Global Wafer Grinder (Wafer Thinning Equipment) Supply, Demand and Key Producers, 2024-2030

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Published Date: 01 Apr 2024

Category: Machinery & Equipment

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

The global Wafer Grinder (Wafer Thinning Equipment) market size is expected to reach $ 1285.5 million by 2030, rising at a market growth of 6.2% CAGR during the forecast period (2024-2030).

Global key players of wafer grinder (wafer thinning equipment) include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, etc. Global top three manufacturers hold a share over 84%. Japan is the largest producer of wafer grinder (wafer thinning equipment) holds a share over 57%. In terms of product, full automatic is the largest segment, with a share over 68%. And in terms of application, the largest application is 300 mm wafer, with a share over 78%.

In China market, the key players of Wafer Grinder (Wafer Thinning Equipment) include Disco and TOKYO SEIMITSU, etc. The top two players hold a share over 80%. In terms of product type, Fully Automatic is the largest segment, occupied for a share of about 92%, and in terms of application, 300mm Wafer has a share about 80 percent.

This report studies the global Wafer Grinder (Wafer Thinning Equipment) production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Wafer Grinder (Wafer Thinning Equipment), and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of Wafer Grinder (Wafer Thinning Equipment) that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global Wafer Grinder (Wafer Thinning Equipment) total production and demand, 2019-2030, (Units)
Global Wafer Grinder (Wafer Thinning Equipment) total production value, 2019-2030, (USD Million)
Global Wafer Grinder (Wafer Thinning Equipment) production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (Units)
Global Wafer Grinder (Wafer Thinning Equipment) consumption by region & country, CAGR, 2019-2030 & (Units)
U.S. VS China: Wafer Grinder (Wafer Thinning Equipment) domestic production, consumption, key domestic manufacturers and share
Global Wafer Grinder (Wafer Thinning Equipment) production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (Units)
Global Wafer Grinder (Wafer Thinning Equipment) production by Type, production, value, CAGR, 2019-2030, (USD Million) & (Units)
Global Wafer Grinder (Wafer Thinning Equipment) production by Application production, value, CAGR, 2019-2030, (USD Million) & (Units).

This reports profiles key players in the global Wafer Grinder (Wafer Thinning Equipment) market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG and Shenzhen Fangda, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Wafer Grinder (Wafer Thinning Equipment) market.

Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global Wafer Grinder (Wafer Thinning Equipment) Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global Wafer Grinder (Wafer Thinning Equipment) Market, Segmentation by Type
    Fully Automatic
    Semi-Automatic

Global Wafer Grinder (Wafer Thinning Equipment) Market, Segmentation by Application
    200mm Wafer
    300mm Wafer
    Others

Companies Profiled:
    Disco
    TOKYO SEIMITSU
    G&N
    Okamoto Semiconductor Equipment Division
    CETC
    Koyo Machinery
    Revasum
    WAIDA MFG
    Shenzhen Fangda
    Hunan Yujing Machine Industrial
    SpeedFam
    Hauhaiqingke

Key Questions Answered
1. How big is the global Wafer Grinder (Wafer Thinning Equipment) market?
2. What is the demand of the global Wafer Grinder (Wafer Thinning Equipment) market?
3. What is the year over year growth of the global Wafer Grinder (Wafer Thinning Equipment) market?
4. What is the production and production value of the global Wafer Grinder (Wafer Thinning Equipment) market?
5. Who are the key producers in the global Wafer Grinder (Wafer Thinning Equipment) market?

Table of Contents

1 Supply Summary
    1.1 Wafer Grinder (Wafer Thinning Equipment) Introduction
    1.2 World Wafer Grinder (Wafer Thinning Equipment) Supply & Forecast
        1.2.1 World Wafer Grinder (Wafer Thinning Equipment) Production Value (2019 & 2023 & 2030)
        1.2.2 World Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030)
        1.2.3 World Wafer Grinder (Wafer Thinning Equipment) Pricing Trends (2019-2030)
    1.3 World Wafer Grinder (Wafer Thinning Equipment) Production by Region (Based on Production Site)
        1.3.1 World Wafer Grinder (Wafer Thinning Equipment) Production Value by Region (2019-2030)
        1.3.2 World Wafer Grinder (Wafer Thinning Equipment) Production by Region (2019-2030)
        1.3.3 World Wafer Grinder (Wafer Thinning Equipment) Average Price by Region (2019-2030)
        1.3.4 North America Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030)
        1.3.5 Europe Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030)
        1.3.6 China Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030)
        1.3.7 Japan Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030)
        1.3.8 Taiwan (China) Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030)
        1.3.9 South Korea Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 Wafer Grinder (Wafer Thinning Equipment) Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 Wafer Grinder (Wafer Thinning Equipment) Major Market Trends

2 Demand Summary
    2.1 World Wafer Grinder (Wafer Thinning Equipment) Demand (2019-2030)
    2.2 World Wafer Grinder (Wafer Thinning Equipment) Consumption by Region
        2.2.1 World Wafer Grinder (Wafer Thinning Equipment) Consumption by Region (2019-2024)
        2.2.2 World Wafer Grinder (Wafer Thinning Equipment) Consumption Forecast by Region (2025-2030)
    2.3 United States Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030)
    2.4 China Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030)
    2.5 Europe Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030)
    2.6 Japan Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030)
    2.7 South Korea Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030)
    2.8 ASEAN Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030)
    2.9 India Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030)

3 World Wafer Grinder (Wafer Thinning Equipment) Manufacturers Competitive Analysis
    3.1 World Wafer Grinder (Wafer Thinning Equipment) Production Value by Manufacturer (2019-2024)
    3.2 World Wafer Grinder (Wafer Thinning Equipment) Production by Manufacturer (2019-2024)
    3.3 World Wafer Grinder (Wafer Thinning Equipment) Average Price by Manufacturer (2019-2024)
    3.4 Wafer Grinder (Wafer Thinning Equipment) Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global Wafer Grinder (Wafer Thinning Equipment) Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for Wafer Grinder (Wafer Thinning Equipment) in 2023
        3.5.3 Global Concentration Ratios (CR8) for Wafer Grinder (Wafer Thinning Equipment) in 2023
    3.6 Wafer Grinder (Wafer Thinning Equipment) Market: Overall Company Footprint Analysis
        3.6.1 Wafer Grinder (Wafer Thinning Equipment) Market: Region Footprint
        3.6.2 Wafer Grinder (Wafer Thinning Equipment) Market: Company Product Type Footprint
        3.6.3 Wafer Grinder (Wafer Thinning Equipment) Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: Wafer Grinder (Wafer Thinning Equipment) Production Value Comparison
        4.1.1 United States VS China: Wafer Grinder (Wafer Thinning Equipment) Production Value Comparison (2019 & 2023 & 2030)
        4.1.2 United States VS China: Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share Comparison (2019 & 2023 & 2030)
    4.2 United States VS China: Wafer Grinder (Wafer Thinning Equipment) Production Comparison
        4.2.1 United States VS China: Wafer Grinder (Wafer Thinning Equipment) Production Comparison (2019 & 2023 & 2030)
        4.2.2 United States VS China: Wafer Grinder (Wafer Thinning Equipment) Production Market Share Comparison (2019 & 2023 & 2030)
    4.3 United States VS China: Wafer Grinder (Wafer Thinning Equipment) Consumption Comparison
        4.3.1 United States VS China: Wafer Grinder (Wafer Thinning Equipment) Consumption Comparison (2019 & 2023 & 2030)
        4.3.2 United States VS China: Wafer Grinder (Wafer Thinning Equipment) Consumption Market Share Comparison (2019 & 2023 & 2030)
    4.4 United States Based Wafer Grinder (Wafer Thinning Equipment) Manufacturers and Market Share, 2019-2024
        4.4.1 United States Based Wafer Grinder (Wafer Thinning Equipment) Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Value (2019-2024)
        4.4.3 United States Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production (2019-2024)
    4.5 China Based Wafer Grinder (Wafer Thinning Equipment) Manufacturers and Market Share
        4.5.1 China Based Wafer Grinder (Wafer Thinning Equipment) Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Value (2019-2024)
        4.5.3 China Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production (2019-2024)
    4.6 Rest of World Based Wafer Grinder (Wafer Thinning Equipment) Manufacturers and Market Share, 2019-2024
        4.6.1 Rest of World Based Wafer Grinder (Wafer Thinning Equipment) Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Value (2019-2024)
        4.6.3 Rest of World Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production (2019-2024)

5 Market Analysis by Type
    5.1 World Wafer Grinder (Wafer Thinning Equipment) Market Size Overview by Type: 2019 VS 2023 VS 2030
    5.2 Segment Introduction by Type
        5.2.1 Fully Automatic
        5.2.2 Semi-Automatic
    5.3 Market Segment by Type
        5.3.1 World Wafer Grinder (Wafer Thinning Equipment) Production by Type (2019-2030)
        5.3.2 World Wafer Grinder (Wafer Thinning Equipment) Production Value by Type (2019-2030)
        5.3.3 World Wafer Grinder (Wafer Thinning Equipment) Average Price by Type (2019-2030)

6 Market Analysis by Application
    6.1 World Wafer Grinder (Wafer Thinning Equipment) Market Size Overview by Application: 2019 VS 2023 VS 2030
    6.2 Segment Introduction by Application
        6.2.1 200mm Wafer
        6.2.2 300mm Wafer
        6.2.3 Others
    6.3 Market Segment by Application
        6.3.1 World Wafer Grinder (Wafer Thinning Equipment) Production by Application (2019-2030)
        6.3.2 World Wafer Grinder (Wafer Thinning Equipment) Production Value by Application (2019-2030)
        6.3.3 World Wafer Grinder (Wafer Thinning Equipment) Average Price by Application (2019-2030)

7 Company Profiles
    7.1 Disco
        7.1.1 Disco Details
        7.1.2 Disco Major Business
        7.1.3 Disco Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.1.4 Disco Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.1.5 Disco Recent Developments/Updates
        7.1.6 Disco Competitive Strengths & Weaknesses
    7.2 TOKYO SEIMITSU
        7.2.1 TOKYO SEIMITSU Details
        7.2.2 TOKYO SEIMITSU Major Business
        7.2.3 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.2.4 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.2.5 TOKYO SEIMITSU Recent Developments/Updates
        7.2.6 TOKYO SEIMITSU Competitive Strengths & Weaknesses
    7.3 G&N
        7.3.1 G&N Details
        7.3.2 G&N Major Business
        7.3.3 G&N Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.3.4 G&N Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.3.5 G&N Recent Developments/Updates
        7.3.6 G&N Competitive Strengths & Weaknesses
    7.4 Okamoto Semiconductor Equipment Division
        7.4.1 Okamoto Semiconductor Equipment Division Details
        7.4.2 Okamoto Semiconductor Equipment Division Major Business
        7.4.3 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.4.4 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
        7.4.6 Okamoto Semiconductor Equipment Division Competitive Strengths & Weaknesses
    7.5 CETC
        7.5.1 CETC Details
        7.5.2 CETC Major Business
        7.5.3 CETC Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.5.4 CETC Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.5.5 CETC Recent Developments/Updates
        7.5.6 CETC Competitive Strengths & Weaknesses
    7.6 Koyo Machinery
        7.6.1 Koyo Machinery Details
        7.6.2 Koyo Machinery Major Business
        7.6.3 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.6.4 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.6.5 Koyo Machinery Recent Developments/Updates
        7.6.6 Koyo Machinery Competitive Strengths & Weaknesses
    7.7 Revasum
        7.7.1 Revasum Details
        7.7.2 Revasum Major Business
        7.7.3 Revasum Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.7.4 Revasum Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.7.5 Revasum Recent Developments/Updates
        7.7.6 Revasum Competitive Strengths & Weaknesses
    7.8 WAIDA MFG
        7.8.1 WAIDA MFG Details
        7.8.2 WAIDA MFG Major Business
        7.8.3 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.8.4 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.8.5 WAIDA MFG Recent Developments/Updates
        7.8.6 WAIDA MFG Competitive Strengths & Weaknesses
    7.9 Shenzhen Fangda
        7.9.1 Shenzhen Fangda Details
        7.9.2 Shenzhen Fangda Major Business
        7.9.3 Shenzhen Fangda Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.9.4 Shenzhen Fangda Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.9.5 Shenzhen Fangda Recent Developments/Updates
        7.9.6 Shenzhen Fangda Competitive Strengths & Weaknesses
    7.10 Hunan Yujing Machine Industrial
        7.10.1 Hunan Yujing Machine Industrial Details
        7.10.2 Hunan Yujing Machine Industrial Major Business
        7.10.3 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.10.4 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.10.5 Hunan Yujing Machine Industrial Recent Developments/Updates
        7.10.6 Hunan Yujing Machine Industrial Competitive Strengths & Weaknesses
    7.11 SpeedFam
        7.11.1 SpeedFam Details
        7.11.2 SpeedFam Major Business
        7.11.3 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.11.4 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.11.5 SpeedFam Recent Developments/Updates
        7.11.6 SpeedFam Competitive Strengths & Weaknesses
    7.12 Hauhaiqingke
        7.12.1 Hauhaiqingke Details
        7.12.2 Hauhaiqingke Major Business
        7.12.3 Hauhaiqingke Wafer Grinder (Wafer Thinning Equipment) Product and Services
        7.12.4 Hauhaiqingke Wafer Grinder (Wafer Thinning Equipment) Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.12.5 Hauhaiqingke Recent Developments/Updates
        7.12.6 Hauhaiqingke Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 Wafer Grinder (Wafer Thinning Equipment) Industry Chain
    8.2 Wafer Grinder (Wafer Thinning Equipment) Upstream Analysis
        8.2.1 Wafer Grinder (Wafer Thinning Equipment) Core Raw Materials
        8.2.2 Main Manufacturers of Wafer Grinder (Wafer Thinning Equipment) Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 Wafer Grinder (Wafer Thinning Equipment) Production Mode
    8.6 Wafer Grinder (Wafer Thinning Equipment) Procurement Model
    8.7 Wafer Grinder (Wafer Thinning Equipment) Industry Sales Model and Sales Channels
        8.7.1 Wafer Grinder (Wafer Thinning Equipment) Sales Model
        8.7.2 Wafer Grinder (Wafer Thinning Equipment) Typical Customers

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Region (2019, 2023 and 2030) & (USD Million)
    Table 2. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Region (2019-2024) & (USD Million)
    Table 3. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Region (2025-2030) & (USD Million)
    Table 4. World Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Region (2019-2024)
    Table 5. World Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Region (2025-2030)
    Table 6. World Wafer Grinder (Wafer Thinning Equipment) Production by Region (2019-2024) & (Units)
    Table 7. World Wafer Grinder (Wafer Thinning Equipment) Production by Region (2025-2030) & (Units)
    Table 8. World Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Region (2019-2024)
    Table 9. World Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Region (2025-2030)
    Table 10. World Wafer Grinder (Wafer Thinning Equipment) Average Price by Region (2019-2024) & (K US$/Unit)
    Table 11. World Wafer Grinder (Wafer Thinning Equipment) Average Price by Region (2025-2030) & (K US$/Unit)
    Table 12. Wafer Grinder (Wafer Thinning Equipment) Major Market Trends
    Table 13. World Wafer Grinder (Wafer Thinning Equipment) Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (Units)
    Table 14. World Wafer Grinder (Wafer Thinning Equipment) Consumption by Region (2019-2024) & (Units)
    Table 15. World Wafer Grinder (Wafer Thinning Equipment) Consumption Forecast by Region (2025-2030) & (Units)
    Table 16. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Manufacturer (2019-2024) & (USD Million)
    Table 17. Production Value Market Share of Key Wafer Grinder (Wafer Thinning Equipment) Producers in 2023
    Table 18. World Wafer Grinder (Wafer Thinning Equipment) Production by Manufacturer (2019-2024) & (Units)
    Table 19. Production Market Share of Key Wafer Grinder (Wafer Thinning Equipment) Producers in 2023
    Table 20. World Wafer Grinder (Wafer Thinning Equipment) Average Price by Manufacturer (2019-2024) & (K US$/Unit)
    Table 21. Global Wafer Grinder (Wafer Thinning Equipment) Company Evaluation Quadrant
    Table 22. World Wafer Grinder (Wafer Thinning Equipment) Industry Rank of Major Manufacturers, Based on Production Value in 2023
    Table 23. Head Office and Wafer Grinder (Wafer Thinning Equipment) Production Site of Key Manufacturer
    Table 24. Wafer Grinder (Wafer Thinning Equipment) Market: Company Product Type Footprint
    Table 25. Wafer Grinder (Wafer Thinning Equipment) Market: Company Product Application Footprint
    Table 26. Wafer Grinder (Wafer Thinning Equipment) Competitive Factors
    Table 27. Wafer Grinder (Wafer Thinning Equipment) New Entrant and Capacity Expansion Plans
    Table 28. Wafer Grinder (Wafer Thinning Equipment) Mergers & Acquisitions Activity
    Table 29. United States VS China Wafer Grinder (Wafer Thinning Equipment) Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
    Table 30. United States VS China Wafer Grinder (Wafer Thinning Equipment) Production Comparison, (2019 & 2023 & 2030) & (Units)
    Table 31. United States VS China Wafer Grinder (Wafer Thinning Equipment) Consumption Comparison, (2019 & 2023 & 2030) & (Units)
    Table 32. United States Based Wafer Grinder (Wafer Thinning Equipment) Manufacturers, Headquarters and Production Site (States, Country)
    Table 33. United States Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Value, (2019-2024) & (USD Million)
    Table 34. United States Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share (2019-2024)
    Table 35. United States Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production (2019-2024) & (Units)
    Table 36. United States Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Market Share (2019-2024)
    Table 37. China Based Wafer Grinder (Wafer Thinning Equipment) Manufacturers, Headquarters and Production Site (Province, Country)
    Table 38. China Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Value, (2019-2024) & (USD Million)
    Table 39. China Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share (2019-2024)
    Table 40. China Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production (2019-2024) & (Units)
    Table 41. China Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Market Share (2019-2024)
    Table 42. Rest of World Based Wafer Grinder (Wafer Thinning Equipment) Manufacturers, Headquarters and Production Site (States, Country)
    Table 43. Rest of World Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Value, (2019-2024) & (USD Million)
    Table 44. Rest of World Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share (2019-2024)
    Table 45. Rest of World Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production (2019-2024) & (Units)
    Table 46. Rest of World Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Market Share (2019-2024)
    Table 47. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Type, (USD Million), 2019 & 2023 & 2030
    Table 48. World Wafer Grinder (Wafer Thinning Equipment) Production by Type (2019-2024) & (Units)
    Table 49. World Wafer Grinder (Wafer Thinning Equipment) Production by Type (2025-2030) & (Units)
    Table 50. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Type (2019-2024) & (USD Million)
    Table 51. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Type (2025-2030) & (USD Million)
    Table 52. World Wafer Grinder (Wafer Thinning Equipment) Average Price by Type (2019-2024) & (K US$/Unit)
    Table 53. World Wafer Grinder (Wafer Thinning Equipment) Average Price by Type (2025-2030) & (K US$/Unit)
    Table 54. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Application, (USD Million), 2019 & 2023 & 2030
    Table 55. World Wafer Grinder (Wafer Thinning Equipment) Production by Application (2019-2024) & (Units)
    Table 56. World Wafer Grinder (Wafer Thinning Equipment) Production by Application (2025-2030) & (Units)
    Table 57. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Application (2019-2024) & (USD Million)
    Table 58. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Application (2025-2030) & (USD Million)
    Table 59. World Wafer Grinder (Wafer Thinning Equipment) Average Price by Application (2019-2024) & (K US$/Unit)
    Table 60. World Wafer Grinder (Wafer Thinning Equipment) Average Price by Application (2025-2030) & (K US$/Unit)
    Table 61. Disco Basic Information, Manufacturing Base and Competitors
    Table 62. Disco Major Business
    Table 63. Disco Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 64. Disco Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 65. Disco Recent Developments/Updates
    Table 66. Disco Competitive Strengths & Weaknesses
    Table 67. TOKYO SEIMITSU Basic Information, Manufacturing Base and Competitors
    Table 68. TOKYO SEIMITSU Major Business
    Table 69. TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 70. TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 71. TOKYO SEIMITSU Recent Developments/Updates
    Table 72. TOKYO SEIMITSU Competitive Strengths & Weaknesses
    Table 73. G&N Basic Information, Manufacturing Base and Competitors
    Table 74. G&N Major Business
    Table 75. G&N Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 76. G&N Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 77. G&N Recent Developments/Updates
    Table 78. G&N Competitive Strengths & Weaknesses
    Table 79. Okamoto Semiconductor Equipment Division Basic Information, Manufacturing Base and Competitors
    Table 80. Okamoto Semiconductor Equipment Division Major Business
    Table 81. Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 82. Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 83. Okamoto Semiconductor Equipment Division Recent Developments/Updates
    Table 84. Okamoto Semiconductor Equipment Division Competitive Strengths & Weaknesses
    Table 85. CETC Basic Information, Manufacturing Base and Competitors
    Table 86. CETC Major Business
    Table 87. CETC Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 88. CETC Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 89. CETC Recent Developments/Updates
    Table 90. CETC Competitive Strengths & Weaknesses
    Table 91. Koyo Machinery Basic Information, Manufacturing Base and Competitors
    Table 92. Koyo Machinery Major Business
    Table 93. Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 94. Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 95. Koyo Machinery Recent Developments/Updates
    Table 96. Koyo Machinery Competitive Strengths & Weaknesses
    Table 97. Revasum Basic Information, Manufacturing Base and Competitors
    Table 98. Revasum Major Business
    Table 99. Revasum Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 100. Revasum Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 101. Revasum Recent Developments/Updates
    Table 102. Revasum Competitive Strengths & Weaknesses
    Table 103. WAIDA MFG Basic Information, Manufacturing Base and Competitors
    Table 104. WAIDA MFG Major Business
    Table 105. WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 106. WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 107. WAIDA MFG Recent Developments/Updates
    Table 108. WAIDA MFG Competitive Strengths & Weaknesses
    Table 109. Shenzhen Fangda Basic Information, Manufacturing Base and Competitors
    Table 110. Shenzhen Fangda Major Business
    Table 111. Shenzhen Fangda Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 112. Shenzhen Fangda Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 113. Shenzhen Fangda Recent Developments/Updates
    Table 114. Shenzhen Fangda Competitive Strengths & Weaknesses
    Table 115. Hunan Yujing Machine Industrial Basic Information, Manufacturing Base and Competitors
    Table 116. Hunan Yujing Machine Industrial Major Business
    Table 117. Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 118. Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 119. Hunan Yujing Machine Industrial Recent Developments/Updates
    Table 120. Hunan Yujing Machine Industrial Competitive Strengths & Weaknesses
    Table 121. SpeedFam Basic Information, Manufacturing Base and Competitors
    Table 122. SpeedFam Major Business
    Table 123. SpeedFam Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 124. SpeedFam Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 125. SpeedFam Recent Developments/Updates
    Table 126. Hauhaiqingke Basic Information, Manufacturing Base and Competitors
    Table 127. Hauhaiqingke Major Business
    Table 128. Hauhaiqingke Wafer Grinder (Wafer Thinning Equipment) Product and Services
    Table 129. Hauhaiqingke Wafer Grinder (Wafer Thinning Equipment) Production (Units), Price (K US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 130. Global Key Players of Wafer Grinder (Wafer Thinning Equipment) Upstream (Raw Materials)
    Table 131. Wafer Grinder (Wafer Thinning Equipment) Typical Customers
    Table 132. Wafer Grinder (Wafer Thinning Equipment) Typical Distributors
List of Figure
    Figure 1. Wafer Grinder (Wafer Thinning Equipment) Picture
    Figure 2. World Wafer Grinder (Wafer Thinning Equipment) Production Value: 2019 & 2023 & 2030, (USD Million)
    Figure 3. World Wafer Grinder (Wafer Thinning Equipment) Production Value and Forecast (2019-2030) & (USD Million)
    Figure 4. World Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030) & (Units)
    Figure 5. World Wafer Grinder (Wafer Thinning Equipment) Average Price (2019-2030) & (K US$/Unit)
    Figure 6. World Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Region (2019-2030)
    Figure 7. World Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Region (2019-2030)
    Figure 8. North America Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030) & (Units)
    Figure 9. Europe Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030) & (Units)
    Figure 10. China Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030) & (Units)
    Figure 11. Japan Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030) & (Units)
    Figure 12. Taiwan (China) Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030) & (Units)
    Figure 13. South Korea Wafer Grinder (Wafer Thinning Equipment) Production (2019-2030) & (Units)
    Figure 14. Wafer Grinder (Wafer Thinning Equipment) Market Drivers
    Figure 15. Factors Affecting Demand
    Figure 16. World Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030) & (Units)
    Figure 17. World Wafer Grinder (Wafer Thinning Equipment) Consumption Market Share by Region (2019-2030)
    Figure 18. United States Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030) & (Units)
    Figure 19. China Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030) & (Units)
    Figure 20. Europe Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030) & (Units)
    Figure 21. Japan Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030) & (Units)
    Figure 22. South Korea Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030) & (Units)
    Figure 23. ASEAN Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030) & (Units)
    Figure 24. India Wafer Grinder (Wafer Thinning Equipment) Consumption (2019-2030) & (Units)
    Figure 25. Producer Shipments of Wafer Grinder (Wafer Thinning Equipment) by Manufacturer Revenue ($MM) and Market Share (%): 2023
    Figure 26. Global Four-firm Concentration Ratios (CR4) for Wafer Grinder (Wafer Thinning Equipment) Markets in 2023
    Figure 27. Global Four-firm Concentration Ratios (CR8) for Wafer Grinder (Wafer Thinning Equipment) Markets in 2023
    Figure 28. United States VS China: Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share Comparison (2019 & 2023 & 2030)
    Figure 29. United States VS China: Wafer Grinder (Wafer Thinning Equipment) Production Market Share Comparison (2019 & 2023 & 2030)
    Figure 30. United States VS China: Wafer Grinder (Wafer Thinning Equipment) Consumption Market Share Comparison (2019 & 2023 & 2030)
    Figure 31. United States Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Market Share 2023
    Figure 32. China Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Market Share 2023
    Figure 33. Rest of World Based Manufacturers Wafer Grinder (Wafer Thinning Equipment) Production Market Share 2023
    Figure 34. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Type, (USD Million), 2019 & 2023 & 2030
    Figure 35. World Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Type in 2023
    Figure 36. Fully Automatic
    Figure 37. Semi-Automatic
    Figure 38. World Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Type (2019-2030)
    Figure 39. World Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Type (2019-2030)
    Figure 40. World Wafer Grinder (Wafer Thinning Equipment) Average Price by Type (2019-2030) & (K US$/Unit)
    Figure 41. World Wafer Grinder (Wafer Thinning Equipment) Production Value by Application, (USD Million), 2019 & 2023 & 2030
    Figure 42. World Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Application in 2023
    Figure 43. 200mm Wafer
    Figure 44. 300mm Wafer
    Figure 45. Others
    Figure 46. World Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Application (2019-2030)
    Figure 47. World Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Application (2019-2030)
    Figure 48. World Wafer Grinder (Wafer Thinning Equipment) Average Price by Application (2019-2030) & (K US$/Unit)
    Figure 49. Wafer Grinder (Wafer Thinning Equipment) Industry Chain
    Figure 50. Wafer Grinder (Wafer Thinning Equipment) Procurement Model
    Figure 51. Wafer Grinder (Wafer Thinning Equipment) Sales Model
    Figure 52. Wafer Grinder (Wafer Thinning Equipment) Sales Channels, Direct Sales, and Distribution
    Figure 53. Methodology
    Figure 54. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke

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