Global 3D IC & 2.5D IC Packaging Supply, Demand and Key Producers, 2023-2029

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Published Date: 21 Jan 2023

Category: Electronics & Semiconductor

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs),while a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

This report studies the global 3D IC & 2.5D IC Packaging production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for 3D IC & 2.5D IC Packaging, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of 3D IC & 2.5D IC Packaging that contribute to its increasing demand across many markets.

The global 3D IC & 2.5D IC Packaging market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

Highlights and key features of the study
Global 3D IC & 2.5D IC Packaging total production and demand, 2018-2029, (K Units)
Global 3D IC & 2.5D IC Packaging total production value, 2018-2029, (USD Million)
Global 3D IC & 2.5D IC Packaging production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (K Units)
Global 3D IC & 2.5D IC Packaging consumption by region & country, CAGR, 2018-2029 & (K Units)
U.S. VS China: 3D IC & 2.5D IC Packaging domestic production, consumption, key domestic manufacturers and share
Global 3D IC & 2.5D IC Packaging production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (K Units)
Global 3D IC & 2.5D IC Packaging production by Type, production, value, CAGR, 2018-2029, (USD Million) & (K Units)
Global 3D IC & 2.5D IC Packaging production by Application production, value, CAGR, 2018-2029, (USD Million) & (K Units)
This reports profiles key players in the global 3D IC & 2.5D IC Packaging market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Intel Corporation, Toshiba Corp, Samsung Electronics, Stmicroelectronics, Taiwan Semiconductor Manufacturing, Amkor Technology, United Microelectronics, Broadcom and ASE Group, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World 3D IC & 2.5D IC Packaging market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Units) and average price (USD/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global 3D IC & 2.5D IC Packaging Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global 3D IC & 2.5D IC Packaging Market, Segmentation by Type
    3D TSV
    2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

Global 3D IC & 2.5D IC Packaging Market, Segmentation by Application
    Automotive
    Consumer electronics
    Medical devices
    Military & aerospace
    Telecommunication
    Industrial sector and smart technologies

Companies Profiled:
    Intel Corporation
    Toshiba Corp
    Samsung Electronics
    Stmicroelectronics
    Taiwan Semiconductor Manufacturing
    Amkor Technology
    United Microelectronics
    Broadcom
    ASE Group
    Pure Storage
    Advanced Semiconductor Engineering

Key Questions Answered
1. How big is the global 3D IC & 2.5D IC Packaging market?
2. What is the demand of the global 3D IC & 2.5D IC Packaging market?
3. What is the year over year growth of the global 3D IC & 2.5D IC Packaging market?
4. What is the production and production value of the global 3D IC & 2.5D IC Packaging market?
5. Who are the key producers in the global 3D IC & 2.5D IC Packaging market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 3D IC & 2.5D IC Packaging Introduction
    1.2 World 3D IC & 2.5D IC Packaging Supply & Forecast
        1.2.1 World 3D IC & 2.5D IC Packaging Production Value (2018 & 2022 & 2029)
        1.2.2 World 3D IC & 2.5D IC Packaging Production (2018-2029)
        1.2.3 World 3D IC & 2.5D IC Packaging Pricing Trends (2018-2029)
    1.3 World 3D IC & 2.5D IC Packaging Production by Region (Based on Production Site)
        1.3.1 World 3D IC & 2.5D IC Packaging Production Value by Region (2018-2029)
        1.3.2 World 3D IC & 2.5D IC Packaging Production by Region (2018-2029)
        1.3.3 World 3D IC & 2.5D IC Packaging Average Price by Region (2018-2029)
        1.3.4 North America 3D IC & 2.5D IC Packaging Production (2018-2029)
        1.3.5 Europe 3D IC & 2.5D IC Packaging Production (2018-2029)
        1.3.6 China 3D IC & 2.5D IC Packaging Production (2018-2029)
        1.3.7 Japan 3D IC & 2.5D IC Packaging Production (2018-2029)
        1.3.8 South Korea 3D IC & 2.5D IC Packaging Production (2018-2029)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 3D IC & 2.5D IC Packaging Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 3D IC & 2.5D IC Packaging Major Market Trends
    1.5 Influence of COVID-19 and Russia-Ukraine War
        1.5.1 Influence of COVID-19
        1.5.2 Influence of Russia-Ukraine War

2 Demand Summary
    2.1 World 3D IC & 2.5D IC Packaging Demand (2018-2029)
    2.2 World 3D IC & 2.5D IC Packaging Consumption by Region
        2.2.1 World 3D IC & 2.5D IC Packaging Consumption by Region (2018-2023)
        2.2.2 World 3D IC & 2.5D IC Packaging Consumption Forecast by Region (2024-2029)
    2.3 United States 3D IC & 2.5D IC Packaging Consumption (2018-2029)
    2.4 China 3D IC & 2.5D IC Packaging Consumption (2018-2029)
    2.5 Europe 3D IC & 2.5D IC Packaging Consumption (2018-2029)
    2.6 Japan 3D IC & 2.5D IC Packaging Consumption (2018-2029)
    2.7 South Korea 3D IC & 2.5D IC Packaging Consumption (2018-2029)
    2.8 ASEAN 3D IC & 2.5D IC Packaging Consumption (2018-2029)
    2.9 India 3D IC & 2.5D IC Packaging Consumption (2018-2029)

3 World 3D IC & 2.5D IC Packaging Manufacturers Competitive Analysis
    3.1 World 3D IC & 2.5D IC Packaging Production Value by Manufacturer (2018-2023)
    3.2 World 3D IC & 2.5D IC Packaging Production by Manufacturer (2018-2023)
    3.3 World 3D IC & 2.5D IC Packaging Average Price by Manufacturer (2018-2023)
    3.4 3D IC & 2.5D IC Packaging Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global 3D IC & 2.5D IC Packaging Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for 3D IC & 2.5D IC Packaging in 2022
        3.5.3 Global Concentration Ratios (CR8) for 3D IC & 2.5D IC Packaging in 2022
    3.6 3D IC & 2.5D IC Packaging Market: Overall Company Footprint Analysis
        3.6.1 3D IC & 2.5D IC Packaging Market: Region Footprint
        3.6.2 3D IC & 2.5D IC Packaging Market: Company Product Type Footprint
        3.6.3 3D IC & 2.5D IC Packaging Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: 3D IC & 2.5D IC Packaging Production Value Comparison
        4.1.1 United States VS China: 3D IC & 2.5D IC Packaging Production Value Comparison (2018 & 2022 & 2029)
        4.1.2 United States VS China: 3D IC & 2.5D IC Packaging Production Value Market Share Comparison (2018 & 2022 & 2029)
    4.2 United States VS China: 3D IC & 2.5D IC Packaging Production Comparison
        4.2.1 United States VS China: 3D IC & 2.5D IC Packaging Production Comparison (2018 & 2022 & 2029)
        4.2.2 United States VS China: 3D IC & 2.5D IC Packaging Production Market Share Comparison (2018 & 2022 & 2029)
    4.3 United States VS China: 3D IC & 2.5D IC Packaging Consumption Comparison
        4.3.1 United States VS China: 3D IC & 2.5D IC Packaging Consumption Comparison (2018 & 2022 & 2029)
        4.3.2 United States VS China: 3D IC & 2.5D IC Packaging Consumption Market Share Comparison (2018 & 2022 & 2029)
    4.4 United States Based 3D IC & 2.5D IC Packaging Manufacturers and Market Share, 2018-2023
        4.4.1 United States Based 3D IC & 2.5D IC Packaging Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers 3D IC & 2.5D IC Packaging Production Value (2018-2023)
        4.4.3 United States Based Manufacturers 3D IC & 2.5D IC Packaging Production (2018-2023)
    4.5 China Based 3D IC & 2.5D IC Packaging Manufacturers and Market Share
        4.5.1 China Based 3D IC & 2.5D IC Packaging Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers 3D IC & 2.5D IC Packaging Production Value (2018-2023)
        4.5.3 China Based Manufacturers 3D IC & 2.5D IC Packaging Production (2018-2023)
    4.6 Rest of World Based 3D IC & 2.5D IC Packaging Manufacturers and Market Share, 2018-2023
        4.6.1 Rest of World Based 3D IC & 2.5D IC Packaging Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers 3D IC & 2.5D IC Packaging Production Value (2018-2023)
        4.6.3 Rest of World Based Manufacturers 3D IC & 2.5D IC Packaging Production (2018-2023)

5 Market Analysis by Type
    5.1 World 3D IC & 2.5D IC Packaging Market Size Overview by Type: 2018 VS 2022 VS 2029
    5.2 Segment Introduction by Type
        5.2.1 3D TSV
        5.2.2 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
    5.3 Market Segment by Type
        5.3.1 World 3D IC & 2.5D IC Packaging Production by Type (2018-2029)
        5.3.2 World 3D IC & 2.5D IC Packaging Production Value by Type (2018-2029)
        5.3.3 World 3D IC & 2.5D IC Packaging Average Price by Type (2018-2029)

6 Market Analysis by Application
    6.1 World 3D IC & 2.5D IC Packaging Market Size Overview by Application: 2018 VS 2022 VS 2029
    6.2 Segment Introduction by Application
        6.2.1 Automotive
        6.2.2 Consumer electronics
        6.2.3 Medical devices
        6.2.4 Military & aerospace
        6.2.5 Telecommunication
        6.2.6 Industrial sector and smart technologies
    6.3 Market Segment by Application
        6.3.1 World 3D IC & 2.5D IC Packaging Production by Application (2018-2029)
        6.3.2 World 3D IC & 2.5D IC Packaging Production Value by Application (2018-2029)
        6.3.3 World 3D IC & 2.5D IC Packaging Average Price by Application (2018-2029)

7 Company Profiles
    7.1 Intel Corporation
        7.1.1 Intel Corporation Details
        7.1.2 Intel Corporation Major Business
        7.1.3 Intel Corporation 3D IC & 2.5D IC Packaging Product and Services
        7.1.4 Intel Corporation 3D IC & 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.1.5 Intel Corporation Recent Developments/Updates
        7.1.6 Intel Corporation Competitive Strengths & Weaknesses
    7.2 Toshiba Corp
        7.2.1 Toshiba Corp Details
        7.2.2 Toshiba Corp Major Business
        7.2.3 Toshiba Corp 3D IC & 2.5D IC Packaging Product and Services
        7.2.4 Toshiba Corp 3D IC & 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.2.5 Toshiba Corp Recent Developments/Updates
        7.2.6 Toshiba Corp Competitive Strengths & Weaknesses
    7.3 Samsung Electronics
        7.3.1 Samsung Electronics Details
        7.3.2 Samsung Electronics Major Business
        7.3.3 Samsung Electronics 3D IC & 2.5D IC Packaging Product and Services
        7.3.4 Samsung Electronics 3D IC & 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.3.5 Samsung Electronics Recent Developments/Updates
        7.3.6 Samsung Electronics Competitive Strengths & Weaknesses
    7.4 Stmicroelectronics
        7.4.1 Stmicroelectronics Details
        7.4.2 Stmicroelectronics Major Business
        7.4.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Product and Services
        7.4.4 Stmicroelectronics 3D IC & 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.4.5 Stmicroelectronics Recent Developments/Updates
        7.4.6 Stmicroelectronics Competitive Strengths & Weaknesses
    7.5 Taiwan Semiconductor Manufacturing
        7.5.1 Taiwan Semiconductor Manufacturing Details
        7.5.2 Taiwan Semiconductor Manufacturing Major Business
        7.5.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product and Services
        7.5.4 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.5.5 Taiwan Semiconductor Manufacturing Recent Developments/Updates
        7.5.6 Taiwan Semiconductor Manufacturing Competitive Strengths & Weaknesses
    7.6 Amkor Technology
        7.6.1 Amkor Technology Details
        7.6.2 Amkor Technology Major Business
        7.6.3 Amkor Technology 3D IC & 2.5D IC Packaging Product and Services
        7.6.4 Amkor Technology 3D IC & 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.6.5 Amkor Technology Recent Developments/Updates
        7.6.6 Amkor Technology Competitive Strengths & Weaknesses
    7.7 United Microelectronics
        7.7.1 United Microelectronics Details
        7.7.2 United Microelectronics Major Business
        7.7.3 United Microelectronics 3D IC & 2.5D IC Packaging Product and Services
        7.7.4 United Microelectronics 3D IC & 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.7.5 United Microelectronics Recent Developments/Updates
        7.7.6 United Microelectronics Competitive Strengths & Weaknesses
    7.8 Broadcom
        7.8.1 Broadcom Details
        7.8.2 Broadcom Major Business
        7.8.3 Broadcom 3D IC & 2.5D IC Packaging Product and Services
        7.8.4 Broadcom 3D IC & 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.8.5 Broadcom Recent Developments/Updates
        7.8.6 Broadcom Competitive Strengths & Weaknesses
    7.9 ASE Group
        7.9.1 ASE Group Details
        7.9.2 ASE Group Major Business
        7.9.3 ASE Group 3D IC & 2.5D IC Packaging Product and Services
        7.9.4 ASE Group 3D IC & 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.9.5 ASE Group Recent Developments/Updates
        7.9.6 ASE Group Competitive Strengths & Weaknesses
    7.10 Pure Storage
        7.10.1 Pure Storage Details
        7.10.2 Pure Storage Major Business
        7.10.3 Pure Storage 3D IC & 2.5D IC Packaging Product and Services
        7.10.4 Pure Storage 3D IC & 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.10.5 Pure Storage Recent Developments/Updates
        7.10.6 Pure Storage Competitive Strengths & Weaknesses
    7.11 Advanced Semiconductor Engineering
        7.11.1 Advanced Semiconductor Engineering Details
        7.11.2 Advanced Semiconductor Engineering Major Business
        7.11.3 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product and Services
        7.11.4 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.11.5 Advanced Semiconductor Engineering Recent Developments/Updates
        7.11.6 Advanced Semiconductor Engineering Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 3D IC & 2.5D IC Packaging Industry Chain
    8.2 3D IC & 2.5D IC Packaging Upstream Analysis
        8.2.1 3D IC & 2.5D IC Packaging Core Raw Materials
        8.2.2 Main Manufacturers of 3D IC & 2.5D IC Packaging Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 3D IC & 2.5D IC Packaging Production Mode
    8.6 3D IC & 2.5D IC Packaging Procurement Model
    8.7 3D IC & 2.5D IC Packaging Industry Sales Model and Sales Channels
        8.7.1 3D IC & 2.5D IC Packaging Sales Model
        8.7.2 3D IC & 2.5D IC Packaging Typical Customers

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. World 3D IC & 2.5D IC Packaging Production Value by Region (2018, 2022 and 2029) & (USD Million)
    Table 2. World 3D IC & 2.5D IC Packaging Production Value by Region (2018-2023) & (USD Million)
    Table 3. World 3D IC & 2.5D IC Packaging Production Value by Region (2024-2029) & (USD Million)
    Table 4. World 3D IC & 2.5D IC Packaging Production Value Market Share by Region (2018-2023)
    Table 5. World 3D IC & 2.5D IC Packaging Production Value Market Share by Region (2024-2029)
    Table 6. World 3D IC & 2.5D IC Packaging Production by Region (2018-2023) & (K Units)
    Table 7. World 3D IC & 2.5D IC Packaging Production by Region (2024-2029) & (K Units)
    Table 8. World 3D IC & 2.5D IC Packaging Production Market Share by Region (2018-2023)
    Table 9. World 3D IC & 2.5D IC Packaging Production Market Share by Region (2024-2029)
    Table 10. World 3D IC & 2.5D IC Packaging Average Price by Region (2018-2023) & (USD/Unit)
    Table 11. World 3D IC & 2.5D IC Packaging Average Price by Region (2024-2029) & (USD/Unit)
    Table 12. 3D IC & 2.5D IC Packaging Major Market Trends
    Table 13. World 3D IC & 2.5D IC Packaging Consumption Growth Rate Forecast by Region (2018 & 2022 & 2029) & (K Units)
    Table 14. World 3D IC & 2.5D IC Packaging Consumption by Region (2018-2023) & (K Units)
    Table 15. World 3D IC & 2.5D IC Packaging Consumption Forecast by Region (2024-2029) & (K Units)
    Table 16. World 3D IC & 2.5D IC Packaging Production Value by Manufacturer (2018-2023) & (USD Million)
    Table 17. Production Value Market Share of Key 3D IC & 2.5D IC Packaging Producers in 2022
    Table 18. World 3D IC & 2.5D IC Packaging Production by Manufacturer (2018-2023) & (K Units)
    Table 19. Production Market Share of Key 3D IC & 2.5D IC Packaging Producers in 2022
    Table 20. World 3D IC & 2.5D IC Packaging Average Price by Manufacturer (2018-2023) & (USD/Unit)
    Table 21. Global 3D IC & 2.5D IC Packaging Company Evaluation Quadrant
    Table 22. World 3D IC & 2.5D IC Packaging Industry Rank of Major Manufacturers, Based on Production Value in 2022
    Table 23. Head Office and 3D IC & 2.5D IC Packaging Production Site of Key Manufacturer
    Table 24. 3D IC & 2.5D IC Packaging Market: Company Product Type Footprint
    Table 25. 3D IC & 2.5D IC Packaging Market: Company Product Application Footprint
    Table 26. 3D IC & 2.5D IC Packaging Competitive Factors
    Table 27. 3D IC & 2.5D IC Packaging New Entrant and Capacity Expansion Plans
    Table 28. 3D IC & 2.5D IC Packaging Mergers & Acquisitions Activity
    Table 29. United States VS China 3D IC & 2.5D IC Packaging Production Value Comparison, (2018 & 2022 & 2029) & (USD Million)
    Table 30. United States VS China 3D IC & 2.5D IC Packaging Production Comparison, (2018 & 2022 & 2029) & (K Units)
    Table 31. United States VS China 3D IC & 2.5D IC Packaging Consumption Comparison, (2018 & 2022 & 2029) & (K Units)
    Table 32. United States Based 3D IC & 2.5D IC Packaging Manufacturers, Headquarters and Production Site (States, Country)
    Table 33. United States Based Manufacturers 3D IC & 2.5D IC Packaging Production Value, (2018-2023) & (USD Million)
    Table 34. United States Based Manufacturers 3D IC & 2.5D IC Packaging Production Value Market Share (2018-2023)
    Table 35. United States Based Manufacturers 3D IC & 2.5D IC Packaging Production (2018-2023) & (K Units)
    Table 36. United States Based Manufacturers 3D IC & 2.5D IC Packaging Production Market Share (2018-2023)
    Table 37. China Based 3D IC & 2.5D IC Packaging Manufacturers, Headquarters and Production Site (Province, Country)
    Table 38. China Based Manufacturers 3D IC & 2.5D IC Packaging Production Value, (2018-2023) & (USD Million)
    Table 39. China Based Manufacturers 3D IC & 2.5D IC Packaging Production Value Market Share (2018-2023)
    Table 40. China Based Manufacturers 3D IC & 2.5D IC Packaging Production (2018-2023) & (K Units)
    Table 41. China Based Manufacturers 3D IC & 2.5D IC Packaging Production Market Share (2018-2023)
    Table 42. Rest of World Based 3D IC & 2.5D IC Packaging Manufacturers, Headquarters and Production Site (States, Country)
    Table 43. Rest of World Based Manufacturers 3D IC & 2.5D IC Packaging Production Value, (2018-2023) & (USD Million)
    Table 44. Rest of World Based Manufacturers 3D IC & 2.5D IC Packaging Production Value Market Share (2018-2023)
    Table 45. Rest of World Based Manufacturers 3D IC & 2.5D IC Packaging Production (2018-2023) & (K Units)
    Table 46. Rest of World Based Manufacturers 3D IC & 2.5D IC Packaging Production Market Share (2018-2023)
    Table 47. World 3D IC & 2.5D IC Packaging Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Table 48. World 3D IC & 2.5D IC Packaging Production by Type (2018-2023) & (K Units)
    Table 49. World 3D IC & 2.5D IC Packaging Production by Type (2024-2029) & (K Units)
    Table 50. World 3D IC & 2.5D IC Packaging Production Value by Type (2018-2023) & (USD Million)
    Table 51. World 3D IC & 2.5D IC Packaging Production Value by Type (2024-2029) & (USD Million)
    Table 52. World 3D IC & 2.5D IC Packaging Average Price by Type (2018-2023) & (USD/Unit)
    Table 53. World 3D IC & 2.5D IC Packaging Average Price by Type (2024-2029) & (USD/Unit)
    Table 54. World 3D IC & 2.5D IC Packaging Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Table 55. World 3D IC & 2.5D IC Packaging Production by Application (2018-2023) & (K Units)
    Table 56. World 3D IC & 2.5D IC Packaging Production by Application (2024-2029) & (K Units)
    Table 57. World 3D IC & 2.5D IC Packaging Production Value by Application (2018-2023) & (USD Million)
    Table 58. World 3D IC & 2.5D IC Packaging Production Value by Application (2024-2029) & (USD Million)
    Table 59. World 3D IC & 2.5D IC Packaging Average Price by Application (2018-2023) & (USD/Unit)
    Table 60. World 3D IC & 2.5D IC Packaging Average Price by Application (2024-2029) & (USD/Unit)
    Table 61. Intel Corporation Basic Information, Manufacturing Base and Competitors
    Table 62. Intel Corporation Major Business
    Table 63. Intel Corporation 3D IC & 2.5D IC Packaging Product and Services
    Table 64. Intel Corporation 3D IC & 2.5D IC Packaging Production (K Units), Price (USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 65. Intel Corporation Recent Developments/Updates
    Table 66. Intel Corporation Competitive Strengths & Weaknesses
    Table 67. Toshiba Corp Basic Information, Manufacturing Base and Competitors
    Table 68. Toshiba Corp Major Business
    Table 69. Toshiba Corp 3D IC & 2.5D IC Packaging Product and Services
    Table 70. Toshiba Corp 3D IC & 2.5D IC Packaging Production (K Units), Price (USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 71. Toshiba Corp Recent Developments/Updates
    Table 72. Toshiba Corp Competitive Strengths & Weaknesses
    Table 73. Samsung Electronics Basic Information, Manufacturing Base and Competitors
    Table 74. Samsung Electronics Major Business
    Table 75. Samsung Electronics 3D IC & 2.5D IC Packaging Product and Services
    Table 76. Samsung Electronics 3D IC & 2.5D IC Packaging Production (K Units), Price (USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 77. Samsung Electronics Recent Developments/Updates
    Table 78. Samsung Electronics Competitive Strengths & Weaknesses
    Table 79. Stmicroelectronics Basic Information, Manufacturing Base and Competitors
    Table 80. Stmicroelectronics Major Business
    Table 81. Stmicroelectronics 3D IC & 2.5D IC Packaging Product and Services
    Table 82. Stmicroelectronics 3D IC & 2.5D IC Packaging Production (K Units), Price (USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 83. Stmicroelectronics Recent Developments/Updates
    Table 84. Stmicroelectronics Competitive Strengths & Weaknesses
    Table 85. Taiwan Semiconductor Manufacturing Basic Information, Manufacturing Base and Competitors
    Table 86. Taiwan Semiconductor Manufacturing Major Business
    Table 87. Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product and Services
    Table 88. Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production (K Units), Price (USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 89. Taiwan Semiconductor Manufacturing Recent Developments/Updates
    Table 90. Taiwan Semiconductor Manufacturing Competitive Strengths & Weaknesses
    Table 91. Amkor Technology Basic Information, Manufacturing Base and Competitors
    Table 92. Amkor Technology Major Business
    Table 93. Amkor Technology 3D IC & 2.5D IC Packaging Product and Services
    Table 94. Amkor Technology 3D IC & 2.5D IC Packaging Production (K Units), Price (USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 95. Amkor Technology Recent Developments/Updates
    Table 96. Amkor Technology Competitive Strengths & Weaknesses
    Table 97. United Microelectronics Basic Information, Manufacturing Base and Competitors
    Table 98. United Microelectronics Major Business
    Table 99. United Microelectronics 3D IC & 2.5D IC Packaging Product and Services
    Table 100. United Microelectronics 3D IC & 2.5D IC Packaging Production (K Units), Price (USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 101. United Microelectronics Recent Developments/Updates
    Table 102. United Microelectronics Competitive Strengths & Weaknesses
    Table 103. Broadcom Basic Information, Manufacturing Base and Competitors
    Table 104. Broadcom Major Business
    Table 105. Broadcom 3D IC & 2.5D IC Packaging Product and Services
    Table 106. Broadcom 3D IC & 2.5D IC Packaging Production (K Units), Price (USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 107. Broadcom Recent Developments/Updates
    Table 108. Broadcom Competitive Strengths & Weaknesses
    Table 109. ASE Group Basic Information, Manufacturing Base and Competitors
    Table 110. ASE Group Major Business
    Table 111. ASE Group 3D IC & 2.5D IC Packaging Product and Services
    Table 112. ASE Group 3D IC & 2.5D IC Packaging Production (K Units), Price (USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 113. ASE Group Recent Developments/Updates
    Table 114. ASE Group Competitive Strengths & Weaknesses
    Table 115. Pure Storage Basic Information, Manufacturing Base and Competitors
    Table 116. Pure Storage Major Business
    Table 117. Pure Storage 3D IC & 2.5D IC Packaging Product and Services
    Table 118. Pure Storage 3D IC & 2.5D IC Packaging Production (K Units), Price (USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 119. Pure Storage Recent Developments/Updates
    Table 120. Advanced Semiconductor Engineering Basic Information, Manufacturing Base and Competitors
    Table 121. Advanced Semiconductor Engineering Major Business
    Table 122. Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product and Services
    Table 123. Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Production (K Units), Price (USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 124. Global Key Players of 3D IC & 2.5D IC Packaging Upstream (Raw Materials)
    Table 125. 3D IC & 2.5D IC Packaging Typical Customers
    Table 126. 3D IC & 2.5D IC Packaging Typical Distributors
List of Figure
    Figure 1. 3D IC & 2.5D IC Packaging Picture
    Figure 2. World 3D IC & 2.5D IC Packaging Production Value: 2018 & 2022 & 2029, (USD Million)
    Figure 3. World 3D IC & 2.5D IC Packaging Production Value and Forecast (2018-2029) & (USD Million)
    Figure 4. World 3D IC & 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 5. World 3D IC & 2.5D IC Packaging Average Price (2018-2029) & (USD/Unit)
    Figure 6. World 3D IC & 2.5D IC Packaging Production Value Market Share by Region (2018-2029)
    Figure 7. World 3D IC & 2.5D IC Packaging Production Market Share by Region (2018-2029)
    Figure 8. North America 3D IC & 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 9. Europe 3D IC & 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 10. China 3D IC & 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 11. Japan 3D IC & 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 12. South Korea 3D IC & 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 13. 3D IC & 2.5D IC Packaging Market Drivers
    Figure 14. Factors Affecting Demand
    Figure 15. World 3D IC & 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 16. World 3D IC & 2.5D IC Packaging Consumption Market Share by Region (2018-2029)
    Figure 17. United States 3D IC & 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 18. China 3D IC & 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 19. Europe 3D IC & 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 20. Japan 3D IC & 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 21. South Korea 3D IC & 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 22. ASEAN 3D IC & 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 23. India 3D IC & 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 24. Producer Shipments of 3D IC & 2.5D IC Packaging by Manufacturer Revenue ($MM) and Market Share (%): 2022
    Figure 25. Global Four-firm Concentration Ratios (CR4) for 3D IC & 2.5D IC Packaging Markets in 2022
    Figure 26. Global Four-firm Concentration Ratios (CR8) for 3D IC & 2.5D IC Packaging Markets in 2022
    Figure 27. United States VS China: 3D IC & 2.5D IC Packaging Production Value Market Share Comparison (2018 & 2022 & 2029)
    Figure 28. United States VS China: 3D IC & 2.5D IC Packaging Production Market Share Comparison (2018 & 2022 & 2029)
    Figure 29. United States VS China: 3D IC & 2.5D IC Packaging Consumption Market Share Comparison (2018 & 2022 & 2029)
    Figure 30. United States Based Manufacturers 3D IC & 2.5D IC Packaging Production Market Share 2022
    Figure 31. China Based Manufacturers 3D IC & 2.5D IC Packaging Production Market Share 2022
    Figure 32. Rest of World Based Manufacturers 3D IC & 2.5D IC Packaging Production Market Share 2022
    Figure 33. World 3D IC & 2.5D IC Packaging Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Figure 34. World 3D IC & 2.5D IC Packaging Production Value Market Share by Type in 2022
    Figure 35. 3D TSV
    Figure 36. 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
    Figure 37. World 3D IC & 2.5D IC Packaging Production Market Share by Type (2018-2029)
    Figure 38. World 3D IC & 2.5D IC Packaging Production Value Market Share by Type (2018-2029)
    Figure 39. World 3D IC & 2.5D IC Packaging Average Price by Type (2018-2029) & (USD/Unit)
    Figure 40. World 3D IC & 2.5D IC Packaging Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Figure 41. World 3D IC & 2.5D IC Packaging Production Value Market Share by Application in 2022
    Figure 42. Automotive
    Figure 43. Consumer electronics
    Figure 44. Medical devices
    Figure 45. Military & aerospace
    Figure 46. Telecommunication
    Figure 47. Industrial sector and smart technologies
    Figure 48. World 3D IC & 2.5D IC Packaging Production Market Share by Application (2018-2029)
    Figure 49. World 3D IC & 2.5D IC Packaging Production Value Market Share by Application (2018-2029)
    Figure 50. World 3D IC & 2.5D IC Packaging Average Price by Application (2018-2029) & (USD/Unit)
    Figure 51. 3D IC & 2.5D IC Packaging Industry Chain
    Figure 52. 3D IC & 2.5D IC Packaging Procurement Model
    Figure 53. 3D IC & 2.5D IC Packaging Sales Model
    Figure 54. 3D IC & 2.5D IC Packaging Sales Channels, Direct Sales, and Distribution
    Figure 55. Methodology
    Figure 56. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering

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