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The global Thermo Compression Bonder market size is expected to reach $ 270.7 million by 2030, rising at a market growth of 20.1% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Thermo Compression Bonder market size was valued at USD 75 million in 2023 and is forecast to a readjusted size of USD 270.7 million by 2030 with a CAGR of 20.1% during review period.

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The global Manual Thermo Compression Bonder market size is expected to reach $ 10 million by 2030, rising at a market growth of 2.8% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Manual Thermo Compression Bonder market size was valued at USD 8 million in 2023 and is forecast to a readjusted size of USD 10 million by 2030 with a CAGR of 2.8% during review period.

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The global Automatic Thermo Compression Bonder market size is expected to reach $ 75 million by 2030, rising at a market growth of 1.7% CAGR during the forecast period (2024-2030).

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According to our (Global Info Research) latest study, the global Automatic Thermo Compression Bonder market size was valued at USD 67 million in 2023 and is forecast to a readjusted size of USD 75 million by 2030 with a CAGR of 1.7% during review period.

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Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.

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The global Manual Thermo Compression Bonder market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

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Manual Thermo Compression Bonder is Serves both die bonding and flip chip bonding. Compatible with various devices by changing the stage and collet parts. Supports thermo-compression bonding, adhesive bonding, metal eutectic bonding, ultrasonic bonding and various other methods. Most suitable for fabricating and developing prototypes, and collecting condition setting data of mass-production equipment.

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The global Automatic Thermo Compression Bonder market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

USD4480.00

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