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The global Solder Ball Mounter (SBM) market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Solder Ball Mounter (SBM) market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

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The global Automatic Solder Ball Mounter market size is expected to reach $ 748.3 million by 2030, rising at a market growth of 4.9% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Automatic Solder Ball Mounter market size was valued at USD 536.1 million in 2023 and is forecast to a readjusted size of USD 748.3 million by 2030 with a CAGR of 4.9% during review period.

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Wafer Level Solder Ball Mounter is a piece of equipment in semiconductor manufacturing, mainly used to permanently connect wafers of different materials. As a part of the back-end engineering of semiconductor production, it is mainly used to perform ball bonding on the electrodes in the chip using bonding metal wires and ceramic cleavers before the wafer is cut, and the wire tails are cut to form protruding electrodes (threads). pillar bump) process. After the ball is planted, the protruding electrodes of the chip are connected through the key flip chip process to form an electronic circuit.

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The global Automatic BGA Solder Ball Mounter market size is expected to reach $ 472.8 million by 2030, rising at a market growth of 5.1% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Automatic BGA Solder Ball Mounter market size was valued at USD 334.4 million in 2023 and is forecast to a readjusted size of USD 472.8 million by 2030 with a CAGR of 5.1% during review period.

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The global Solder Ball Mounter market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

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The global Solder Ball Mounter (SBM) market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

USD4480.00

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The substrate solder ball mounter locates the substrate with image processing technology, applies flux by needle transcription or printing, and then fixes the solder ball in the corresponding position of the substrate. After ball implanting, the substrate is inspected with image processing system and the substrate which is not qualified is put into the scrap box and the qualified product goes to the next process - reflow oven. bga substrate ball implanting machine can be divided into subsystems such as substrate loading device, solder ball supply, needle transcription/printing, ball implanting and substrate transfer part.

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