 Global Concentration Ratios (CR4) for Semiconductor & IC Packaging in 2022
3.2.3 Global Concentration Ratios (CR8) for Semiconductor & IC Packaging in 2022
3.3 Semiconductor & IC Packaging Company Evaluation Quadrant
3.4 Semiconductor & IC Packaging Market: Overall Company Footprint Analysis
3.4.1 Semiconductor & IC Packaging Market: Region Footprint
3.4.2 Semiconductor & IC Packaging Market: Company Product Type Footprint
3.4.3 Semiconductor & IC Packaging Market: Company Product Application Footprint
3.5 Competitive Environment
3.5.1 Historical Structure of the Industry
3.5.2 Barriers of Market Entry
3.5.3 Factors of Competition
3.6 Mergers, Acquisitions Activity

4 United States VS China VS Rest of the World (by Headquarter Location)
4.1 United States VS China: Semiconductor & IC Packaging Revenue Comparison (by Headquarter Location)
4.1.1 United States VS China: Semiconductor & IC Packaging Market Size Comparison (2018 & 2022 & 2029) (by Headquarter Location)
4.1.2 United States VS China: Semiconductor & IC Packaging Revenue Market Share Comparison (2018 & 2022 & 2029)
4.2 United States Based Companies VS China Based Companies: Semiconductor & IC Packaging Consumption Value Comparison
4.2.1 United States VS China: Semiconductor & IC Packaging Consumption Value Comparison (2018 & 2022 & 2029)
4.2.2 United States VS China: Semiconductor & IC Packaging Consumption Value Market Share Comparison (2018 & 2022 & 2029)
4.3 United States Based Semiconductor & IC Packaging Companies and Market Share, 2018-2023
4.3.1 United States Based Semiconductor & IC Packaging Companies, Headquarters (States, Country)
4.3.2 United States Based Companies Semiconductor & IC Packaging Revenue, (2018-2023)
4.4 China Based Companies Semiconductor & IC Packaging Revenue and Market Share, 2018-2023
4.4.1 China Based Semiconductor & IC Packaging Companies, Company Headquarters (Province, Country)
4.4.2 China Based Companies Semiconductor & IC Packaging Revenue, (2018-2023)
4.5 Rest of World Based Semiconductor & IC Packaging Companies and Market Share, 2018-2023
4.5.1 Rest of World Based Semiconductor & IC Packaging Companies, Headquarters (States, Country)
4.5.2 Rest of World Based Companies Semiconductor & IC Packaging Revenue, (2018-2023)

5 Market Analysis by Type
5.1 World Semiconductor & IC Packaging Market Size Overview by Type: 2018 VS 2022 VS 2029
5.2 Segment Introduction by Type
5.2.1 DIP
5.2.2 SOP
5.2.3 QFP
5.2.4 QFN
5.2.5 BGA
5.2.6 CSP
5.2.7 Others
5.3 Market Segment by Type
5.3.1 World Semiconductor & IC Packaging Market Size by Type (2018-2023)
5.3.2 World Semiconductor & IC Packaging Market Size by Type (2024-2029)
5.3.3 World Semiconductor & IC Packaging Market Size Market Share by Type (2018-2029)

6 Market Analysis by Application
6.1 World Semiconductor & IC Packaging Market Size Overview by Application: 2018 VS 2022 VS 2029
6.2 Segment Introduction by Application
6.2.1 Telecommunications
6.2.2 Automotive
6.2.3 Aerospace and Defense
6.2.4 Medical Devices
6.2.5 Medical Devices
6.3 Market Segment by Application
6.3.1 World Semiconductor & IC Packaging Market Size by Application (2018-2023)
6.3.2 World Semiconductor & IC Packaging Market Size by Application (2024-2029)
6.3.3 World Semiconductor & IC Packaging Market Size by Application (2018-2029)

7 Company Profiles
7.1 ASE
7.1.1 ASE Details
7.1.2 ASE Major Business
7.1.3 ASE Semiconductor & IC Packaging Product and Services
7.1.4 ASE Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.1.5 ASE Recent Developments/Updates
7.1.6 ASE Competitive Strengths & Weaknesses
7.2 Amkor
7.2.1 Amkor Details
7.2.2 Amkor Major Business
7.2.3 Amkor Semiconductor & IC Packaging Product and Services
7.2.4 Amkor Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.2.5 Amkor Recent Developments/Updates
7.2.6 Amkor Competitive Strengths & Weaknesses
7.3 SPIL
7.3.1 SPIL Details
7.3.2 SPIL Major Business
7.3.3 SPIL Semiconductor & IC Packaging Product and Services
7.3.4 SPIL Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.3.5 SPIL Recent Developments/Updates
7.3.6 SPIL Competitive Strengths & Weaknesses
7.4 STATS ChipPac
7.4.1 STATS ChipPac Details
7.4.2 STATS ChipPac Major Business
7.4.3 STATS ChipPac Semiconductor & IC Packaging Product and Services
7.4.4 STATS ChipPac Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.4.5 STATS ChipPac Recent Developments/Updates
7.4.6 STATS ChipPac Competitive Strengths & Weaknesses
7.5 Powertech Technology
7.5.1 Powertech Technology Details
7.5.2 Powertech Technology Major Business
7.5.3 Powertech Technology Semiconductor & IC Packaging Product and Services
7.5.4 Powertech Technology Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.5.5 Powertech Technology Recent Developments/Updates
7.5.6 Powertech Technology Competitive Strengths & Weaknesses
7.6 J-devices
7.6.1 J-devices Details
7.6.2 J-devices Major Business
7.6.3 J-devices Semiconductor & IC Packaging Product and Services
7.6.4 J-devices Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.6.5 J-devices Recent Developments/Updates
7.6.6 J-devices Competitive Strengths & Weaknesses
7.7 UTAC
7.7.1 UTAC Details
7.7.2 UTAC Major Business
7.7.3 UTAC Semiconductor & IC Packaging Product and Services
7.7.4 UTAC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.7.5 UTAC Recent Developments/Updates
7.7.6 UTAC Competitive Strengths & Weaknesses
7.8 JECT
7.8.1 JECT Details
7.8.2 JECT Major Business
7.8.3 JECT Semiconductor & IC Packaging Product and Services
7.8.4 JECT Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.8.5 JECT Recent Developments/Updates
7.8.6 JECT Competitive Strengths & Weaknesses
7.9 ChipMOS
7.9.1 ChipMOS Details
7.9.2 ChipMOS Major Business
7.9.3 ChipMOS Semiconductor & IC Packaging Product and Services
7.9.4 ChipMOS Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.9.5 ChipMOS Recent Developments/Updates
7.9.6 ChipMOS Competitive Strengths & Weaknesses
7.10 Chipbond
7.10.1 Chipbond Details
7.10.2 Chipbond Major Business
7.10.3 Chipbond Semiconductor & IC Packaging Product and Services
7.10.4 Chipbond Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.10.5 Chipbond Recent Developments/Updates
7.10.6 Chipbond Competitive Strengths & Weaknesses
7.11 KYEC
7.11.1 KYEC Details
7.11.2 KYEC Major Business
7.11.3 KYEC Semiconductor & IC Packaging Product and Services
7.11.4 KYEC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.11.5 KYEC Recent Developments/Updates
7.11.6 KYEC Competitive Strengths & Weaknesses
7.12 STS Semiconductor
7.12.1 STS Semiconductor Details
7.12.2 STS Semiconductor Major Business
7.12.3 STS Semiconductor Semiconductor & IC Packaging Product and Services
7.12.4 STS Semiconductor Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.12.5 STS Semiconductor Recent Developments/Updates
7.12.6 STS Semiconductor Competitive Strengths & Weaknesses
7.13 Huatian
7.13.1 Huatian Details
7.13.2 Huatian Major Business
7.13.3 Huatian Semiconductor & IC Packaging Product and Services
7.13.4 Huatian Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.13.5 Huatian Recent Developments/Updates
7.13.6 Huatian Competitive Strengths & Weaknesses
7.14 MPl(Carsem)
7.14.1 MPl(Carsem) Details
7.14.2 MPl(Carsem) Major Business
7.14.3 MPl(Carsem) Semiconductor & IC Packaging Product and Services
7.14.4 MPl(Carsem) Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.14.5 MPl(Carsem) Recent Developments/Updates
7.14.6 MPl(Carsem) Competitive Strengths & Weaknesses
7.15 Nepes
7.15.1 Nepes Details
7.15.2 Nepes Major Business
7.15.3 Nepes Semiconductor & IC Packaging Product and Services
7.15.4 Nepes Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.15.5 Nepes Recent Developments/Updates
7.15.6 Nepes Competitive Strengths & Weaknesses
7.16 FATC
7.16.1 FATC Details
7.16.2 FATC Major Business
7.16.3 FATC Semiconductor & IC Packaging Product and Services
7.16.4 FATC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.16.5 FATC Recent Developments/Updates
7.16.6 FATC Competitive Strengths & Weaknesses
7.17 Walton
7.17.1 Walton Details
7.17.2 Walton Major Business
7.17.3 Walton Semiconductor & IC Packaging Product and Services
7.17.4 Walton Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.17.5 Walton Recent Developments/Updates
7.17.6 Walton Competitive Strengths & Weaknesses
7.18 Kyocera
7.18.1 Kyocera Details
7.18.2 Kyocera Major Business
7.18.3 Kyocera Semiconductor & IC Packaging Product and Services
7.18.4 Kyocera Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.18.5 Kyocera Recent Developments/Updates
7.18.6 Kyocera Competitive Strengths & Weaknesses
7.19 Unisem
7.19.1 Unisem Details
7.19.2 Unisem Major Business
7.19.3 Unisem Semiconductor & IC Packaging Product and Services
7.19.4 Unisem Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.19.5 Unisem Recent Developments/Updates
7.19.6 Unisem Competitive Strengths & Weaknesses
7.20 NantongFujitsu Microelectronics
7.20.1 NantongFujitsu Microelectronics Details
7.20.2 NantongFujitsu Microelectronics Major Business
7.20.3 NantongFujitsu Microelectronics Semiconductor & IC Packaging Product and Services
7.20.4 NantongFujitsu Microelectronics Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.20.5 NantongFujitsu Microelectronics Recent Developments/Updates
7.20.6 NantongFujitsu Microelectronics Competitive Strengths & Weaknesses
7.21 Hana Micron
7.21.1 Hana Micron Details
7.21.2 Hana Micron Major Business
7.21.3 Hana Micron Semiconductor & IC Packaging Product and Services
7.21.4 Hana Micron Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.21.5 Hana Micron Recent Developments/Updates
7.21.6 Hana Micron Competitive Strengths & Weaknesses
7.22 Walton Advanced Engineering
7.22.1 Walton Advanced Engineering Details
7.22.2 Walton Advanced Engineering Major Business
7.22.3 Walton Advanced Engineering Semiconductor & IC Packaging Product and Services
7.22.4 Walton Advanced Engineering Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.22.5 Walton Advanced Engineering Recent Developments/Updates
7.22.6 Walton Advanced Engineering Competitive Strengths & Weaknesses
7.23 Signetics
7.23.1 Signetics Details
7.23.2 Signetics Major Business
7.23.3 Signetics Semiconductor & IC Packaging Product and Services
7.23.4 Signetics Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.23.5 Signetics Recent Developments/Updates
7.23.6 Signetics Competitive Strengths & Weaknesses
7.24 Intel Corp
7.24.1 Intel Corp Details
7.24.2 Intel Corp Major Business
7.24.3 Intel Corp Semiconductor & IC Packaging Product and Services
7.24.4 Intel Corp Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.24.5 Intel Corp Recent Developments/Updates
7.24.6 Intel Corp Competitive Strengths & Weaknesses
7.25 LINGSEN
7.25.1 LINGSEN Details
7.25.2 LINGSEN Major Business
7.25.3 LINGSEN Semiconductor & IC Packaging Product and Services
7.25.4 LINGSEN Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.25.5 LINGSEN Recent Developments/Updates
7.25.6 LINGSEN Competitive Strengths & Weaknesses

8 Industry Chain Analysis
8.1 Semiconductor & IC Packaging Industry Chain
8.2 Semiconductor & IC Packaging Upstream Analysis
8.3 Semiconductor & IC Packaging Midstream Analysis
8.4 Semiconductor & IC Packaging Downstream Analysis

9 Research Findings and Conclusion

10 Appendix
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
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Table of Figures

List of Tables
Table 1. World Semiconductor & IC Packaging Revenue by Region (2018, 2022 and 2029) & (USD Million), (by Headquarter Location)
Table 2. World Semiconductor & IC Packaging Revenue by Region (2018-2023) & (USD Million), (by Headquarter Location)
Table 3. World Semiconductor & IC Packaging Revenue by Region (2024-2029) & (USD Million), (by Headquarter Location)
Table 4. World Semiconductor & IC Packaging Revenue Market Share by Region (2018-2023), (by Headquarter Location)
Table 5. World Semiconductor & IC Packaging Revenue Market Share by Region (2024-2029), (by Headquarter Location)
Table 6. Major Market Trends
Table 7. World Semiconductor & IC Packaging Consumption Value Growth Rate Forecast by Region (2018 & 2022 & 2029) & (USD Million)
Table 8. World Semiconductor & IC Packaging Consumption Value by Region (2018-2023) & (USD Million)
Table 9. World Semiconductor & IC Packaging Consumption Value Forecast by Region (2024-2029) & (USD Million)
Table 10. World Semiconductor & IC Packaging Revenue by Player (2018-2023) & (USD Million)
Table 11. Revenue Market Share of Key Semiconductor & IC Packaging Players in 2022
Table 12. World Semiconductor & IC Packaging Industry Rank of Major Player, Based on Revenue in 2022
Table 13. Global Semiconductor & IC Packaging Company Evaluation Quadrant
Table 14. Head Office of Key Semiconductor & IC Packaging Player
Table 15. Semiconductor & IC Packaging Market: Company Product Type Footprint
Table 16. Semiconductor & IC Packaging Market: Company Product Application Footprint
Table 17. Semiconductor & IC Packaging Mergers & Acquisitions Activity
Table 18. United States VS China Semiconductor & IC Packaging Market Size Comparison, (2018 & 2022 & 2029) & (USD Million)
Table 19. United States VS China Semiconductor & IC Packaging Consumption Value Comparison, (2018 & 2022 & 2029) & (USD Million)
Table 20. United States Based Semiconductor & IC Packaging Companies, Headquarters (States, Country)
Table 21. United States Based Companies Semiconductor & IC Packaging Revenue, (2018-2023) & (USD Million)
Table 22. United States Based Companies Semiconductor & IC Packaging Revenue Market Share (2018-2023)
Table 23. China Based Semiconductor & IC Packaging Companies, Headquarters (Province, Country)
Table 24. China Based Companies Semiconductor & IC Packaging Revenue, (2018-2023) & (USD Million)
Table 25. China Based Companies Semiconductor & IC Packaging Revenue Market Share (2018-2023)
Table 26. Rest of World Based Semiconductor & IC Packaging Companies, Headquarters (States, Country)
Table 27. Rest of World Based Companies Semiconductor & IC Packaging Revenue, (2018-2023) & (USD Million)
Table 28. Rest of World Based Companies Semiconductor & IC Packaging Revenue Market Share (2018-2023)
Table 29. World Semiconductor & IC Packaging Market Size by Type, (USD Million), 2018 & 2022 & 2029
Table 30. World Semiconductor & IC Packaging Market Size by Type (2018-2023) & (USD Million)
Table 31. World Semiconductor & IC Packaging Market Size by Type (2024-2029) & (USD Million)
Table 32. World Semiconductor & IC Packaging Market Size by Application, (USD Million), 2018 & 2022 & 2029
Table 33. World Semiconductor & IC Packaging Market Size by Application (2018-2023) & (USD Million)
Table 34. World Semiconductor & IC Packaging Market Size by Application (2024-2029) & (USD Million)
Table 35. ASE Basic Information, Area Served and Competitors
Table 36. ASE Major Business
Table 37. ASE Semiconductor & IC Packaging Product and Services
Table 38. ASE Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 39. ASE Recent Developments/Updates
Table 40. ASE Competitive Strengths & Weaknesses
Table 41. Amkor Basic Information, Area Served and Competitors
Table 42. Amkor Major Business
Table 43. Amkor Semiconductor & IC Packaging Product and Services
Table 44. Amkor Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 45. Amkor Recent Developments/Updates
Table 46. Amkor Competitive Strengths & Weaknesses
Table 47. SPIL Basic Information, Area Served and Competitors
Table 48. SPIL Major Business
Table 49. SPIL Semiconductor & IC Packaging Product and Services
Table 50. SPIL Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 51. SPIL Recent Developments/Updates
Table 52. SPIL Competitive Strengths & Weaknesses
Table 53. STATS ChipPac Basic Information, Area Served and Competitors
Table 54. STATS ChipPac Major Business
Table 55. STATS ChipPac Semiconductor & IC Packaging Product and Services
Table 56. STATS ChipPac Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 57. STATS ChipPac Recent Developments/Updates
Table 58. STATS ChipPac Competitive Strengths & Weaknesses
Table 59. Powertech Technology Basic Information, Area Served and Competitors
Table 60. Powertech Technology Major Business
Table 61. Powertech Technology Semiconductor & IC Packaging Product and Services
Table 62. Powertech Technology Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 63. Powertech Technology Recent Developments/Updates
Table 64. Powertech Technology Competitive Strengths & Weaknesses
Table 65. J-devices Basic Information, Area Served and Competitors
Table 66. J-devices Major Business
Table 67. J-devices Semiconductor & IC Packaging Product and Services
Table 68. J-devices Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 69. J-devices Recent Developments/Updates
Table 70. J-devices Competitive Strengths & Weaknesses
Table 71. UTAC Basic Information, Area Served and Competitors
Table 72. UTAC Major Business
Table 73. UTAC Semiconductor & IC Packaging Product and Services
Table 74. UTAC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 75. UTAC Recent Developments/Updates
Table 76. UTAC Competitive Strengths & Weaknesses
Table 77. JECT Basic Information, Area Served and Competitors
Table 78. JECT Major Business
Table 79. JECT Semiconductor & IC Packaging Product and Services
Table 80. JECT Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 81. JECT Recent Developments/Updates
Table 82. JECT Competitive Strengths & Weaknesses
Table 83. ChipMOS Basic Information, Area Served and Competitors
Table 84. ChipMOS Major Business
Table 85. ChipMOS Semiconductor & IC Packaging Product and Services
Table 86. ChipMOS Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 87. ChipMOS Recent Developments/Updates
Table 88. ChipMOS Competitive Strengths & Weaknesses
Table 89. Chipbond Basic Information, Area Served and Competitors
Table 90. Chipbond Major Business
Table 91. Chipbond Semiconductor & IC Packaging Product and Services
Table 92. Chipbond Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 93. Chipbond Recent Developments/Updates
Table 94. Chipbond Competitive Strengths & Weaknesses
Table 95. KYEC Basic Information, Area Served and Competitors
Table 96. KYEC Major Business
Table 97. KYEC Semiconductor & IC Packaging Product and Services
Table 98. KYEC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 99. KYEC Recent Developments/Updates
Table 100. KYEC Competitive Strengths & Weaknesses
Table 101. STS Semiconductor Basic Information, Area Served and Competitors
Table 102. STS Semiconductor Major Business
Table 103. STS Semiconductor Semiconductor & IC Packaging Product and Services
Table 104. STS Semiconductor Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 105. STS Semiconductor Recent Developments/Updates
Table 106. STS Semiconductor Competitive Strengths & Weaknesses
Table 107. Huatian Basic Information, Area Served and Competitors
Table 108. Huatian Major Business
Table 109. Huatian Semiconductor & IC Packaging Product and Services
Table 110. Huatian Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 111. Huatian Recent Developments/Updates
Table 112. Huatian Competitive Strengths & Weaknesses
Table 113. MPl(Carsem) Basic Information, Area Served and Competitors
Table 114. MPl(Carsem) Major Business
Table 115. MPl(Carsem) Semiconductor & IC Packaging Product and Services
Table 116. MPl(Carsem) Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 117. MPl(Carsem) Recent Developments/Updates
Table 118. MPl(Carsem) Competitive Strengths & Weaknesses
Table 119. Nepes Basic Information, Area Served and Competitors
Table 120. Nepes Major Business
Table 121. Nepes Semiconductor & IC Packaging Product and Services
Table 122. Nepes Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 123. Nepes Recent Developments/Updates
Table 124. Nepes Competitive Strengths & Weaknesses
Table 125. FATC Basic Information, Area Served and Competitors
Table 126. FATC Major Business
Table 127. FATC Semiconductor & IC Packaging Product and Services
Table 128. FATC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 129. FATC Recent Developments/Updates
Table 130. FATC Competitive Strengths & Weaknesses
Table 131. Walton Basic Information, Area Served and Competitors
Table 132. Walton Major Business
Table 133. Walton Semiconductor & IC Packaging Product and Services
Table 134. Walton Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 135. Walton Recent Developments/Updates
Table 136. Walton Competitive Strengths & Weaknesses
Table 137. Kyocera Basic Information, Area Served and Competitors
Table 138. Kyocera Major Business
Table 139. Kyocera Semiconductor & IC Packaging Product and Services
Table 140. Kyocera Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 141. Kyocera Recent Developments/Updates
Table 142. Kyocera Competitive Strengths & Weaknesses
Table 143. Unisem Basic Information, Area Served and Competitors
Table 144. Unisem Major Business
Table 145. Unisem Semiconductor & IC Packaging Product and Services
Table 146. Unisem Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 147. Unisem Recent Developments/Updates
Table 148. Unisem Competitive Strengths & Weaknesses
Table 149. NantongFujitsu Microelectronics Basic Information, Area Served and Competitors
Table 150. NantongFujitsu Microelectronics Major Business
Table 151. NantongFujitsu Microelectronics Semiconductor & IC Packaging Product and Services
Table 152. NantongFujitsu Microelectronics Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 153. NantongFujitsu Microelectronics Recent Developments/Updates
Table 154. NantongFujitsu Microelectronics Competitive Strengths & Weaknesses
Table 155. Hana Micron Basic Information, Area Served and Competitors
Table 156. Hana Micron Major Business
Table 157. Hana Micron Semiconductor & IC Packaging Product and Services
Table 158. Hana Micron Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 159. Hana Micron Recent Developments/Updates
Table 160. Hana Micron Competitive Strengths & Weaknesses
Table 161. Walton Advanced Engineering Basic Information, Area Served and Competitors
Table 162. Walton Advanced Engineering Major Business
Table 163. Walton Advanced Engineering Semiconductor & IC Packaging Product and Services
Table 164. Walton Advanced Engineering Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 165. Walton Advanced Engineering Recent Developments/Updates
Table 166. Walton Advanced Engineering Competitive Strengths & Weaknesses
Table 167. Signetics Basic Information, Area Served and Competitors
Table 168. Signetics Major Business
Table 169. Signetics Semiconductor & IC Packaging Product and Services
Table 170. Signetics Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 171. Signetics Recent Developments/Updates
Table 172. Signetics Competitive Strengths & Weaknesses
Table 173. Intel Corp Basic Information, Area Served and Competitors
Table 174. Intel Corp Major Business
Table 175. Intel Corp Semiconductor & IC Packaging Product and Services
Table 176. Intel Corp Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 177. Intel Corp Recent Developments/Updates
Table 178. LINGSEN Basic Information, Area Served and Competitors
Table 179. LINGSEN Major Business
Table 180. LINGSEN Semiconductor & IC Packaging Product and Services
Table 181. LINGSEN Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 182. Global Key Players of Semiconductor & IC Packaging Upstream (Raw Materials)
Table 183. Semiconductor & IC Packaging Typical Customers
List of Figure
Figure 1. Semiconductor & IC Packaging Picture
Figure 2. World Semiconductor & IC Packaging Total Market Size: 2018 & 2022 & 2029, (USD Million)
Figure 3. World Semiconductor & IC Packaging Total Market Size (2018-2029) & (USD Million)
Figure 4. World Semiconductor & IC Packaging Revenue Market Share by Region (2018, 2022 and 2029) & (USD Million) , (by Headquarter Location)
Figure 5. World Semiconductor & IC Packaging Revenue Market Share by Region (2018-2029), (by Headquarter Location)
Figure 6. United States Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 7. China Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 8. Europe Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 9. Japan Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 10. South Korea Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 11. ASEAN Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 12. India Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 13. Semiconductor & IC Packaging Market Drivers
Figure 14. Factors Affecting Demand
Figure 15. World Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 16. World Semiconductor & IC Packaging Consumption Value Market Share by Region (2018-2029)
Figure 17. United States Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 18. China Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 19. Europe Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 20. Japan Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 21. South Korea Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 22. ASEAN Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 23. India Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 24. Producer Shipments of Semiconductor & IC Packaging by Player Revenue ($MM) and Market Share (%): 2022
Figure 25. Global Four-firm Concentration Ratios (CR4) for Semiconductor & IC Packaging Markets in 2022
Figure 26. Global Four-firm Concentration Ratios (CR8) for Semiconductor & IC Packaging Markets in 2022
Figure 27. United States VS China: Semiconductor & IC Packaging Revenue Market Share Comparison (2018 & 2022 & 2029)
Figure 28. United States VS China: Semiconductor & IC Packaging Consumption Value Market Share Comparison (2018 & 2022 & 2029)
Figure 29. World Semiconductor & IC Packaging Market Size by Type, (USD Million), 2018 & 2022 & 2029
Figure 30. World Semiconductor & IC Packaging Market Size Market Share by Type in 2022
Figure 31. DIP
Figure 32. SOP
Figure 33. QFP
Figure 34. QFN
Figure 35. BGA
Figure 36. CSP
Figure 37. Others
Figure 38. World Semiconductor & IC Packaging Market Size Market Share by Type (2018-2029)
Figure 39. World Semiconductor & IC Packaging Market Size by Application, (USD Million), 2018 & 2022 & 2029
Figure 40. World Semiconductor & IC Packaging Market Size Market Share by Application in 2022
Figure 41. Telecommunications
Figure 42. Automotive
Figure 43. Aerospace and Defense
Figure 44. Medical Devices
Figure 45. Consumer Electronics
Figure 46. Semiconductor & IC Packaging Industrial Chain
Figure 47. Methodology
Figure 48. Research Process and Data Source
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Research Methodology

Client Requirements

yuan2

Review and analyze client requirements

yuan2

Discussion of all the project requirements and queries

Flexibility Check

yuan2

Project Feasibility Analysis

yuan2

Finalizing tentative research programme

yuan2

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

yuan2

Determination of key drivers, restraints, challenge, and opportunity

yuan2

Identifies market needs and trends

Market Size Estimation & Forecast

yuan2

Estimation of historical data based on secondary and primary data

yuan2

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

yuan2

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

yuan2

Consideration of geography, region-specific product/service demand for region segments

yuan2

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

tuBiao1

Data Source

yuan2

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

yuan2

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

yuan2

Collection of data

yuan2

Cumulating and collating the essential qualitative and quantitative data

yuan2

Generation of report in client requested format by research analysts

yuan2

Reviews by expert analysts

yuan2

Final quality check

yuan2

Clarifying queries

yuan2

Receiving feedback

yuan2

Ensuring satisfaction

  • yuan01
    liuCheng01

    01 Identification of data

    This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.

  • yuan01
    liuCheng01

    02 Evaluation of Market Dynamic

    This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.

  • yuan01
    liuCheng01

    03 Collection of Data

    This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.

  • yuan01
    liuCheng01

    04 Collaboration of Data

    This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.

  • yuan01
    liuCheng01

    05 Verification and Analysis

    This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

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Companies Mentioned

ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Kyocera
Unisem
NantongFujitsu Microelectronics
Hana Micron
Walton Advanced Engineering
Signetics
Intel Corp
LINGSEN
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Global Semiconductor & IC Packaging Supply, Demand and Key Producers, 2023-2029

Global Semiconductor & IC Packaging Supply, Demand and Key Producers, 2023-2029

Page: 129

Published Date: 15 Aug 2023

Category: Packaging

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Description

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Description

The global Semiconductor & IC Packaging market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

This report studies the global Semiconductor & IC Packaging demand, key companies, and key regions.

This report is a detailed and comprehensive analysis of the world market for Semiconductor & IC Packaging, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor & IC Packaging that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Semiconductor & IC Packaging total market, 2018-2029, (USD Million)
Global Semiconductor & IC Packaging total market by region & country, CAGR, 2018-2029, (USD Million)
U.S. VS China: Semiconductor & IC Packaging total market, key domestic companies and share, (USD Million)
Global Semiconductor & IC Packaging revenue by player and market share 2018-2023, (USD Million)
Global Semiconductor & IC Packaging total market by Type, CAGR, 2018-2029, (USD Million)
Global Semiconductor & IC Packaging total market by Application, CAGR, 2018-2029, (USD Million).

This reports profiles major players in the global Semiconductor & IC Packaging market based on the following parameters – company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, J-devices, UTAC, JECT and ChipMOS, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Semiconductor & IC Packaging market.

Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global Semiconductor & IC Packaging Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Semiconductor & IC Packaging Market, Segmentation by Type
DIP
SOP
QFP
QFN
BGA
CSP
Others

Global Semiconductor & IC Packaging Market, Segmentation by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics

Companies Profiled:
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Kyocera
Unisem
NantongFujitsu Microelectronics
Hana Micron
Walton Advanced Engineering
Signetics
Intel Corp
LINGSEN

Key Questions Answered
1. How big is the global Semiconductor & IC Packaging market?
2. What is the demand of the global Semiconductor & IC Packaging market?
3. What is the year over year growth of the global Semiconductor & IC Packaging market?
4. What is the total value of the global Semiconductor & IC Packaging market?
5. Who are the major players in the global Semiconductor & IC Packaging market?
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Table of Contents

1 Supply Summary
1.1 Semiconductor & IC Packaging Introduction
1.2 World Semiconductor & IC Packaging Market Size & Forecast (2018 & 2022 & 2029)
1.3 World Semiconductor & IC Packaging Total Market by Region (by Headquarter Location)
1.3.1 World Semiconductor & IC Packaging Market Size by Region (2018-2029), (by Headquarter Location)
1.3.2 United States Semiconductor & IC Packaging Market Size (2018-2029)
1.3.3 China Semiconductor & IC Packaging Market Size (2018-2029)
1.3.4 Europe Semiconductor & IC Packaging Market Size (2018-2029)
1.3.5 Japan Semiconductor & IC Packaging Market Size (2018-2029)
1.3.6 South Korea Semiconductor & IC Packaging Market Size (2018-2029)
1.3.7 ASEAN Semiconductor & IC Packaging Market Size (2018-2029)
1.3.8 India Semiconductor & IC Packaging Market Size (2018-2029)
1.4 Market Drivers, Restraints and Trends
1.4.1 Semiconductor & IC Packaging Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Semiconductor & IC Packaging Major Market Trends

2 Demand Summary
2.1 World Semiconductor & IC Packaging Consumption Value (2018-2029)
2.2 World Semiconductor & IC Packaging Consumption Value by Region
2.2.1 World Semiconductor & IC Packaging Consumption Value by Region (2018-2023)
2.2.2 World Semiconductor & IC Packaging Consumption Value Forecast by Region (2024-2029)
2.3 United States Semiconductor & IC Packaging Consumption Value (2018-2029)
2.4 China Semiconductor & IC Packaging Consumption Value (2018-2029)
2.5 Europe Semiconductor & IC Packaging Consumption Value (2018-2029)
2.6 Japan Semiconductor & IC Packaging Consumption Value (2018-2029)
2.7 South Korea Semiconductor & IC Packaging Consumption Value (2018-2029)
2.8 ASEAN Semiconductor & IC Packaging Consumption Value (2018-2029)
2.9 India Semiconductor & IC Packaging Consumption Value (2018-2029)

3 World Semiconductor & IC Packaging Companies Competitive Analysis
3.1 World Semiconductor & IC Packaging Revenue by Player (2018-2023)
3.2 Industry Rank and Concentration Rate (CR)
3.2.1 Global Semiconductor & IC Packaging Industry Rank of Major Players
3.2.2 Global Concentration Ratios (CR4) for Semiconductor & IC Packaging in 2022
3.2.3 Global Concentration Ratios (CR8) for Semiconductor & IC Packaging in 2022
3.3 Semiconductor & IC Packaging Company Evaluation Quadrant
3.4 Semiconductor & IC Packaging Market: Overall Company Footprint Analysis
3.4.1 Semiconductor & IC Packaging Market: Region Footprint
3.4.2 Semiconductor & IC Packaging Market: Company Product Type Footprint
3.4.3 Semiconductor & IC Packaging Market: Company Product Application Footprint
3.5 Competitive Environment
3.5.1 Historical Structure of the Industry
3.5.2 Barriers of Market Entry
3.5.3 Factors of Competition
3.6 Mergers, Acquisitions Activity

4 United States VS China VS Rest of the World (by Headquarter Location)
4.1 United States VS China: Semiconductor & IC Packaging Revenue Comparison (by Headquarter Location)
4.1.1 United States VS China: Semiconductor & IC Packaging Market Size Comparison (2018 & 2022 & 2029) (by Headquarter Location)
4.1.2 United States VS China: Semiconductor & IC Packaging Revenue Market Share Comparison (2018 & 2022 & 2029)
4.2 United States Based Companies VS China Based Companies: Semiconductor & IC Packaging Consumption Value Comparison
4.2.1 United States VS China: Semiconductor & IC Packaging Consumption Value Comparison (2018 & 2022 & 2029)
4.2.2 United States VS China: Semiconductor & IC Packaging Consumption Value Market Share Comparison (2018 & 2022 & 2029)
4.3 United States Based Semiconductor & IC Packaging Companies and Market Share, 2018-2023
4.3.1 United States Based Semiconductor & IC Packaging Companies, Headquarters (States, Country)
4.3.2 United States Based Companies Semiconductor & IC Packaging Revenue, (2018-2023)
4.4 China Based Companies Semiconductor & IC Packaging Revenue and Market Share, 2018-2023
4.4.1 China Based Semiconductor & IC Packaging Companies, Company Headquarters (Province, Country)
4.4.2 China Based Companies Semiconductor & IC Packaging Revenue, (2018-2023)
4.5 Rest of World Based Semiconductor & IC Packaging Companies and Market Share, 2018-2023
4.5.1 Rest of World Based Semiconductor & IC Packaging Companies, Headquarters (States, Country)
4.5.2 Rest of World Based Companies Semiconductor & IC Packaging Revenue, (2018-2023)

5 Market Analysis by Type
5.1 World Semiconductor & IC Packaging Market Size Overview by Type: 2018 VS 2022 VS 2029
5.2 Segment Introduction by Type
5.2.1 DIP
5.2.2 SOP
5.2.3 QFP
5.2.4 QFN
5.2.5 BGA
5.2.6 CSP
5.2.7 Others
5.3 Market Segment by Type
5.3.1 World Semiconductor & IC Packaging Market Size by Type (2018-2023)
5.3.2 World Semiconductor & IC Packaging Market Size by Type (2024-2029)
5.3.3 World Semiconductor & IC Packaging Market Size Market Share by Type (2018-2029)

6 Market Analysis by Application
6.1 World Semiconductor & IC Packaging Market Size Overview by Application: 2018 VS 2022 VS 2029
6.2 Segment Introduction by Application
6.2.1 Telecommunications
6.2.2 Automotive
6.2.3 Aerospace and Defense
6.2.4 Medical Devices
6.2.5 Medical Devices
6.3 Market Segment by Application
6.3.1 World Semiconductor & IC Packaging Market Size by Application (2018-2023)
6.3.2 World Semiconductor & IC Packaging Market Size by Application (2024-2029)
6.3.3 World Semiconductor & IC Packaging Market Size by Application (2018-2029)

7 Company Profiles
7.1 ASE
7.1.1 ASE Details
7.1.2 ASE Major Business
7.1.3 ASE Semiconductor & IC Packaging Product and Services
7.1.4 ASE Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.1.5 ASE Recent Developments/Updates
7.1.6 ASE Competitive Strengths & Weaknesses
7.2 Amkor
7.2.1 Amkor Details
7.2.2 Amkor Major Business
7.2.3 Amkor Semiconductor & IC Packaging Product and Services
7.2.4 Amkor Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.2.5 Amkor Recent Developments/Updates
7.2.6 Amkor Competitive Strengths & Weaknesses
7.3 SPIL
7.3.1 SPIL Details
7.3.2 SPIL Major Business
7.3.3 SPIL Semiconductor & IC Packaging Product and Services
7.3.4 SPIL Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.3.5 SPIL Recent Developments/Updates
7.3.6 SPIL Competitive Strengths & Weaknesses
7.4 STATS ChipPac
7.4.1 STATS ChipPac Details
7.4.2 STATS ChipPac Major Business
7.4.3 STATS ChipPac Semiconductor & IC Packaging Product and Services
7.4.4 STATS ChipPac Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.4.5 STATS ChipPac Recent Developments/Updates
7.4.6 STATS ChipPac Competitive Strengths & Weaknesses
7.5 Powertech Technology
7.5.1 Powertech Technology Details
7.5.2 Powertech Technology Major Business
7.5.3 Powertech Technology Semiconductor & IC Packaging Product and Services
7.5.4 Powertech Technology Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.5.5 Powertech Technology Recent Developments/Updates
7.5.6 Powertech Technology Competitive Strengths & Weaknesses
7.6 J-devices
7.6.1 J-devices Details
7.6.2 J-devices Major Business
7.6.3 J-devices Semiconductor & IC Packaging Product and Services
7.6.4 J-devices Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.6.5 J-devices Recent Developments/Updates
7.6.6 J-devices Competitive Strengths & Weaknesses
7.7 UTAC
7.7.1 UTAC Details
7.7.2 UTAC Major Business
7.7.3 UTAC Semiconductor & IC Packaging Product and Services
7.7.4 UTAC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.7.5 UTAC Recent Developments/Updates
7.7.6 UTAC Competitive Strengths & Weaknesses
7.8 JECT
7.8.1 JECT Details
7.8.2 JECT Major Business
7.8.3 JECT Semiconductor & IC Packaging Product and Services
7.8.4 JECT Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.8.5 JECT Recent Developments/Updates
7.8.6 JECT Competitive Strengths & Weaknesses
7.9 ChipMOS
7.9.1 ChipMOS Details
7.9.2 ChipMOS Major Business
7.9.3 ChipMOS Semiconductor & IC Packaging Product and Services
7.9.4 ChipMOS Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.9.5 ChipMOS Recent Developments/Updates
7.9.6 ChipMOS Competitive Strengths & Weaknesses
7.10 Chipbond
7.10.1 Chipbond Details
7.10.2 Chipbond Major Business
7.10.3 Chipbond Semiconductor & IC Packaging Product and Services
7.10.4 Chipbond Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.10.5 Chipbond Recent Developments/Updates
7.10.6 Chipbond Competitive Strengths & Weaknesses
7.11 KYEC
7.11.1 KYEC Details
7.11.2 KYEC Major Business
7.11.3 KYEC Semiconductor & IC Packaging Product and Services
7.11.4 KYEC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.11.5 KYEC Recent Developments/Updates
7.11.6 KYEC Competitive Strengths & Weaknesses
7.12 STS Semiconductor
7.12.1 STS Semiconductor Details
7.12.2 STS Semiconductor Major Business
7.12.3 STS Semiconductor Semiconductor & IC Packaging Product and Services
7.12.4 STS Semiconductor Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.12.5 STS Semiconductor Recent Developments/Updates
7.12.6 STS Semiconductor Competitive Strengths & Weaknesses
7.13 Huatian
7.13.1 Huatian Details
7.13.2 Huatian Major Business
7.13.3 Huatian Semiconductor & IC Packaging Product and Services
7.13.4 Huatian Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.13.5 Huatian Recent Developments/Updates
7.13.6 Huatian Competitive Strengths & Weaknesses
7.14 MPl(Carsem)
7.14.1 MPl(Carsem) Details
7.14.2 MPl(Carsem) Major Business
7.14.3 MPl(Carsem) Semiconductor & IC Packaging Product and Services
7.14.4 MPl(Carsem) Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.14.5 MPl(Carsem) Recent Developments/Updates
7.14.6 MPl(Carsem) Competitive Strengths & Weaknesses
7.15 Nepes
7.15.1 Nepes Details
7.15.2 Nepes Major Business
7.15.3 Nepes Semiconductor & IC Packaging Product and Services
7.15.4 Nepes Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.15.5 Nepes Recent Developments/Updates
7.15.6 Nepes Competitive Strengths & Weaknesses
7.16 FATC
7.16.1 FATC Details
7.16.2 FATC Major Business
7.16.3 FATC Semiconductor & IC Packaging Product and Services
7.16.4 FATC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.16.5 FATC Recent Developments/Updates
7.16.6 FATC Competitive Strengths & Weaknesses
7.17 Walton
7.17.1 Walton Details
7.17.2 Walton Major Business
7.17.3 Walton Semiconductor & IC Packaging Product and Services
7.17.4 Walton Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.17.5 Walton Recent Developments/Updates
7.17.6 Walton Competitive Strengths & Weaknesses
7.18 Kyocera
7.18.1 Kyocera Details
7.18.2 Kyocera Major Business
7.18.3 Kyocera Semiconductor & IC Packaging Product and Services
7.18.4 Kyocera Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.18.5 Kyocera Recent Developments/Updates
7.18.6 Kyocera Competitive Strengths & Weaknesses
7.19 Unisem
7.19.1 Unisem Details
7.19.2 Unisem Major Business
7.19.3 Unisem Semiconductor & IC Packaging Product and Services
7.19.4 Unisem Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.19.5 Unisem Recent Developments/Updates
7.19.6 Unisem Competitive Strengths & Weaknesses
7.20 NantongFujitsu Microelectronics
7.20.1 NantongFujitsu Microelectronics Details
7.20.2 NantongFujitsu Microelectronics Major Business
7.20.3 NantongFujitsu Microelectronics Semiconductor & IC Packaging Product and Services
7.20.4 NantongFujitsu Microelectronics Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.20.5 NantongFujitsu Microelectronics Recent Developments/Updates
7.20.6 NantongFujitsu Microelectronics Competitive Strengths & Weaknesses
7.21 Hana Micron
7.21.1 Hana Micron Details
7.21.2 Hana Micron Major Business
7.21.3 Hana Micron Semiconductor & IC Packaging Product and Services
7.21.4 Hana Micron Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.21.5 Hana Micron Recent Developments/Updates
7.21.6 Hana Micron Competitive Strengths & Weaknesses
7.22 Walton Advanced Engineering
7.22.1 Walton Advanced Engineering Details
7.22.2 Walton Advanced Engineering Major Business
7.22.3 Walton Advanced Engineering Semiconductor & IC Packaging Product and Services
7.22.4 Walton Advanced Engineering Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.22.5 Walton Advanced Engineering Recent Developments/Updates
7.22.6 Walton Advanced Engineering Competitive Strengths & Weaknesses
7.23 Signetics
7.23.1 Signetics Details
7.23.2 Signetics Major Business
7.23.3 Signetics Semiconductor & IC Packaging Product and Services
7.23.4 Signetics Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.23.5 Signetics Recent Developments/Updates
7.23.6 Signetics Competitive Strengths & Weaknesses
7.24 Intel Corp
7.24.1 Intel Corp Details
7.24.2 Intel Corp Major Business
7.24.3 Intel Corp Semiconductor & IC Packaging Product and Services
7.24.4 Intel Corp Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.24.5 Intel Corp Recent Developments/Updates
7.24.6 Intel Corp Competitive Strengths & Weaknesses
7.25 LINGSEN
7.25.1 LINGSEN Details
7.25.2 LINGSEN Major Business
7.25.3 LINGSEN Semiconductor & IC Packaging Product and Services
7.25.4 LINGSEN Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
7.25.5 LINGSEN Recent Developments/Updates
7.25.6 LINGSEN Competitive Strengths & Weaknesses

8 Industry Chain Analysis
8.1 Semiconductor & IC Packaging Industry Chain
8.2 Semiconductor & IC Packaging Upstream Analysis
8.3 Semiconductor & IC Packaging Midstream Analysis
8.4 Semiconductor & IC Packaging Downstream Analysis

9 Research Findings and Conclusion

10 Appendix
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
btl

Table of Figures

List of Tables
Table 1. World Semiconductor & IC Packaging Revenue by Region (2018, 2022 and 2029) & (USD Million), (by Headquarter Location)
Table 2. World Semiconductor & IC Packaging Revenue by Region (2018-2023) & (USD Million), (by Headquarter Location)
Table 3. World Semiconductor & IC Packaging Revenue by Region (2024-2029) & (USD Million), (by Headquarter Location)
Table 4. World Semiconductor & IC Packaging Revenue Market Share by Region (2018-2023), (by Headquarter Location)
Table 5. World Semiconductor & IC Packaging Revenue Market Share by Region (2024-2029), (by Headquarter Location)
Table 6. Major Market Trends
Table 7. World Semiconductor & IC Packaging Consumption Value Growth Rate Forecast by Region (2018 & 2022 & 2029) & (USD Million)
Table 8. World Semiconductor & IC Packaging Consumption Value by Region (2018-2023) & (USD Million)
Table 9. World Semiconductor & IC Packaging Consumption Value Forecast by Region (2024-2029) & (USD Million)
Table 10. World Semiconductor & IC Packaging Revenue by Player (2018-2023) & (USD Million)
Table 11. Revenue Market Share of Key Semiconductor & IC Packaging Players in 2022
Table 12. World Semiconductor & IC Packaging Industry Rank of Major Player, Based on Revenue in 2022
Table 13. Global Semiconductor & IC Packaging Company Evaluation Quadrant
Table 14. Head Office of Key Semiconductor & IC Packaging Player
Table 15. Semiconductor & IC Packaging Market: Company Product Type Footprint
Table 16. Semiconductor & IC Packaging Market: Company Product Application Footprint
Table 17. Semiconductor & IC Packaging Mergers & Acquisitions Activity
Table 18. United States VS China Semiconductor & IC Packaging Market Size Comparison, (2018 & 2022 & 2029) & (USD Million)
Table 19. United States VS China Semiconductor & IC Packaging Consumption Value Comparison, (2018 & 2022 & 2029) & (USD Million)
Table 20. United States Based Semiconductor & IC Packaging Companies, Headquarters (States, Country)
Table 21. United States Based Companies Semiconductor & IC Packaging Revenue, (2018-2023) & (USD Million)
Table 22. United States Based Companies Semiconductor & IC Packaging Revenue Market Share (2018-2023)
Table 23. China Based Semiconductor & IC Packaging Companies, Headquarters (Province, Country)
Table 24. China Based Companies Semiconductor & IC Packaging Revenue, (2018-2023) & (USD Million)
Table 25. China Based Companies Semiconductor & IC Packaging Revenue Market Share (2018-2023)
Table 26. Rest of World Based Semiconductor & IC Packaging Companies, Headquarters (States, Country)
Table 27. Rest of World Based Companies Semiconductor & IC Packaging Revenue, (2018-2023) & (USD Million)
Table 28. Rest of World Based Companies Semiconductor & IC Packaging Revenue Market Share (2018-2023)
Table 29. World Semiconductor & IC Packaging Market Size by Type, (USD Million), 2018 & 2022 & 2029
Table 30. World Semiconductor & IC Packaging Market Size by Type (2018-2023) & (USD Million)
Table 31. World Semiconductor & IC Packaging Market Size by Type (2024-2029) & (USD Million)
Table 32. World Semiconductor & IC Packaging Market Size by Application, (USD Million), 2018 & 2022 & 2029
Table 33. World Semiconductor & IC Packaging Market Size by Application (2018-2023) & (USD Million)
Table 34. World Semiconductor & IC Packaging Market Size by Application (2024-2029) & (USD Million)
Table 35. ASE Basic Information, Area Served and Competitors
Table 36. ASE Major Business
Table 37. ASE Semiconductor & IC Packaging Product and Services
Table 38. ASE Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 39. ASE Recent Developments/Updates
Table 40. ASE Competitive Strengths & Weaknesses
Table 41. Amkor Basic Information, Area Served and Competitors
Table 42. Amkor Major Business
Table 43. Amkor Semiconductor & IC Packaging Product and Services
Table 44. Amkor Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 45. Amkor Recent Developments/Updates
Table 46. Amkor Competitive Strengths & Weaknesses
Table 47. SPIL Basic Information, Area Served and Competitors
Table 48. SPIL Major Business
Table 49. SPIL Semiconductor & IC Packaging Product and Services
Table 50. SPIL Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 51. SPIL Recent Developments/Updates
Table 52. SPIL Competitive Strengths & Weaknesses
Table 53. STATS ChipPac Basic Information, Area Served and Competitors
Table 54. STATS ChipPac Major Business
Table 55. STATS ChipPac Semiconductor & IC Packaging Product and Services
Table 56. STATS ChipPac Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 57. STATS ChipPac Recent Developments/Updates
Table 58. STATS ChipPac Competitive Strengths & Weaknesses
Table 59. Powertech Technology Basic Information, Area Served and Competitors
Table 60. Powertech Technology Major Business
Table 61. Powertech Technology Semiconductor & IC Packaging Product and Services
Table 62. Powertech Technology Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 63. Powertech Technology Recent Developments/Updates
Table 64. Powertech Technology Competitive Strengths & Weaknesses
Table 65. J-devices Basic Information, Area Served and Competitors
Table 66. J-devices Major Business
Table 67. J-devices Semiconductor & IC Packaging Product and Services
Table 68. J-devices Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 69. J-devices Recent Developments/Updates
Table 70. J-devices Competitive Strengths & Weaknesses
Table 71. UTAC Basic Information, Area Served and Competitors
Table 72. UTAC Major Business
Table 73. UTAC Semiconductor & IC Packaging Product and Services
Table 74. UTAC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 75. UTAC Recent Developments/Updates
Table 76. UTAC Competitive Strengths & Weaknesses
Table 77. JECT Basic Information, Area Served and Competitors
Table 78. JECT Major Business
Table 79. JECT Semiconductor & IC Packaging Product and Services
Table 80. JECT Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 81. JECT Recent Developments/Updates
Table 82. JECT Competitive Strengths & Weaknesses
Table 83. ChipMOS Basic Information, Area Served and Competitors
Table 84. ChipMOS Major Business
Table 85. ChipMOS Semiconductor & IC Packaging Product and Services
Table 86. ChipMOS Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 87. ChipMOS Recent Developments/Updates
Table 88. ChipMOS Competitive Strengths & Weaknesses
Table 89. Chipbond Basic Information, Area Served and Competitors
Table 90. Chipbond Major Business
Table 91. Chipbond Semiconductor & IC Packaging Product and Services
Table 92. Chipbond Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 93. Chipbond Recent Developments/Updates
Table 94. Chipbond Competitive Strengths & Weaknesses
Table 95. KYEC Basic Information, Area Served and Competitors
Table 96. KYEC Major Business
Table 97. KYEC Semiconductor & IC Packaging Product and Services
Table 98. KYEC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 99. KYEC Recent Developments/Updates
Table 100. KYEC Competitive Strengths & Weaknesses
Table 101. STS Semiconductor Basic Information, Area Served and Competitors
Table 102. STS Semiconductor Major Business
Table 103. STS Semiconductor Semiconductor & IC Packaging Product and Services
Table 104. STS Semiconductor Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 105. STS Semiconductor Recent Developments/Updates
Table 106. STS Semiconductor Competitive Strengths & Weaknesses
Table 107. Huatian Basic Information, Area Served and Competitors
Table 108. Huatian Major Business
Table 109. Huatian Semiconductor & IC Packaging Product and Services
Table 110. Huatian Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 111. Huatian Recent Developments/Updates
Table 112. Huatian Competitive Strengths & Weaknesses
Table 113. MPl(Carsem) Basic Information, Area Served and Competitors
Table 114. MPl(Carsem) Major Business
Table 115. MPl(Carsem) Semiconductor & IC Packaging Product and Services
Table 116. MPl(Carsem) Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 117. MPl(Carsem) Recent Developments/Updates
Table 118. MPl(Carsem) Competitive Strengths & Weaknesses
Table 119. Nepes Basic Information, Area Served and Competitors
Table 120. Nepes Major Business
Table 121. Nepes Semiconductor & IC Packaging Product and Services
Table 122. Nepes Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 123. Nepes Recent Developments/Updates
Table 124. Nepes Competitive Strengths & Weaknesses
Table 125. FATC Basic Information, Area Served and Competitors
Table 126. FATC Major Business
Table 127. FATC Semiconductor & IC Packaging Product and Services
Table 128. FATC Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 129. FATC Recent Developments/Updates
Table 130. FATC Competitive Strengths & Weaknesses
Table 131. Walton Basic Information, Area Served and Competitors
Table 132. Walton Major Business
Table 133. Walton Semiconductor & IC Packaging Product and Services
Table 134. Walton Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 135. Walton Recent Developments/Updates
Table 136. Walton Competitive Strengths & Weaknesses
Table 137. Kyocera Basic Information, Area Served and Competitors
Table 138. Kyocera Major Business
Table 139. Kyocera Semiconductor & IC Packaging Product and Services
Table 140. Kyocera Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 141. Kyocera Recent Developments/Updates
Table 142. Kyocera Competitive Strengths & Weaknesses
Table 143. Unisem Basic Information, Area Served and Competitors
Table 144. Unisem Major Business
Table 145. Unisem Semiconductor & IC Packaging Product and Services
Table 146. Unisem Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 147. Unisem Recent Developments/Updates
Table 148. Unisem Competitive Strengths & Weaknesses
Table 149. NantongFujitsu Microelectronics Basic Information, Area Served and Competitors
Table 150. NantongFujitsu Microelectronics Major Business
Table 151. NantongFujitsu Microelectronics Semiconductor & IC Packaging Product and Services
Table 152. NantongFujitsu Microelectronics Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 153. NantongFujitsu Microelectronics Recent Developments/Updates
Table 154. NantongFujitsu Microelectronics Competitive Strengths & Weaknesses
Table 155. Hana Micron Basic Information, Area Served and Competitors
Table 156. Hana Micron Major Business
Table 157. Hana Micron Semiconductor & IC Packaging Product and Services
Table 158. Hana Micron Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 159. Hana Micron Recent Developments/Updates
Table 160. Hana Micron Competitive Strengths & Weaknesses
Table 161. Walton Advanced Engineering Basic Information, Area Served and Competitors
Table 162. Walton Advanced Engineering Major Business
Table 163. Walton Advanced Engineering Semiconductor & IC Packaging Product and Services
Table 164. Walton Advanced Engineering Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 165. Walton Advanced Engineering Recent Developments/Updates
Table 166. Walton Advanced Engineering Competitive Strengths & Weaknesses
Table 167. Signetics Basic Information, Area Served and Competitors
Table 168. Signetics Major Business
Table 169. Signetics Semiconductor & IC Packaging Product and Services
Table 170. Signetics Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 171. Signetics Recent Developments/Updates
Table 172. Signetics Competitive Strengths & Weaknesses
Table 173. Intel Corp Basic Information, Area Served and Competitors
Table 174. Intel Corp Major Business
Table 175. Intel Corp Semiconductor & IC Packaging Product and Services
Table 176. Intel Corp Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 177. Intel Corp Recent Developments/Updates
Table 178. LINGSEN Basic Information, Area Served and Competitors
Table 179. LINGSEN Major Business
Table 180. LINGSEN Semiconductor & IC Packaging Product and Services
Table 181. LINGSEN Semiconductor & IC Packaging Revenue, Gross Margin and Market Share (2018-2023) & (USD Million)
Table 182. Global Key Players of Semiconductor & IC Packaging Upstream (Raw Materials)
Table 183. Semiconductor & IC Packaging Typical Customers
List of Figure
Figure 1. Semiconductor & IC Packaging Picture
Figure 2. World Semiconductor & IC Packaging Total Market Size: 2018 & 2022 & 2029, (USD Million)
Figure 3. World Semiconductor & IC Packaging Total Market Size (2018-2029) & (USD Million)
Figure 4. World Semiconductor & IC Packaging Revenue Market Share by Region (2018, 2022 and 2029) & (USD Million) , (by Headquarter Location)
Figure 5. World Semiconductor & IC Packaging Revenue Market Share by Region (2018-2029), (by Headquarter Location)
Figure 6. United States Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 7. China Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 8. Europe Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 9. Japan Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 10. South Korea Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 11. ASEAN Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 12. India Based Company Semiconductor & IC Packaging Revenue (2018-2029) & (USD Million)
Figure 13. Semiconductor & IC Packaging Market Drivers
Figure 14. Factors Affecting Demand
Figure 15. World Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 16. World Semiconductor & IC Packaging Consumption Value Market Share by Region (2018-2029)
Figure 17. United States Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 18. China Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 19. Europe Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 20. Japan Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 21. South Korea Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 22. ASEAN Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 23. India Semiconductor & IC Packaging Consumption Value (2018-2029) & (USD Million)
Figure 24. Producer Shipments of Semiconductor & IC Packaging by Player Revenue ($MM) and Market Share (%): 2022
Figure 25. Global Four-firm Concentration Ratios (CR4) for Semiconductor & IC Packaging Markets in 2022
Figure 26. Global Four-firm Concentration Ratios (CR8) for Semiconductor & IC Packaging Markets in 2022
Figure 27. United States VS China: Semiconductor & IC Packaging Revenue Market Share Comparison (2018 & 2022 & 2029)
Figure 28. United States VS China: Semiconductor & IC Packaging Consumption Value Market Share Comparison (2018 & 2022 & 2029)
Figure 29. World Semiconductor & IC Packaging Market Size by Type, (USD Million), 2018 & 2022 & 2029
Figure 30. World Semiconductor & IC Packaging Market Size Market Share by Type in 2022
Figure 31. DIP
Figure 32. SOP
Figure 33. QFP
Figure 34. QFN
Figure 35. BGA
Figure 36. CSP
Figure 37. Others
Figure 38. World Semiconductor & IC Packaging Market Size Market Share by Type (2018-2029)
Figure 39. World Semiconductor & IC Packaging Market Size by Application, (USD Million), 2018 & 2022 & 2029
Figure 40. World Semiconductor & IC Packaging Market Size Market Share by Application in 2022
Figure 41. Telecommunications
Figure 42. Automotive
Figure 43. Aerospace and Defense
Figure 44. Medical Devices
Figure 45. Consumer Electronics
Figure 46. Semiconductor & IC Packaging Industrial Chain
Figure 47. Methodology
Figure 48. Research Process and Data Source
btl

Research Methodology

Client Requirements

yuan2

Review and analyze client requirements

yuan2

Discussion of all the project requirements and queries

Flexibility Check

yuan2

Project Feasibility Analysis

yuan2

Finalizing tentative research programme

yuan2

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

yuan2

Determination of key drivers, restraints, challenge, and opportunity

yuan2

Identifies market needs and trends

Market Size Estimation & Forecast

yuan2

Estimation of historical data based on secondary and primary data

yuan2

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

yuan2

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

yuan2

Consideration of geography, region-specific product/service demand for region segments

yuan2

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

tuBiao1

Data Source

yuan2

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

yuan2

Discussion of all the project requirements and queries

Validation and triangulation of secondary and primary source.

yuan2

Collection of data

yuan2

Cumulating and collating the essential qualitative and quantitative data

yuan2

Generation of report in client requested format by research analysts

yuan2

Reviews by expert analysts

yuan2

Final quality check

yuan2

Clarifying queries

yuan2

Receiving feedback

yuan2

Ensuring satisfaction

  • yuan01
    liuCheng01

    01 Identification of data

    This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.

  • yuan01
    liuCheng01

    02 Evaluation of Market Dynamic

    This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.

  • yuan01
    liuCheng01

    03 Collection of Data

    This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.

  • yuan01
    liuCheng01

    04 Collaboration of Data

    This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.

  • yuan01
    liuCheng01

    05 Verification and Analysis

    This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

btl

Companies Mentioned

ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Kyocera
Unisem
NantongFujitsu Microelectronics
Hana Micron
Walton Advanced Engineering
Signetics
Intel Corp
LINGSEN
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