Global 2.5D and 3D IC Packaging Market 2023 by Company, Regions, Type and Application, Forecast to 2029

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Published Date: 28 Mar 2023

Category: Electronics & Semiconductor

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Description
Table of Contents
Table of Figures
Research Methodology
Related Reports
Product Tags

Description

According to our (Global Info Research) latest study, the global 2.5D and 3D IC Packaging market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for shortest interconnect and smallest package footprint.

This report is a detailed and comprehensive analysis for global 2.5D and 3D IC Packaging market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.

Key Features:
Global 2.5D and 3D IC Packaging market size and forecasts, in consumption value ($ Million), 2018-2029
Global 2.5D and 3D IC Packaging market size and forecasts by region and country, in consumption value ($ Million), 2018-2029
Global 2.5D and 3D IC Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), 2018-2029
Global 2.5D and 3D IC Packaging market shares of main players, in revenue ($ Million), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for 2.5D and 3D IC Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global 2.5D and 3D IC Packaging market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE Technology, Samsung Electronics, Toshiba, STMicroelectronics and Xilinx, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Market segmentation
2.5D and 3D IC Packaging market is split by Type and by Application. For the period 2018-2029, the growth among segments provide accurate calculations and forecasts for consumption value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
    2.5D
    3D TSV
    3D Wafer-level Chip-scale Packaging

Market segment by Application
    Consumer Electronics
    Medical Devices
    Communications and Telecom
    Automotive
    Other

Market segment by players, this report covers
    ASE Technology
    Samsung Electronics
    Toshiba
    STMicroelectronics
    Xilinx
    Intel
    Micron Technology
    TSMC
    SK Hynix
    Amkor Technology
    GlobalFoundries
    SanDisk (Western Digital)
    Synopsys
    Invensas
    Siliconware Precision Industries
    Jiangsu Changjiang Electronics
    Powertech Technology

Market segment by regions, regional analysis covers
    North America (United States, Canada, and Mexico)
    Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
    South America (Brazil, Argentina and Rest of South America)
    Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe 2.5D and 3D IC Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of 2.5D and 3D IC Packaging, with revenue, gross margin and global market share of 2.5D and 3D IC Packaging from 2018 to 2023.
Chapter 3, the 2.5D and 3D IC Packaging competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2018 to 2029.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2018 to 2023.and 2.5D and 3D IC Packaging market forecast, by regions, type and application, with consumption value, from 2024 to 2029.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War
Chapter 12, the key raw materials and key suppliers, and industry chain of 2.5D and 3D IC Packaging.
Chapter 13, to describe 2.5D and 3D IC Packaging research findings and conclusion.

Table of Contents

1 Market Overview
    1.1 Product Overview and Scope of 2.5D and 3D IC Packaging
    1.2 Market Estimation Caveats and Base Year
    1.3 Classification of 2.5D and 3D IC Packaging by Type
        1.3.1 Overview: Global 2.5D and 3D IC Packaging Market Size by Type: 2018 Versus 2022 Versus 2029
        1.3.2 Global 2.5D and 3D IC Packaging Consumption Value Market Share by Type in 2022
        1.3.3 2.5D
        1.3.4 3D TSV
        1.3.5 3D Wafer-level Chip-scale Packaging
    1.4 Global 2.5D and 3D IC Packaging Market by Application
        1.4.1 Overview: Global 2.5D and 3D IC Packaging Market Size by Application: 2018 Versus 2022 Versus 2029
        1.4.2 Consumer Electronics
        1.4.3 Medical Devices
        1.4.4 Communications and Telecom
        1.4.5 Automotive
        1.4.6 Other
    1.5 Global 2.5D and 3D IC Packaging Market Size & Forecast
    1.6 Global 2.5D and 3D IC Packaging Market Size and Forecast by Region
        1.6.1 Global 2.5D and 3D IC Packaging Market Size by Region: 2018 VS 2022 VS 2029
        1.6.2 Global 2.5D and 3D IC Packaging Market Size by Region, (2018-2029)
        1.6.3 North America 2.5D and 3D IC Packaging Market Size and Prospect (2018-2029)
        1.6.4 Europe 2.5D and 3D IC Packaging Market Size and Prospect (2018-2029)
        1.6.5 Asia-Pacific 2.5D and 3D IC Packaging Market Size and Prospect (2018-2029)
        1.6.6 South America 2.5D and 3D IC Packaging Market Size and Prospect (2018-2029)
        1.6.7 Middle East and Africa 2.5D and 3D IC Packaging Market Size and Prospect (2018-2029)

2 Company Profiles
    2.1 ASE Technology
        2.1.1 ASE Technology Details
        2.1.2 ASE Technology Major Business
        2.1.3 ASE Technology 2.5D and 3D IC Packaging Product and Solutions
        2.1.4 ASE Technology 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.1.5 ASE Technology Recent Developments and Future Plans
    2.2 Samsung Electronics
        2.2.1 Samsung Electronics Details
        2.2.2 Samsung Electronics Major Business
        2.2.3 Samsung Electronics 2.5D and 3D IC Packaging Product and Solutions
        2.2.4 Samsung Electronics 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.2.5 Samsung Electronics Recent Developments and Future Plans
    2.3 Toshiba
        2.3.1 Toshiba Details
        2.3.2 Toshiba Major Business
        2.3.3 Toshiba 2.5D and 3D IC Packaging Product and Solutions
        2.3.4 Toshiba 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.3.5 Toshiba Recent Developments and Future Plans
    2.4 STMicroelectronics
        2.4.1 STMicroelectronics Details
        2.4.2 STMicroelectronics Major Business
        2.4.3 STMicroelectronics 2.5D and 3D IC Packaging Product and Solutions
        2.4.4 STMicroelectronics 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.4.5 STMicroelectronics Recent Developments and Future Plans
    2.5 Xilinx
        2.5.1 Xilinx Details
        2.5.2 Xilinx Major Business
        2.5.3 Xilinx 2.5D and 3D IC Packaging Product and Solutions
        2.5.4 Xilinx 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.5.5 Xilinx Recent Developments and Future Plans
    2.6 Intel
        2.6.1 Intel Details
        2.6.2 Intel Major Business
        2.6.3 Intel 2.5D and 3D IC Packaging Product and Solutions
        2.6.4 Intel 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.6.5 Intel Recent Developments and Future Plans
    2.7 Micron Technology
        2.7.1 Micron Technology Details
        2.7.2 Micron Technology Major Business
        2.7.3 Micron Technology 2.5D and 3D IC Packaging Product and Solutions
        2.7.4 Micron Technology 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.7.5 Micron Technology Recent Developments and Future Plans
    2.8 TSMC
        2.8.1 TSMC Details
        2.8.2 TSMC Major Business
        2.8.3 TSMC 2.5D and 3D IC Packaging Product and Solutions
        2.8.4 TSMC 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.8.5 TSMC Recent Developments and Future Plans
    2.9 SK Hynix
        2.9.1 SK Hynix Details
        2.9.2 SK Hynix Major Business
        2.9.3 SK Hynix 2.5D and 3D IC Packaging Product and Solutions
        2.9.4 SK Hynix 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.9.5 SK Hynix Recent Developments and Future Plans
    2.10 Amkor Technology
        2.10.1 Amkor Technology Details
        2.10.2 Amkor Technology Major Business
        2.10.3 Amkor Technology 2.5D and 3D IC Packaging Product and Solutions
        2.10.4 Amkor Technology 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.10.5 Amkor Technology Recent Developments and Future Plans
    2.11 GlobalFoundries
        2.11.1 GlobalFoundries Details
        2.11.2 GlobalFoundries Major Business
        2.11.3 GlobalFoundries 2.5D and 3D IC Packaging Product and Solutions
        2.11.4 GlobalFoundries 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.11.5 GlobalFoundries Recent Developments and Future Plans
    2.12 SanDisk (Western Digital)
        2.12.1 SanDisk (Western Digital) Details
        2.12.2 SanDisk (Western Digital) Major Business
        2.12.3 SanDisk (Western Digital) 2.5D and 3D IC Packaging Product and Solutions
        2.12.4 SanDisk (Western Digital) 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.12.5 SanDisk (Western Digital) Recent Developments and Future Plans
    2.13 Synopsys
        2.13.1 Synopsys Details
        2.13.2 Synopsys Major Business
        2.13.3 Synopsys 2.5D and 3D IC Packaging Product and Solutions
        2.13.4 Synopsys 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.13.5 Synopsys Recent Developments and Future Plans
    2.14 Invensas
        2.14.1 Invensas Details
        2.14.2 Invensas Major Business
        2.14.3 Invensas 2.5D and 3D IC Packaging Product and Solutions
        2.14.4 Invensas 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.14.5 Invensas Recent Developments and Future Plans
    2.15 Siliconware Precision Industries
        2.15.1 Siliconware Precision Industries Details
        2.15.2 Siliconware Precision Industries Major Business
        2.15.3 Siliconware Precision Industries 2.5D and 3D IC Packaging Product and Solutions
        2.15.4 Siliconware Precision Industries 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.15.5 Siliconware Precision Industries Recent Developments and Future Plans
    2.16 Jiangsu Changjiang Electronics
        2.16.1 Jiangsu Changjiang Electronics Details
        2.16.2 Jiangsu Changjiang Electronics Major Business
        2.16.3 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Product and Solutions
        2.16.4 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.16.5 Jiangsu Changjiang Electronics Recent Developments and Future Plans
    2.17 Powertech Technology
        2.17.1 Powertech Technology Details
        2.17.2 Powertech Technology Major Business
        2.17.3 Powertech Technology 2.5D and 3D IC Packaging Product and Solutions
        2.17.4 Powertech Technology 2.5D and 3D IC Packaging Revenue, Gross Margin and Market Share (2018-2023)
        2.17.5 Powertech Technology Recent Developments and Future Plans

3 Market Competition, by Players
    3.1 Global 2.5D and 3D IC Packaging Revenue and Share by Players (2018-2023)
    3.2 Market Share Analysis (2022)
        3.2.1 Market Share of 2.5D and 3D IC Packaging by Company Revenue
        3.2.2 Top 3 2.5D and 3D IC Packaging Players Market Share in 2022
        3.2.3 Top 6 2.5D and 3D IC Packaging Players Market Share in 2022
    3.3 2.5D and 3D IC Packaging Market: Overall Company Footprint Analysis
        3.3.1 2.5D and 3D IC Packaging Market: Region Footprint
        3.3.2 2.5D and 3D IC Packaging Market: Company Product Type Footprint
        3.3.3 2.5D and 3D IC Packaging Market: Company Product Application Footprint
    3.4 New Market Entrants and Barriers to Market Entry
    3.5 Mergers, Acquisition, Agreements, and Collaborations

4 Market Size Segment by Type
    4.1 Global 2.5D and 3D IC Packaging Consumption Value and Market Share by Type (2018-2023)
    4.2 Global 2.5D and 3D IC Packaging Market Forecast by Type (2024-2029)

5 Market Size Segment by Application
    5.1 Global 2.5D and 3D IC Packaging Consumption Value Market Share by Application (2018-2023)
    5.2 Global 2.5D and 3D IC Packaging Market Forecast by Application (2024-2029)

6 North America
    6.1 North America 2.5D and 3D IC Packaging Consumption Value by Type (2018-2029)
    6.2 North America 2.5D and 3D IC Packaging Consumption Value by Application (2018-2029)
    6.3 North America 2.5D and 3D IC Packaging Market Size by Country
        6.3.1 North America 2.5D and 3D IC Packaging Consumption Value by Country (2018-2029)
        6.3.2 United States 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        6.3.3 Canada 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        6.3.4 Mexico 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)

7 Europe
    7.1 Europe 2.5D and 3D IC Packaging Consumption Value by Type (2018-2029)
    7.2 Europe 2.5D and 3D IC Packaging Consumption Value by Application (2018-2029)
    7.3 Europe 2.5D and 3D IC Packaging Market Size by Country
        7.3.1 Europe 2.5D and 3D IC Packaging Consumption Value by Country (2018-2029)
        7.3.2 Germany 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        7.3.3 France 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        7.3.4 United Kingdom 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        7.3.5 Russia 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        7.3.6 Italy 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)

8 Asia-Pacific
    8.1 Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Type (2018-2029)
    8.2 Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Application (2018-2029)
    8.3 Asia-Pacific 2.5D and 3D IC Packaging Market Size by Region
        8.3.1 Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Region (2018-2029)
        8.3.2 China 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        8.3.3 Japan 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        8.3.4 South Korea 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        8.3.5 India 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        8.3.6 Southeast Asia 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        8.3.7 Australia 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)

9 South America
    9.1 South America 2.5D and 3D IC Packaging Consumption Value by Type (2018-2029)
    9.2 South America 2.5D and 3D IC Packaging Consumption Value by Application (2018-2029)
    9.3 South America 2.5D and 3D IC Packaging Market Size by Country
        9.3.1 South America 2.5D and 3D IC Packaging Consumption Value by Country (2018-2029)
        9.3.2 Brazil 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        9.3.3 Argentina 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)

10 Middle East & Africa
    10.1 Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Type (2018-2029)
    10.2 Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Application (2018-2029)
    10.3 Middle East & Africa 2.5D and 3D IC Packaging Market Size by Country
        10.3.1 Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Country (2018-2029)
        10.3.2 Turkey 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        10.3.3 Saudi Arabia 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)
        10.3.4 UAE 2.5D and 3D IC Packaging Market Size and Forecast (2018-2029)

11 Market Dynamics
    11.1 2.5D and 3D IC Packaging Market Drivers
    11.2 2.5D and 3D IC Packaging Market Restraints
    11.3 2.5D and 3D IC Packaging Trends Analysis
    11.4 Porters Five Forces Analysis
        11.4.1 Threat of New Entrants
        11.4.2 Bargaining Power of Suppliers
        11.4.3 Bargaining Power of Buyers
        11.4.4 Threat of Substitutes
        11.4.5 Competitive Rivalry
    11.5 Influence of COVID-19 and Russia-Ukraine War
        11.5.1 Influence of COVID-19
        11.5.2 Influence of Russia-Ukraine War

12 Industry Chain Analysis
    12.1 2.5D and 3D IC Packaging Industry Chain
    12.2 2.5D and 3D IC Packaging Upstream Analysis
    12.3 2.5D and 3D IC Packaging Midstream Analysis
    12.4 2.5D and 3D IC Packaging Downstream Analysis

13 Research Findings and Conclusion

14 Appendix
    14.1 Methodology
    14.2 Research Process and Data Source
    14.3 Disclaimer

Table of Figures

List of Tables
    Table 1. Global 2.5D and 3D IC Packaging Consumption Value by Type, (USD Million), 2018 & 2022 & 2029
    Table 2. Global 2.5D and 3D IC Packaging Consumption Value by Application, (USD Million), 2018 & 2022 & 2029
    Table 3. Global 2.5D and 3D IC Packaging Consumption Value by Region (2018-2023) & (USD Million)
    Table 4. Global 2.5D and 3D IC Packaging Consumption Value by Region (2024-2029) & (USD Million)
    Table 5. ASE Technology Company Information, Head Office, and Major Competitors
    Table 6. ASE Technology Major Business
    Table 7. ASE Technology 2.5D and 3D IC Packaging Product and Solutions
    Table 8. ASE Technology 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 9. ASE Technology Recent Developments and Future Plans
    Table 10. Samsung Electronics Company Information, Head Office, and Major Competitors
    Table 11. Samsung Electronics Major Business
    Table 12. Samsung Electronics 2.5D and 3D IC Packaging Product and Solutions
    Table 13. Samsung Electronics 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 14. Samsung Electronics Recent Developments and Future Plans
    Table 15. Toshiba Company Information, Head Office, and Major Competitors
    Table 16. Toshiba Major Business
    Table 17. Toshiba 2.5D and 3D IC Packaging Product and Solutions
    Table 18. Toshiba 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 19. Toshiba Recent Developments and Future Plans
    Table 20. STMicroelectronics Company Information, Head Office, and Major Competitors
    Table 21. STMicroelectronics Major Business
    Table 22. STMicroelectronics 2.5D and 3D IC Packaging Product and Solutions
    Table 23. STMicroelectronics 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 24. STMicroelectronics Recent Developments and Future Plans
    Table 25. Xilinx Company Information, Head Office, and Major Competitors
    Table 26. Xilinx Major Business
    Table 27. Xilinx 2.5D and 3D IC Packaging Product and Solutions
    Table 28. Xilinx 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 29. Xilinx Recent Developments and Future Plans
    Table 30. Intel Company Information, Head Office, and Major Competitors
    Table 31. Intel Major Business
    Table 32. Intel 2.5D and 3D IC Packaging Product and Solutions
    Table 33. Intel 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 34. Intel Recent Developments and Future Plans
    Table 35. Micron Technology Company Information, Head Office, and Major Competitors
    Table 36. Micron Technology Major Business
    Table 37. Micron Technology 2.5D and 3D IC Packaging Product and Solutions
    Table 38. Micron Technology 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 39. Micron Technology Recent Developments and Future Plans
    Table 40. TSMC Company Information, Head Office, and Major Competitors
    Table 41. TSMC Major Business
    Table 42. TSMC 2.5D and 3D IC Packaging Product and Solutions
    Table 43. TSMC 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 44. TSMC Recent Developments and Future Plans
    Table 45. SK Hynix Company Information, Head Office, and Major Competitors
    Table 46. SK Hynix Major Business
    Table 47. SK Hynix 2.5D and 3D IC Packaging Product and Solutions
    Table 48. SK Hynix 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 49. SK Hynix Recent Developments and Future Plans
    Table 50. Amkor Technology Company Information, Head Office, and Major Competitors
    Table 51. Amkor Technology Major Business
    Table 52. Amkor Technology 2.5D and 3D IC Packaging Product and Solutions
    Table 53. Amkor Technology 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 54. Amkor Technology Recent Developments and Future Plans
    Table 55. GlobalFoundries Company Information, Head Office, and Major Competitors
    Table 56. GlobalFoundries Major Business
    Table 57. GlobalFoundries 2.5D and 3D IC Packaging Product and Solutions
    Table 58. GlobalFoundries 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 59. GlobalFoundries Recent Developments and Future Plans
    Table 60. SanDisk (Western Digital) Company Information, Head Office, and Major Competitors
    Table 61. SanDisk (Western Digital) Major Business
    Table 62. SanDisk (Western Digital) 2.5D and 3D IC Packaging Product and Solutions
    Table 63. SanDisk (Western Digital) 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 64. SanDisk (Western Digital) Recent Developments and Future Plans
    Table 65. Synopsys Company Information, Head Office, and Major Competitors
    Table 66. Synopsys Major Business
    Table 67. Synopsys 2.5D and 3D IC Packaging Product and Solutions
    Table 68. Synopsys 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 69. Synopsys Recent Developments and Future Plans
    Table 70. Invensas Company Information, Head Office, and Major Competitors
    Table 71. Invensas Major Business
    Table 72. Invensas 2.5D and 3D IC Packaging Product and Solutions
    Table 73. Invensas 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 74. Invensas Recent Developments and Future Plans
    Table 75. Siliconware Precision Industries Company Information, Head Office, and Major Competitors
    Table 76. Siliconware Precision Industries Major Business
    Table 77. Siliconware Precision Industries 2.5D and 3D IC Packaging Product and Solutions
    Table 78. Siliconware Precision Industries 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 79. Siliconware Precision Industries Recent Developments and Future Plans
    Table 80. Jiangsu Changjiang Electronics Company Information, Head Office, and Major Competitors
    Table 81. Jiangsu Changjiang Electronics Major Business
    Table 82. Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Product and Solutions
    Table 83. Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 84. Jiangsu Changjiang Electronics Recent Developments and Future Plans
    Table 85. Powertech Technology Company Information, Head Office, and Major Competitors
    Table 86. Powertech Technology Major Business
    Table 87. Powertech Technology 2.5D and 3D IC Packaging Product and Solutions
    Table 88. Powertech Technology 2.5D and 3D IC Packaging Revenue (USD Million), Gross Margin and Market Share (2018-2023)
    Table 89. Powertech Technology Recent Developments and Future Plans
    Table 90. Global 2.5D and 3D IC Packaging Revenue (USD Million) by Players (2018-2023)
    Table 91. Global 2.5D and 3D IC Packaging Revenue Share by Players (2018-2023)
    Table 92. Breakdown of 2.5D and 3D IC Packaging by Company Type (Tier 1, Tier 2, and Tier 3)
    Table 93. Market Position of Players in 2.5D and 3D IC Packaging, (Tier 1, Tier 2, and Tier 3), Based on Revenue in 2022
    Table 94. Head Office of Key 2.5D and 3D IC Packaging Players
    Table 95. 2.5D and 3D IC Packaging Market: Company Product Type Footprint
    Table 96. 2.5D and 3D IC Packaging Market: Company Product Application Footprint
    Table 97. 2.5D and 3D IC Packaging New Market Entrants and Barriers to Market Entry
    Table 98. 2.5D and 3D IC Packaging Mergers, Acquisition, Agreements, and Collaborations
    Table 99. Global 2.5D and 3D IC Packaging Consumption Value (USD Million) by Type (2018-2023)
    Table 100. Global 2.5D and 3D IC Packaging Consumption Value Share by Type (2018-2023)
    Table 101. Global 2.5D and 3D IC Packaging Consumption Value Forecast by Type (2024-2029)
    Table 102. Global 2.5D and 3D IC Packaging Consumption Value by Application (2018-2023)
    Table 103. Global 2.5D and 3D IC Packaging Consumption Value Forecast by Application (2024-2029)
    Table 104. North America 2.5D and 3D IC Packaging Consumption Value by Type (2018-2023) & (USD Million)
    Table 105. North America 2.5D and 3D IC Packaging Consumption Value by Type (2024-2029) & (USD Million)
    Table 106. North America 2.5D and 3D IC Packaging Consumption Value by Application (2018-2023) & (USD Million)
    Table 107. North America 2.5D and 3D IC Packaging Consumption Value by Application (2024-2029) & (USD Million)
    Table 108. North America 2.5D and 3D IC Packaging Consumption Value by Country (2018-2023) & (USD Million)
    Table 109. North America 2.5D and 3D IC Packaging Consumption Value by Country (2024-2029) & (USD Million)
    Table 110. Europe 2.5D and 3D IC Packaging Consumption Value by Type (2018-2023) & (USD Million)
    Table 111. Europe 2.5D and 3D IC Packaging Consumption Value by Type (2024-2029) & (USD Million)
    Table 112. Europe 2.5D and 3D IC Packaging Consumption Value by Application (2018-2023) & (USD Million)
    Table 113. Europe 2.5D and 3D IC Packaging Consumption Value by Application (2024-2029) & (USD Million)
    Table 114. Europe 2.5D and 3D IC Packaging Consumption Value by Country (2018-2023) & (USD Million)
    Table 115. Europe 2.5D and 3D IC Packaging Consumption Value by Country (2024-2029) & (USD Million)
    Table 116. Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Type (2018-2023) & (USD Million)
    Table 117. Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Type (2024-2029) & (USD Million)
    Table 118. Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Application (2018-2023) & (USD Million)
    Table 119. Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Application (2024-2029) & (USD Million)
    Table 120. Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Region (2018-2023) & (USD Million)
    Table 121. Asia-Pacific 2.5D and 3D IC Packaging Consumption Value by Region (2024-2029) & (USD Million)
    Table 122. South America 2.5D and 3D IC Packaging Consumption Value by Type (2018-2023) & (USD Million)
    Table 123. South America 2.5D and 3D IC Packaging Consumption Value by Type (2024-2029) & (USD Million)
    Table 124. South America 2.5D and 3D IC Packaging Consumption Value by Application (2018-2023) & (USD Million)
    Table 125. South America 2.5D and 3D IC Packaging Consumption Value by Application (2024-2029) & (USD Million)
    Table 126. South America 2.5D and 3D IC Packaging Consumption Value by Country (2018-2023) & (USD Million)
    Table 127. South America 2.5D and 3D IC Packaging Consumption Value by Country (2024-2029) & (USD Million)
    Table 128. Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Type (2018-2023) & (USD Million)
    Table 129. Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Type (2024-2029) & (USD Million)
    Table 130. Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Application (2018-2023) & (USD Million)
    Table 131. Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Application (2024-2029) & (USD Million)
    Table 132. Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Country (2018-2023) & (USD Million)
    Table 133. Middle East & Africa 2.5D and 3D IC Packaging Consumption Value by Country (2024-2029) & (USD Million)
    Table 134. 2.5D and 3D IC Packaging Raw Material
    Table 135. Key Suppliers of 2.5D and 3D IC Packaging Raw Materials
List of Figures
    Figure 1. 2.5D and 3D IC Packaging Picture
    Figure 2. Global 2.5D and 3D IC Packaging Consumption Value by Type, (USD Million), 2018 & 2022 & 2029
    Figure 3. Global 2.5D and 3D IC Packaging Consumption Value Market Share by Type in 2022
    Figure 4. 2.5D
    Figure 5. 3D TSV
    Figure 6. 3D Wafer-level Chip-scale Packaging
    Figure 7. Global 2.5D and 3D IC Packaging Consumption Value by Type, (USD Million), 2018 & 2022 & 2029
    Figure 8. 2.5D and 3D IC Packaging Consumption Value Market Share by Application in 2022
    Figure 9. Consumer Electronics Picture
    Figure 10. Medical Devices Picture
    Figure 11. Communications and Telecom Picture
    Figure 12. Automotive Picture
    Figure 13. Other Picture
    Figure 14. Global 2.5D and 3D IC Packaging Consumption Value, (USD Million): 2018 & 2022 & 2029
    Figure 15. Global 2.5D and 3D IC Packaging Consumption Value and Forecast (2018-2029) & (USD Million)
    Figure 16. Global Market 2.5D and 3D IC Packaging Consumption Value (USD Million) Comparison by Region (2018 & 2022 & 2029)
    Figure 17. Global 2.5D and 3D IC Packaging Consumption Value Market Share by Region (2018-2029)
    Figure 18. Global 2.5D and 3D IC Packaging Consumption Value Market Share by Region in 2022
    Figure 19. North America 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 20. Europe 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 21. Asia-Pacific 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 22. South America 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 23. Middle East and Africa 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 24. Global 2.5D and 3D IC Packaging Revenue Share by Players in 2022
    Figure 25. 2.5D and 3D IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3) in 2022
    Figure 26. Global Top 3 Players 2.5D and 3D IC Packaging Market Share in 2022
    Figure 27. Global Top 6 Players 2.5D and 3D IC Packaging Market Share in 2022
    Figure 28. Global 2.5D and 3D IC Packaging Consumption Value Share by Type (2018-2023)
    Figure 29. Global 2.5D and 3D IC Packaging Market Share Forecast by Type (2024-2029)
    Figure 30. Global 2.5D and 3D IC Packaging Consumption Value Share by Application (2018-2023)
    Figure 31. Global 2.5D and 3D IC Packaging Market Share Forecast by Application (2024-2029)
    Figure 32. North America 2.5D and 3D IC Packaging Consumption Value Market Share by Type (2018-2029)
    Figure 33. North America 2.5D and 3D IC Packaging Consumption Value Market Share by Application (2018-2029)
    Figure 34. North America 2.5D and 3D IC Packaging Consumption Value Market Share by Country (2018-2029)
    Figure 35. United States 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 36. Canada 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 37. Mexico 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 38. Europe 2.5D and 3D IC Packaging Consumption Value Market Share by Type (2018-2029)
    Figure 39. Europe 2.5D and 3D IC Packaging Consumption Value Market Share by Application (2018-2029)
    Figure 40. Europe 2.5D and 3D IC Packaging Consumption Value Market Share by Country (2018-2029)
    Figure 41. Germany 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 42. France 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 43. United Kingdom 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 44. Russia 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 45. Italy 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 46. Asia-Pacific 2.5D and 3D IC Packaging Consumption Value Market Share by Type (2018-2029)
    Figure 47. Asia-Pacific 2.5D and 3D IC Packaging Consumption Value Market Share by Application (2018-2029)
    Figure 48. Asia-Pacific 2.5D and 3D IC Packaging Consumption Value Market Share by Region (2018-2029)
    Figure 49. China 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 50. Japan 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 51. South Korea 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 52. India 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 53. Southeast Asia 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 54. Australia 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 55. South America 2.5D and 3D IC Packaging Consumption Value Market Share by Type (2018-2029)
    Figure 56. South America 2.5D and 3D IC Packaging Consumption Value Market Share by Application (2018-2029)
    Figure 57. South America 2.5D and 3D IC Packaging Consumption Value Market Share by Country (2018-2029)
    Figure 58. Brazil 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 59. Argentina 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 60. Middle East and Africa 2.5D and 3D IC Packaging Consumption Value Market Share by Type (2018-2029)
    Figure 61. Middle East and Africa 2.5D and 3D IC Packaging Consumption Value Market Share by Application (2018-2029)
    Figure 62. Middle East and Africa 2.5D and 3D IC Packaging Consumption Value Market Share by Country (2018-2029)
    Figure 63. Turkey 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 64. Saudi Arabia 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 65. UAE 2.5D and 3D IC Packaging Consumption Value (2018-2029) & (USD Million)
    Figure 66. 2.5D and 3D IC Packaging Market Drivers
    Figure 67. 2.5D and 3D IC Packaging Market Restraints
    Figure 68. 2.5D and 3D IC Packaging Market Trends
    Figure 69. Porters Five Forces Analysis
    Figure 70. Manufacturing Cost Structure Analysis of 2.5D and 3D IC Packaging in 2022
    Figure 71. Manufacturing Process Analysis of 2.5D and 3D IC Packaging
    Figure 72. 2.5D and 3D IC Packaging Industrial Chain
    Figure 73. Methodology
    Figure 74. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

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