Global 3D-IC Packaging Market 2022 by Company, Regions, Type and Application, Forecast to 2028

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Published Date: 24 Aug 2022

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Product Tags

Description

The 3D-IC Packaging market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

According to our (Global Info Research) latest study, due to COVID-19 and Russia-Ukraine War influence, the global 3D-IC Packaging market size was valued at USD million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during review period.

The 3D-IC Packaging market in the USA. is estimated at USD million in 2022, which currently accounts for a % share in the global market. China, the world`s second largest economy, is estimated at USD million in 2022 and holds a % percent.

Consumer Electronics occupied for % of the 3D-IC Packaging global market in 2021, and it is projected to value USD million by 2028, growing at a % CAGR in next six years. In terms of product type, TSV segment is altered to a % CAGR between 2022 and 2028.

Global key companies of 3D-IC Packaging include Synopsys, Cadence, XMC, United Microelectronics Corp and TSMC, etc. In terms of revenue, the global top four players hold a share over % in 2021.

Key Features of This Report:
This report provides in-depth analysis of the global 3D-IC Packaging market, and provides market size and CAGR for the history and forecast period (2017-2022, 2023-2028), considering 2021 as the base year.

Main 3D-IC Packaging companies’ industry ranking, revenue, and market share analysis. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.

This reports profiles key players in the global 3D-IC Packaging market based on the following parameters – headquarters, products portfolio, 3D-IC Packaging revenue and gross margin, recent developments.

Evaluation and forecast the 3D-IC Packaging market size, projected growth trends, and corresponding market share analysis by type, by application and by region. It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
Highlights of the current market scenario, recent information, latest developments, and factors impacting the growth of the market
Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
Market segmentation
3D-IC Packaging market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of revenue. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type (2017-2028; USD Million)
    TSV
    TGV
    Silicon Interposer

Market segment by Application (2017-2028; USD Million)
    Consumer Electronics
    Medical Devices
    Automotive
    Others

The key market players for global 3D-IC Packaging market are listed below:
    Synopsys
    Cadence
    XMC
    United Microelectronics Corp
    TSMC
    SPIL
    STMicroelectronics
    ASE Group
    Amkor Technology
    Intel Corporation
    GlobalFoundries
    Invensas
    Toshiba Corporation
    Micron Technology
    Xilinx

Region Segment (2017-2028; USD Million)
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Australia)
    South America (Brazil, Argentina, Colombia and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 12 chapters:
Chapter 1, to describe 3D-IC Packaging product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top players of 3D-IC Packaging, with revenue, gross margin and global market share of 3D-IC Packaging from 2019 to 2022.
Chapter 3, the 3D-IC Packaging competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with revenue and growth rate by Type, application, from 2017 to 2028.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2017 to 2022.and 3D-IC Packaging market forecast, by regions, type and application, with revenue, from 2023 to 2028.
Chapter 11 and 12, to describe 3D-IC Packaging research findings and conclusion, appendix and data source.

Table of Contents

1 Market Overview
    1.1 Product Overview and Scope of 3D-IC Packaging
    1.2 Classification of 3D-IC Packaging by Type
        1.2.1 Overview: Global 3D-IC Packaging Market Size by Type: 2017 Versus 2021 Versus 2028
        1.2.2 Global 3D-IC Packaging Revenue Market Share by Type in 2021
        1.2.3 TSV
        1.2.4 TGV
        1.2.5 Silicon Interposer
    1.3 Global 3D-IC Packaging Market by Application
        1.3.1 Overview: Global 3D-IC Packaging Market Size by Application: 2017 Versus 2021 Versus 2028
        1.3.2 Consumer Electronics
        1.3.3 Medical Devices
        1.3.4 Automotive
        1.3.5 Others
    1.4 Global 3D-IC Packaging Market Size & Forecast
    1.5 Global 3D-IC Packaging Market Size and Forecast by Region
        1.5.1 Global 3D-IC Packaging Market Size by Region: 2017 VS 2021 VS 2028
        1.5.2 Global 3D-IC Packaging Market Size by Region, (2017-2022)
        1.5.3 North America 3D-IC Packaging Market Size and Prospect (2017-2028)
        1.5.4 Europe 3D-IC Packaging Market Size and Prospect (2017-2028)
        1.5.5 Asia-Pacific 3D-IC Packaging Market Size and Prospect (2017-2028)
        1.5.6 South America 3D-IC Packaging Market Size and Prospect (2017-2028)
        1.5.7 Middle East and Africa 3D-IC Packaging Market Size and Prospect (2017-2028)
    1.6 Market Drivers, Restraints and Trends
        1.6.1 3D-IC Packaging Market Drivers
        1.6.2 3D-IC Packaging Market Restraints
        1.6.3 3D-IC Packaging Trends Analysis

2 Company Profiles
    2.1 Synopsys
        2.1.1 Synopsys Details
        2.1.2 Synopsys Major Business
        2.1.3 Synopsys 3D-IC Packaging Product and Solutions
        2.1.4 Synopsys 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.1.5 Synopsys Recent Developments and Future Plans
    2.2 Cadence
        2.2.1 Cadence Details
        2.2.2 Cadence Major Business
        2.2.3 Cadence 3D-IC Packaging Product and Solutions
        2.2.4 Cadence 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.2.5 Cadence Recent Developments and Future Plans
    2.3 XMC
        2.3.1 XMC Details
        2.3.2 XMC Major Business
        2.3.3 XMC 3D-IC Packaging Product and Solutions
        2.3.4 XMC 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.3.5 XMC Recent Developments and Future Plans
    2.4 United Microelectronics Corp
        2.4.1 United Microelectronics Corp Details
        2.4.2 United Microelectronics Corp Major Business
        2.4.3 United Microelectronics Corp 3D-IC Packaging Product and Solutions
        2.4.4 United Microelectronics Corp 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.4.5 United Microelectronics Corp Recent Developments and Future Plans
    2.5 TSMC
        2.5.1 TSMC Details
        2.5.2 TSMC Major Business
        2.5.3 TSMC 3D-IC Packaging Product and Solutions
        2.5.4 TSMC 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.5.5 TSMC Recent Developments and Future Plans
    2.6 SPIL
        2.6.1 SPIL Details
        2.6.2 SPIL Major Business
        2.6.3 SPIL 3D-IC Packaging Product and Solutions
        2.6.4 SPIL 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.6.5 SPIL Recent Developments and Future Plans
    2.7 STMicroelectronics
        2.7.1 STMicroelectronics Details
        2.7.2 STMicroelectronics Major Business
        2.7.3 STMicroelectronics 3D-IC Packaging Product and Solutions
        2.7.4 STMicroelectronics 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.7.5 STMicroelectronics Recent Developments and Future Plans
    2.8 ASE Group
        2.8.1 ASE Group Details
        2.8.2 ASE Group Major Business
        2.8.3 ASE Group 3D-IC Packaging Product and Solutions
        2.8.4 ASE Group 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.8.5 ASE Group Recent Developments and Future Plans
    2.9 Amkor Technology
        2.9.1 Amkor Technology Details
        2.9.2 Amkor Technology Major Business
        2.9.3 Amkor Technology 3D-IC Packaging Product and Solutions
        2.9.4 Amkor Technology 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.9.5 Amkor Technology Recent Developments and Future Plans
    2.10 Intel Corporation
        2.10.1 Intel Corporation Details
        2.10.2 Intel Corporation Major Business
        2.10.3 Intel Corporation 3D-IC Packaging Product and Solutions
        2.10.4 Intel Corporation 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.10.5 Intel Corporation Recent Developments and Future Plans
    2.11 GlobalFoundries
        2.11.1 GlobalFoundries Details
        2.11.2 GlobalFoundries Major Business
        2.11.3 GlobalFoundries 3D-IC Packaging Product and Solutions
        2.11.4 GlobalFoundries 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.11.5 GlobalFoundries Recent Developments and Future Plans
    2.12 Invensas
        2.12.1 Invensas Details
        2.12.2 Invensas Major Business
        2.12.3 Invensas 3D-IC Packaging Product and Solutions
        2.12.4 Invensas 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.12.5 Invensas Recent Developments and Future Plans
    2.13 Toshiba Corporation
        2.13.1 Toshiba Corporation Details
        2.13.2 Toshiba Corporation Major Business
        2.13.3 Toshiba Corporation 3D-IC Packaging Product and Solutions
        2.13.4 Toshiba Corporation 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.13.5 Toshiba Corporation Recent Developments and Future Plans
    2.14 Micron Technology
        2.14.1 Micron Technology Details
        2.14.2 Micron Technology Major Business
        2.14.3 Micron Technology 3D-IC Packaging Product and Solutions
        2.14.4 Micron Technology 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.14.5 Micron Technology Recent Developments and Future Plans
    2.15 Xilinx
        2.15.1 Xilinx Details
        2.15.2 Xilinx Major Business
        2.15.3 Xilinx 3D-IC Packaging Product and Solutions
        2.15.4 Xilinx 3D-IC Packaging Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
        2.15.5 Xilinx Recent Developments and Future Plans

3 Market Competition, by Players
    3.1 Global 3D-IC Packaging Revenue and Share by Players (2019, 2020, 2021, and 2022)
    3.2 Market Concentration Rate
        3.2.1 Top 3 3D-IC Packaging Players Market Share in 2021
        3.2.2 Top 10 3D-IC Packaging Players Market Share in 2021
        3.2.3 Market Competition Trend
    3.3 3D-IC Packaging Players Head Office, Products and Services Provided
    3.4 3D-IC Packaging Mergers & Acquisitions
    3.5 3D-IC Packaging New Entrants and Expansion Plans

4 Market Size Segment by Type
    4.1 Global 3D-IC Packaging Revenue and Market Share by Type (2017-2022)
    4.2 Global 3D-IC Packaging Market Forecast by Type (2023-2028)

5 Market Size Segment by Application
    5.1 Global 3D-IC Packaging Revenue Market Share by Application (2017-2022)
    5.2 Global 3D-IC Packaging Market Forecast by Application (2023-2028)

6 North America by Country, by Type, and by Application
    6.1 North America 3D-IC Packaging Revenue by Type (2017-2028)
    6.2 North America 3D-IC Packaging Revenue by Application (2017-2028)
    6.3 North America 3D-IC Packaging Market Size by Country
        6.3.1 North America 3D-IC Packaging Revenue by Country (2017-2028)
        6.3.2 United States 3D-IC Packaging Market Size and Forecast (2017-2028)
        6.3.3 Canada 3D-IC Packaging Market Size and Forecast (2017-2028)
        6.3.4 Mexico 3D-IC Packaging Market Size and Forecast (2017-2028)

7 Europe by Country, by Type, and by Application
    7.1 Europe 3D-IC Packaging Revenue by Type (2017-2028)
    7.2 Europe 3D-IC Packaging Revenue by Application (2017-2028)
    7.3 Europe 3D-IC Packaging Market Size by Country
        7.3.1 Europe 3D-IC Packaging Revenue by Country (2017-2028)
        7.3.2 Germany 3D-IC Packaging Market Size and Forecast (2017-2028)
        7.3.3 France 3D-IC Packaging Market Size and Forecast (2017-2028)
        7.3.4 United Kingdom 3D-IC Packaging Market Size and Forecast (2017-2028)
        7.3.5 Russia 3D-IC Packaging Market Size and Forecast (2017-2028)
        7.3.6 Italy 3D-IC Packaging Market Size and Forecast (2017-2028)

8 Asia-Pacific by Region, by Type, and by Application
    8.1 Asia-Pacific 3D-IC Packaging Revenue by Type (2017-2028)
    8.2 Asia-Pacific 3D-IC Packaging Revenue by Application (2017-2028)
    8.3 Asia-Pacific 3D-IC Packaging Market Size by Region
        8.3.1 Asia-Pacific 3D-IC Packaging Revenue by Region (2017-2028)
        8.3.2 China 3D-IC Packaging Market Size and Forecast (2017-2028)
        8.3.3 Japan 3D-IC Packaging Market Size and Forecast (2017-2028)
        8.3.4 South Korea 3D-IC Packaging Market Size and Forecast (2017-2028)
        8.3.5 India 3D-IC Packaging Market Size and Forecast (2017-2028)
        8.3.6 Southeast Asia 3D-IC Packaging Market Size and Forecast (2017-2028)
        8.3.7 Australia 3D-IC Packaging Market Size and Forecast (2017-2028)

9 South America by Country, by Type, and by Application
    9.1 South America 3D-IC Packaging Revenue by Type (2017-2028)
    9.2 South America 3D-IC Packaging Revenue by Application (2017-2028)
    9.3 South America 3D-IC Packaging Market Size by Country
        9.3.1 South America 3D-IC Packaging Revenue by Country (2017-2028)
        9.3.2 Brazil 3D-IC Packaging Market Size and Forecast (2017-2028)
        9.3.3 Argentina 3D-IC Packaging Market Size and Forecast (2017-2028)

10 Middle East & Africa by Country, by Type, and by Application
    10.1 Middle East & Africa 3D-IC Packaging Revenue by Type (2017-2028)
    10.2 Middle East & Africa 3D-IC Packaging Revenue by Application (2017-2028)
    10.3 Middle East & Africa 3D-IC Packaging Market Size by Country
        10.3.1 Middle East & Africa 3D-IC Packaging Revenue by Country (2017-2028)
        10.3.2 Turkey 3D-IC Packaging Market Size and Forecast (2017-2028)
        10.3.3 Saudi Arabia 3D-IC Packaging Market Size and Forecast (2017-2028)
        10.3.4 UAE 3D-IC Packaging Market Size and Forecast (2017-2028)

11 Research Findings and Conclusion

12 Appendix
    12.1 Methodology
    12.2 Research Process and Data Source
    12.3 Disclaimer

Table of Figures

List of Tables
    Table 1. Global 3D-IC Packaging Revenue by Type, (USD Million), 2017 VS 2021 VS 2028
    Table 2. Global 3D-IC Packaging Revenue by Application, (USD Million), 2017 VS 2021 VS 2028
    Table 3. Global Market 3D-IC Packaging Revenue (Million USD) Comparison by Region (2017 VS 2021 VS 2028)
    Table 4. Global 3D-IC Packaging Revenue (USD Million) by Region (2017-2022)
    Table 5. Global 3D-IC Packaging Revenue Market Share by Region (2023-2028)
    Table 6. Synopsys Corporate Information, Head Office, and Major Competitors
    Table 7. Synopsys Major Business
    Table 8. Synopsys 3D-IC Packaging Product and Solutions
    Table 9. Synopsys 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 10. Cadence Corporate Information, Head Office, and Major Competitors
    Table 11. Cadence Major Business
    Table 12. Cadence 3D-IC Packaging Product and Solutions
    Table 13. Cadence 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 14. XMC Corporate Information, Head Office, and Major Competitors
    Table 15. XMC Major Business
    Table 16. XMC 3D-IC Packaging Product and Solutions
    Table 17. XMC 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 18. United Microelectronics Corp Corporate Information, Head Office, and Major Competitors
    Table 19. United Microelectronics Corp Major Business
    Table 20. United Microelectronics Corp 3D-IC Packaging Product and Solutions
    Table 21. United Microelectronics Corp 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 22. TSMC Corporate Information, Head Office, and Major Competitors
    Table 23. TSMC Major Business
    Table 24. TSMC 3D-IC Packaging Product and Solutions
    Table 25. TSMC 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 26. SPIL Corporate Information, Head Office, and Major Competitors
    Table 27. SPIL Major Business
    Table 28. SPIL 3D-IC Packaging Product and Solutions
    Table 29. SPIL 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 30. STMicroelectronics Corporate Information, Head Office, and Major Competitors
    Table 31. STMicroelectronics Major Business
    Table 32. STMicroelectronics 3D-IC Packaging Product and Solutions
    Table 33. STMicroelectronics 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 34. ASE Group Corporate Information, Head Office, and Major Competitors
    Table 35. ASE Group Major Business
    Table 36. ASE Group 3D-IC Packaging Product and Solutions
    Table 37. ASE Group 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 38. Amkor Technology Corporate Information, Head Office, and Major Competitors
    Table 39. Amkor Technology Major Business
    Table 40. Amkor Technology 3D-IC Packaging Product and Solutions
    Table 41. Amkor Technology 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 42. Intel Corporation Corporate Information, Head Office, and Major Competitors
    Table 43. Intel Corporation Major Business
    Table 44. Intel Corporation 3D-IC Packaging Product and Solutions
    Table 45. Intel Corporation 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 46. GlobalFoundries Corporate Information, Head Office, and Major Competitors
    Table 47. GlobalFoundries Major Business
    Table 48. GlobalFoundries 3D-IC Packaging Product and Solutions
    Table 49. GlobalFoundries 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 50. Invensas Corporate Information, Head Office, and Major Competitors
    Table 51. Invensas Major Business
    Table 52. Invensas 3D-IC Packaging Product and Solutions
    Table 53. Invensas 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 54. Toshiba Corporation Corporate Information, Head Office, and Major Competitors
    Table 55. Toshiba Corporation Major Business
    Table 56. Toshiba Corporation 3D-IC Packaging Product and Solutions
    Table 57. Toshiba Corporation 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 58. Micron Technology Corporate Information, Head Office, and Major Competitors
    Table 59. Micron Technology Major Business
    Table 60. Micron Technology 3D-IC Packaging Product and Solutions
    Table 61. Micron Technology 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 62. Xilinx Corporate Information, Head Office, and Major Competitors
    Table 63. Xilinx Major Business
    Table 64. Xilinx 3D-IC Packaging Product and Solutions
    Table 65. Xilinx 3D-IC Packaging Revenue (USD Million), Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    Table 66. Global 3D-IC Packaging Revenue (USD Million) by Players (2019, 2020, 2021, and 2022)
    Table 67. Global 3D-IC Packaging Revenue Share by Players (2019, 2020, 2021, and 2022)
    Table 68. Breakdown of 3D-IC Packaging by Company Type (Tier 1, Tier 2 and Tier 3)
    Table 69. 3D-IC Packaging Players Head Office, Products and Services Provided
    Table 70. 3D-IC Packaging Mergers & Acquisitions in the Past Five Years
    Table 71. 3D-IC Packaging New Entrants and Expansion Plans
    Table 72. Global 3D-IC Packaging Revenue (USD Million) by Type (2017-2022)
    Table 73. Global 3D-IC Packaging Revenue Share by Type (2017-2022)
    Table 74. Global 3D-IC Packaging Revenue Forecast by Type (2023-2028)
    Table 75. Global 3D-IC Packaging Revenue by Application (2017-2022)
    Table 76. Global 3D-IC Packaging Revenue Forecast by Application (2023-2028)
    Table 77. North America 3D-IC Packaging Revenue by Type (2017-2022) & (USD Million)
    Table 78. North America 3D-IC Packaging Revenue by Type (2023-2028) & (USD Million)
    Table 79. North America 3D-IC Packaging Revenue by Application (2017-2022) & (USD Million)
    Table 80. North America 3D-IC Packaging Revenue by Application (2023-2028) & (USD Million)
    Table 81. North America 3D-IC Packaging Revenue by Country (2017-2022) & (USD Million)
    Table 82. North America 3D-IC Packaging Revenue by Country (2023-2028) & (USD Million)
    Table 83. Europe 3D-IC Packaging Revenue by Type (2017-2022) & (USD Million)
    Table 84. Europe 3D-IC Packaging Revenue by Type (2023-2028) & (USD Million)
    Table 85. Europe 3D-IC Packaging Revenue by Application (2017-2022) & (USD Million)
    Table 86. Europe 3D-IC Packaging Revenue by Application (2023-2028) & (USD Million)
    Table 87. Europe 3D-IC Packaging Revenue by Country (2017-2022) & (USD Million)
    Table 88. Europe 3D-IC Packaging Revenue by Country (2023-2028) & (USD Million)
    Table 89. Asia-Pacific 3D-IC Packaging Revenue by Type (2017-2022) & (USD Million)
    Table 90. Asia-Pacific 3D-IC Packaging Revenue by Type (2023-2028) & (USD Million)
    Table 91. Asia-Pacific 3D-IC Packaging Revenue by Application (2017-2022) & (USD Million)
    Table 92. Asia-Pacific 3D-IC Packaging Revenue by Application (2023-2028) & (USD Million)
    Table 93. Asia-Pacific 3D-IC Packaging Revenue by Region (2017-2022) & (USD Million)
    Table 94. Asia-Pacific 3D-IC Packaging Revenue by Region (2023-2028) & (USD Million)
    Table 95. South America 3D-IC Packaging Revenue by Type (2017-2022) & (USD Million)
    Table 96. South America 3D-IC Packaging Revenue by Type (2023-2028) & (USD Million)
    Table 97. South America 3D-IC Packaging Revenue by Application (2017-2022) & (USD Million)
    Table 98. South America 3D-IC Packaging Revenue by Application (2023-2028) & (USD Million)
    Table 99. South America 3D-IC Packaging Revenue by Country (2017-2022) & (USD Million)
    Table 100. South America 3D-IC Packaging Revenue by Country (2023-2028) & (USD Million)
    Table 101. Middle East & Africa 3D-IC Packaging Revenue by Type (2017-2022) & (USD Million)
    Table 102. Middle East & Africa 3D-IC Packaging Revenue by Type (2023-2028) & (USD Million)
    Table 103. Middle East & Africa 3D-IC Packaging Revenue by Application (2017-2022) & (USD Million)
    Table 104. Middle East & Africa 3D-IC Packaging Revenue by Application (2023-2028) & (USD Million)
    Table 105. Middle East & Africa 3D-IC Packaging Revenue by Country (2017-2022) & (USD Million)
    Table 106. Middle East & Africa 3D-IC Packaging Revenue by Country (2023-2028) & (USD Million)
List of Figures
    Figure 1. 3D-IC Packaging Picture
    Figure 2. Global 3D-IC Packaging Revenue Market Share by Type in 2021
    Figure 3. TSV
    Figure 4. TGV
    Figure 5. Silicon Interposer
    Figure 6. 3D-IC Packaging Revenue Market Share by Application in 2021
    Figure 7. Consumer Electronics Picture
    Figure 8. Medical Devices Picture
    Figure 9. Automotive Picture
    Figure 10. Others Picture
    Figure 11. Global 3D-IC Packaging Market Size, (USD Million): 2017 VS 2021 VS 2028
    Figure 12. Global 3D-IC Packaging Revenue and Forecast (2017-2028) & (USD Million)
    Figure 13. Global 3D-IC Packaging Revenue Market Share by Region (2017-2028)
    Figure 14. Global 3D-IC Packaging Revenue Market Share by Region in 2021
    Figure 15. North America 3D-IC Packaging Revenue (USD Million) and Growth Rate (2017-2028)
    Figure 16. Europe 3D-IC Packaging Revenue (USD Million) and Growth Rate (2017-2028)
    Figure 17. Asia-Pacific 3D-IC Packaging Revenue (USD Million) and Growth Rate (2017-2028)
    Figure 18. South America 3D-IC Packaging Revenue (USD Million) and Growth Rate (2017-2028)
    Figure 19. Middle East and Africa 3D-IC Packaging Revenue (USD Million) and Growth Rate (2017-2028)
    Figure 20. 3D-IC Packaging Market Drivers
    Figure 21. 3D-IC Packaging Market Restraints
    Figure 22. 3D-IC Packaging Market Trends
    Figure 23. Synopsys Recent Developments and Future Plans
    Figure 24. Cadence Recent Developments and Future Plans
    Figure 25. XMC Recent Developments and Future Plans
    Figure 26. United Microelectronics Corp Recent Developments and Future Plans
    Figure 27. TSMC Recent Developments and Future Plans
    Figure 28. SPIL Recent Developments and Future Plans
    Figure 29. STMicroelectronics Recent Developments and Future Plans
    Figure 30. ASE Group Recent Developments and Future Plans
    Figure 31. Amkor Technology Recent Developments and Future Plans
    Figure 32. Intel Corporation Recent Developments and Future Plans
    Figure 33. GlobalFoundries Recent Developments and Future Plans
    Figure 34. Invensas Recent Developments and Future Plans
    Figure 35. Toshiba Corporation Recent Developments and Future Plans
    Figure 36. Micron Technology Recent Developments and Future Plans
    Figure 37. Xilinx Recent Developments and Future Plans
    Figure 38. Global 3D-IC Packaging Revenue Share by Players in 2021
    Figure 39. 3D-IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3) in 2021
    Figure 40. Global Top 3 Players 3D-IC Packaging Revenue Market Share in 2021
    Figure 41. Global Top 10 Players 3D-IC Packaging Revenue Market Share in 2021
    Figure 42. Key Players Market Share Trend (Top 3 Market Share: 2020 VS 2021 VS 2022)
    Figure 43. Global 3D-IC Packaging Revenue Share by Type in 2021
    Figure 44. Global 3D-IC Packaging Market Share Forecast by Type (2023-2028)
    Figure 45. Global 3D-IC Packaging Revenue Share by Application in 2021
    Figure 46. Global 3D-IC Packaging Market Share Forecast by Application (2023-2028)
    Figure 47. North America 3D-IC Packaging Sales Market Share by Type (2017-2028)
    Figure 48. North America 3D-IC Packaging Sales Market Share by Application (2017-2028)
    Figure 49. North America 3D-IC Packaging Revenue Market Share by Country (2017-2028)
    Figure 50. United States 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 51. Canada 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 52. Mexico 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 53. Europe 3D-IC Packaging Sales Market Share by Type (2017-2028)
    Figure 54. Europe 3D-IC Packaging Sales Market Share by Application (2017-2028)
    Figure 55. Europe 3D-IC Packaging Revenue Market Share by Country (2017-2028)
    Figure 56. Germany 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 57. France 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 58. United Kingdom 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 59. Russia 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 60. Italy 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 61. Asia-Pacific 3D-IC Packaging Sales Market Share by Type (2017-2028)
    Figure 62. Asia-Pacific 3D-IC Packaging Sales Market Share by Application (2017-2028)
    Figure 63. Asia-Pacific 3D-IC Packaging Revenue Market Share by Region (2017-2028)
    Figure 64. China 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 65. Japan 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 66. South Korea 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 67. India 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 68. Southeast Asia 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 69. Australia 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 70. South America 3D-IC Packaging Sales Market Share by Type (2017-2028)
    Figure 71. South America 3D-IC Packaging Sales Market Share by Application (2017-2028)
    Figure 72. South America 3D-IC Packaging Revenue Market Share by Country (2017-2028)
    Figure 73. Brazil 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 74. Argentina 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 75. Middle East and Africa 3D-IC Packaging Sales Market Share by Type (2017-2028)
    Figure 76. Middle East and Africa 3D-IC Packaging Sales Market Share by Application (2017-2028)
    Figure 77. Middle East and Africa 3D-IC Packaging Revenue Market Share by Country (2017-2028)
    Figure 78. Turkey 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 79. Saudi Arabia 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 80. UAE 3D-IC Packaging Revenue and Growth Rate (2017-2028) & (USD Million)
    Figure 81. Methodology
    Figure 82. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Synopsys
Cadence
XMC
United Microelectronics Corp
TSMC
SPIL
STMicroelectronics
ASE Group
Amkor Technology
Intel Corporation
GlobalFoundries
Invensas
Toshiba Corporation
Micron Technology
Xilinx

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3D-IC Packaging

2.5D and 3D IC Packaging

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