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The global Back Grinding Tapes market size is expected to reach $ 302 million by 2030, rising at a market growth of 5.1% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Back Grinding Tapes market size was valued at USD 213.6 million in 2023 and is forecast to a readjusted size of USD 302 million by 2030 with a CAGR of 5.1% during review period.

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The global Back Grinding Tapes (BGT) market size is expected to reach $ 266.1 million by 2030, rising at a market growth of 4.7% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Wafer Back Grinding Tapes market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

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According to our (Global Info Research) latest study, the global Back Grinding Tapes (BGT) market size was valued at USD 193.1 million in 2023 and is forecast to a readjusted size of USD 266.1 million by 2030 with a CAGR of 4.7% during review period.

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The global Semiconductor Back Grinding Tapes market size is expected to reach $ 158.2 million by 2030, rising at a market growth of 4.0% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Semiconductor Back Grinding Tapes market size was valued at USD 120 million in 2023 and is forecast to a readjusted size of USD 158.2 million by 2030 with a CAGR of 4.0% during review period.

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The global Heat Resistance Back Grinding Tapes market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Back Grinding Tapes for Semiconductor market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

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BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.

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