Global IC Packaging Substrate Supply, Demand and Key Producers, 2023-2029

Page: 115

Published Date: 09 Feb 2023

Category: Electronics & Semiconductor

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

The global IC Packaging Substrate market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

IC packaging substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging.

This report studies the global IC Packaging Substrate production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for IC Packaging Substrate, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of IC Packaging Substrate that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global IC Packaging Substrate total production and demand, 2018-2029, (K Sqm)
Global IC Packaging Substrate total production value, 2018-2029, (USD Million)
Global IC Packaging Substrate production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (K Sqm)
Global IC Packaging Substrate consumption by region & country, CAGR, 2018-2029 & (K Sqm)
U.S. VS China: IC Packaging Substrate domestic production, consumption, key domestic manufacturers and share
Global IC Packaging Substrate production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (K Sqm)
Global IC Packaging Substrate production by Type, production, value, CAGR, 2018-2029, (USD Million) & (K Sqm)
Global IC Packaging Substrate production by Application production, value, CAGR, 2018-2029, (USD Million) & (K Sqm)
This reports profiles key players in the global IC Packaging Substrate market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Ibiden, Kinsus Interconnect Technology, Unimicron, Shinko Electric Industries, Semco, Simmtech, Nanya, Kyocera and LG Innotek, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World IC Packaging Substrate market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Sqm) and average price (US$/Sqm) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global IC Packaging Substrate Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global IC Packaging Substrate Market, Segmentation by Type
    WB CSP
    FC BGA
    FC CSP
    PBGA
    SiP
    BOC
    Other

Global IC Packaging Substrate Market, Segmentation by Application
    Smart Phones
    PC (Tablet, Laptop)
    Wearable Devices
    Others

Companies Profiled:
    Ibiden
    Kinsus Interconnect Technology
    Unimicron
    Shinko Electric Industries
    Semco
    Simmtech
    Nanya
    Kyocera
    LG Innotek
    AT&S
    ASE
    Daeduck
    Shennan Circuit
    Zhen Ding Technology
    KCC (Korea Circuit Company)
    ACCESS
    Shenzhen Fastprint Circuit Tech
    AKM Meadville
    Toppan Printing

Key Questions Answered
1. How big is the global IC Packaging Substrate market?
2. What is the demand of the global IC Packaging Substrate market?
3. What is the year over year growth of the global IC Packaging Substrate market?
4. What is the production and production value of the global IC Packaging Substrate market?
5. Who are the key producers in the global IC Packaging Substrate market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 IC Packaging Substrate Introduction
    1.2 World IC Packaging Substrate Supply & Forecast
        1.2.1 World IC Packaging Substrate Production Value (2018 & 2022 & 2029)
        1.2.2 World IC Packaging Substrate Production (2018-2029)
        1.2.3 World IC Packaging Substrate Pricing Trends (2018-2029)
    1.3 World IC Packaging Substrate Production by Region (Based on Production Site)
        1.3.1 World IC Packaging Substrate Production Value by Region (2018-2029)
        1.3.2 World IC Packaging Substrate Production by Region (2018-2029)
        1.3.3 World IC Packaging Substrate Average Price by Region (2018-2029)
        1.3.4 North America IC Packaging Substrate Production (2018-2029)
        1.3.5 Europe IC Packaging Substrate Production (2018-2029)
        1.3.6 China IC Packaging Substrate Production (2018-2029)
        1.3.7 Japan IC Packaging Substrate Production (2018-2029)
        1.3.8 South Korea IC Packaging Substrate Production (2018-2029)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 IC Packaging Substrate Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 IC Packaging Substrate Major Market Trends
    1.5 Influence of COVID-19 and Russia-Ukraine War
        1.5.1 Influence of COVID-19
        1.5.2 Influence of Russia-Ukraine War

2 Demand Summary
    2.1 World IC Packaging Substrate Demand (2018-2029)
    2.2 World IC Packaging Substrate Consumption by Region
        2.2.1 World IC Packaging Substrate Consumption by Region (2018-2023)
        2.2.2 World IC Packaging Substrate Consumption Forecast by Region (2024-2029)
    2.3 United States IC Packaging Substrate Consumption (2018-2029)
    2.4 China IC Packaging Substrate Consumption (2018-2029)
    2.5 Europe IC Packaging Substrate Consumption (2018-2029)
    2.6 Japan IC Packaging Substrate Consumption (2018-2029)
    2.7 South Korea IC Packaging Substrate Consumption (2018-2029)
    2.8 ASEAN IC Packaging Substrate Consumption (2018-2029)
    2.9 India IC Packaging Substrate Consumption (2018-2029)

3 World IC Packaging Substrate Manufacturers Competitive Analysis
    3.1 World IC Packaging Substrate Production Value by Manufacturer (2018-2023)
    3.2 World IC Packaging Substrate Production by Manufacturer (2018-2023)
    3.3 World IC Packaging Substrate Average Price by Manufacturer (2018-2023)
    3.4 IC Packaging Substrate Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global IC Packaging Substrate Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for IC Packaging Substrate in 2022
        3.5.3 Global Concentration Ratios (CR8) for IC Packaging Substrate in 2022
    3.6 IC Packaging Substrate Market: Overall Company Footprint Analysis
        3.6.1 IC Packaging Substrate Market: Region Footprint
        3.6.2 IC Packaging Substrate Market: Company Product Type Footprint
        3.6.3 IC Packaging Substrate Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: IC Packaging Substrate Production Value Comparison
        4.1.1 United States VS China: IC Packaging Substrate Production Value Comparison (2018 & 2022 & 2029)
        4.1.2 United States VS China: IC Packaging Substrate Production Value Market Share Comparison (2018 & 2022 & 2029)
    4.2 United States VS China: IC Packaging Substrate Production Comparison
        4.2.1 United States VS China: IC Packaging Substrate Production Comparison (2018 & 2022 & 2029)
        4.2.2 United States VS China: IC Packaging Substrate Production Market Share Comparison (2018 & 2022 & 2029)
    4.3 United States VS China: IC Packaging Substrate Consumption Comparison
        4.3.1 United States VS China: IC Packaging Substrate Consumption Comparison (2018 & 2022 & 2029)
        4.3.2 United States VS China: IC Packaging Substrate Consumption Market Share Comparison (2018 & 2022 & 2029)
    4.4 United States Based IC Packaging Substrate Manufacturers and Market Share, 2018-2023
        4.4.1 United States Based IC Packaging Substrate Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers IC Packaging Substrate Production Value (2018-2023)
        4.4.3 United States Based Manufacturers IC Packaging Substrate Production (2018-2023)
    4.5 China Based IC Packaging Substrate Manufacturers and Market Share
        4.5.1 China Based IC Packaging Substrate Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers IC Packaging Substrate Production Value (2018-2023)
        4.5.3 China Based Manufacturers IC Packaging Substrate Production (2018-2023)
    4.6 Rest of World Based IC Packaging Substrate Manufacturers and Market Share, 2018-2023
        4.6.1 Rest of World Based IC Packaging Substrate Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers IC Packaging Substrate Production Value (2018-2023)
        4.6.3 Rest of World Based Manufacturers IC Packaging Substrate Production (2018-2023)

5 Market Analysis by Type
    5.1 World IC Packaging Substrate Market Size Overview by Type: 2018 VS 2022 VS 2029
    5.2 Segment Introduction by Type
        5.2.1 WB CSP
        5.2.2 FC BGA
        5.2.3 FC CSP
        5.2.4 PBGA
        5.2.5 SiP
        5.2.6 BOC
        5.2.7 Other
    5.3 Market Segment by Type
        5.3.1 World IC Packaging Substrate Production by Type (2018-2029)
        5.3.2 World IC Packaging Substrate Production Value by Type (2018-2029)
        5.3.3 World IC Packaging Substrate Average Price by Type (2018-2029)

6 Market Analysis by Application
    6.1 World IC Packaging Substrate Market Size Overview by Application: 2018 VS 2022 VS 2029
    6.2 Segment Introduction by Application
        6.2.1 Smart Phones
        6.2.2 PC (Tablet, Laptop)
        6.2.3 Wearable Devices
        6.2.4 Others
    6.3 Market Segment by Application
        6.3.1 World IC Packaging Substrate Production by Application (2018-2029)
        6.3.2 World IC Packaging Substrate Production Value by Application (2018-2029)
        6.3.3 World IC Packaging Substrate Average Price by Application (2018-2029)

7 Company Profiles
    7.1 Ibiden
        7.1.1 Ibiden Details
        7.1.2 Ibiden Major Business
        7.1.3 Ibiden IC Packaging Substrate Product and Services
        7.1.4 Ibiden IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.1.5 Ibiden Recent Developments/Updates
        7.1.6 Ibiden Competitive Strengths & Weaknesses
    7.2 Kinsus Interconnect Technology
        7.2.1 Kinsus Interconnect Technology Details
        7.2.2 Kinsus Interconnect Technology Major Business
        7.2.3 Kinsus Interconnect Technology IC Packaging Substrate Product and Services
        7.2.4 Kinsus Interconnect Technology IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.2.5 Kinsus Interconnect Technology Recent Developments/Updates
        7.2.6 Kinsus Interconnect Technology Competitive Strengths & Weaknesses
    7.3 Unimicron
        7.3.1 Unimicron Details
        7.3.2 Unimicron Major Business
        7.3.3 Unimicron IC Packaging Substrate Product and Services
        7.3.4 Unimicron IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.3.5 Unimicron Recent Developments/Updates
        7.3.6 Unimicron Competitive Strengths & Weaknesses
    7.4 Shinko Electric Industries
        7.4.1 Shinko Electric Industries Details
        7.4.2 Shinko Electric Industries Major Business
        7.4.3 Shinko Electric Industries IC Packaging Substrate Product and Services
        7.4.4 Shinko Electric Industries IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.4.5 Shinko Electric Industries Recent Developments/Updates
        7.4.6 Shinko Electric Industries Competitive Strengths & Weaknesses
    7.5 Semco
        7.5.1 Semco Details
        7.5.2 Semco Major Business
        7.5.3 Semco IC Packaging Substrate Product and Services
        7.5.4 Semco IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.5.5 Semco Recent Developments/Updates
        7.5.6 Semco Competitive Strengths & Weaknesses
    7.6 Simmtech
        7.6.1 Simmtech Details
        7.6.2 Simmtech Major Business
        7.6.3 Simmtech IC Packaging Substrate Product and Services
        7.6.4 Simmtech IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.6.5 Simmtech Recent Developments/Updates
        7.6.6 Simmtech Competitive Strengths & Weaknesses
    7.7 Nanya
        7.7.1 Nanya Details
        7.7.2 Nanya Major Business
        7.7.3 Nanya IC Packaging Substrate Product and Services
        7.7.4 Nanya IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.7.5 Nanya Recent Developments/Updates
        7.7.6 Nanya Competitive Strengths & Weaknesses
    7.8 Kyocera
        7.8.1 Kyocera Details
        7.8.2 Kyocera Major Business
        7.8.3 Kyocera IC Packaging Substrate Product and Services
        7.8.4 Kyocera IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.8.5 Kyocera Recent Developments/Updates
        7.8.6 Kyocera Competitive Strengths & Weaknesses
    7.9 LG Innotek
        7.9.1 LG Innotek Details
        7.9.2 LG Innotek Major Business
        7.9.3 LG Innotek IC Packaging Substrate Product and Services
        7.9.4 LG Innotek IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.9.5 LG Innotek Recent Developments/Updates
        7.9.6 LG Innotek Competitive Strengths & Weaknesses
    7.10 AT&S
        7.10.1 AT&S Details
        7.10.2 AT&S Major Business
        7.10.3 AT&S IC Packaging Substrate Product and Services
        7.10.4 AT&S IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.10.5 AT&S Recent Developments/Updates
        7.10.6 AT&S Competitive Strengths & Weaknesses
    7.11 ASE
        7.11.1 ASE Details
        7.11.2 ASE Major Business
        7.11.3 ASE IC Packaging Substrate Product and Services
        7.11.4 ASE IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.11.5 ASE Recent Developments/Updates
        7.11.6 ASE Competitive Strengths & Weaknesses
    7.12 Daeduck
        7.12.1 Daeduck Details
        7.12.2 Daeduck Major Business
        7.12.3 Daeduck IC Packaging Substrate Product and Services
        7.12.4 Daeduck IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.12.5 Daeduck Recent Developments/Updates
        7.12.6 Daeduck Competitive Strengths & Weaknesses
    7.13 Shennan Circuit
        7.13.1 Shennan Circuit Details
        7.13.2 Shennan Circuit Major Business
        7.13.3 Shennan Circuit IC Packaging Substrate Product and Services
        7.13.4 Shennan Circuit IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.13.5 Shennan Circuit Recent Developments/Updates
        7.13.6 Shennan Circuit Competitive Strengths & Weaknesses
    7.14 Zhen Ding Technology
        7.14.1 Zhen Ding Technology Details
        7.14.2 Zhen Ding Technology Major Business
        7.14.3 Zhen Ding Technology IC Packaging Substrate Product and Services
        7.14.4 Zhen Ding Technology IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.14.5 Zhen Ding Technology Recent Developments/Updates
        7.14.6 Zhen Ding Technology Competitive Strengths & Weaknesses
    7.15 KCC (Korea Circuit Company)
        7.15.1 KCC (Korea Circuit Company) Details
        7.15.2 KCC (Korea Circuit Company) Major Business
        7.15.3 KCC (Korea Circuit Company) IC Packaging Substrate Product and Services
        7.15.4 KCC (Korea Circuit Company) IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.15.5 KCC (Korea Circuit Company) Recent Developments/Updates
        7.15.6 KCC (Korea Circuit Company) Competitive Strengths & Weaknesses
    7.16 ACCESS
        7.16.1 ACCESS Details
        7.16.2 ACCESS Major Business
        7.16.3 ACCESS IC Packaging Substrate Product and Services
        7.16.4 ACCESS IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.16.5 ACCESS Recent Developments/Updates
        7.16.6 ACCESS Competitive Strengths & Weaknesses
    7.17 Shenzhen Fastprint Circuit Tech
        7.17.1 Shenzhen Fastprint Circuit Tech Details
        7.17.2 Shenzhen Fastprint Circuit Tech Major Business
        7.17.3 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Product and Services
        7.17.4 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.17.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
        7.17.6 Shenzhen Fastprint Circuit Tech Competitive Strengths & Weaknesses
    7.18 AKM Meadville
        7.18.1 AKM Meadville Details
        7.18.2 AKM Meadville Major Business
        7.18.3 AKM Meadville IC Packaging Substrate Product and Services
        7.18.4 AKM Meadville IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.18.5 AKM Meadville Recent Developments/Updates
        7.18.6 AKM Meadville Competitive Strengths & Weaknesses
    7.19 Toppan Printing
        7.19.1 Toppan Printing Details
        7.19.2 Toppan Printing Major Business
        7.19.3 Toppan Printing IC Packaging Substrate Product and Services
        7.19.4 Toppan Printing IC Packaging Substrate Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.19.5 Toppan Printing Recent Developments/Updates
        7.19.6 Toppan Printing Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 IC Packaging Substrate Industry Chain
    8.2 IC Packaging Substrate Upstream Analysis
        8.2.1 IC Packaging Substrate Core Raw Materials
        8.2.2 Main Manufacturers of IC Packaging Substrate Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 IC Packaging Substrate Production Mode
    8.6 IC Packaging Substrate Procurement Model
    8.7 IC Packaging Substrate Industry Sales Model and Sales Channels
        8.7.1 IC Packaging Substrate Sales Model
        8.7.2 IC Packaging Substrate Typical Customers

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. World IC Packaging Substrate Production Value by Region (2018, 2022 and 2029) & (USD Million)
    Table 2. World IC Packaging Substrate Production Value by Region (2018-2023) & (USD Million)
    Table 3. World IC Packaging Substrate Production Value by Region (2024-2029) & (USD Million)
    Table 4. World IC Packaging Substrate Production Value Market Share by Region (2018-2023)
    Table 5. World IC Packaging Substrate Production Value Market Share by Region (2024-2029)
    Table 6. World IC Packaging Substrate Production by Region (2018-2023) & (K Sqm)
    Table 7. World IC Packaging Substrate Production by Region (2024-2029) & (K Sqm)
    Table 8. World IC Packaging Substrate Production Market Share by Region (2018-2023)
    Table 9. World IC Packaging Substrate Production Market Share by Region (2024-2029)
    Table 10. World IC Packaging Substrate Average Price by Region (2018-2023) & (US$/Sqm)
    Table 11. World IC Packaging Substrate Average Price by Region (2024-2029) & (US$/Sqm)
    Table 12. IC Packaging Substrate Major Market Trends
    Table 13. World IC Packaging Substrate Consumption Growth Rate Forecast by Region (2018 & 2022 & 2029) & (K Sqm)
    Table 14. World IC Packaging Substrate Consumption by Region (2018-2023) & (K Sqm)
    Table 15. World IC Packaging Substrate Consumption Forecast by Region (2024-2029) & (K Sqm)
    Table 16. World IC Packaging Substrate Production Value by Manufacturer (2018-2023) & (USD Million)
    Table 17. Production Value Market Share of Key IC Packaging Substrate Producers in 2022
    Table 18. World IC Packaging Substrate Production by Manufacturer (2018-2023) & (K Sqm)
    Table 19. Production Market Share of Key IC Packaging Substrate Producers in 2022
    Table 20. World IC Packaging Substrate Average Price by Manufacturer (2018-2023) & (US$/Sqm)
    Table 21. Global IC Packaging Substrate Company Evaluation Quadrant
    Table 22. World IC Packaging Substrate Industry Rank of Major Manufacturers, Based on Production Value in 2022
    Table 23. Head Office and IC Packaging Substrate Production Site of Key Manufacturer
    Table 24. IC Packaging Substrate Market: Company Product Type Footprint
    Table 25. IC Packaging Substrate Market: Company Product Application Footprint
    Table 26. IC Packaging Substrate Competitive Factors
    Table 27. IC Packaging Substrate New Entrant and Capacity Expansion Plans
    Table 28. IC Packaging Substrate Mergers & Acquisitions Activity
    Table 29. United States VS China IC Packaging Substrate Production Value Comparison, (2018 & 2022 & 2029) & (USD Million)
    Table 30. United States VS China IC Packaging Substrate Production Comparison, (2018 & 2022 & 2029) & (K Sqm)
    Table 31. United States VS China IC Packaging Substrate Consumption Comparison, (2018 & 2022 & 2029) & (K Sqm)
    Table 32. United States Based IC Packaging Substrate Manufacturers, Headquarters and Production Site (States, Country)
    Table 33. United States Based Manufacturers IC Packaging Substrate Production Value, (2018-2023) & (USD Million)
    Table 34. United States Based Manufacturers IC Packaging Substrate Production Value Market Share (2018-2023)
    Table 35. United States Based Manufacturers IC Packaging Substrate Production (2018-2023) & (K Sqm)
    Table 36. United States Based Manufacturers IC Packaging Substrate Production Market Share (2018-2023)
    Table 37. China Based IC Packaging Substrate Manufacturers, Headquarters and Production Site (Province, Country)
    Table 38. China Based Manufacturers IC Packaging Substrate Production Value, (2018-2023) & (USD Million)
    Table 39. China Based Manufacturers IC Packaging Substrate Production Value Market Share (2018-2023)
    Table 40. China Based Manufacturers IC Packaging Substrate Production (2018-2023) & (K Sqm)
    Table 41. China Based Manufacturers IC Packaging Substrate Production Market Share (2018-2023)
    Table 42. Rest of World Based IC Packaging Substrate Manufacturers, Headquarters and Production Site (States, Country)
    Table 43. Rest of World Based Manufacturers IC Packaging Substrate Production Value, (2018-2023) & (USD Million)
    Table 44. Rest of World Based Manufacturers IC Packaging Substrate Production Value Market Share (2018-2023)
    Table 45. Rest of World Based Manufacturers IC Packaging Substrate Production (2018-2023) & (K Sqm)
    Table 46. Rest of World Based Manufacturers IC Packaging Substrate Production Market Share (2018-2023)
    Table 47. World IC Packaging Substrate Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Table 48. World IC Packaging Substrate Production by Type (2018-2023) & (K Sqm)
    Table 49. World IC Packaging Substrate Production by Type (2024-2029) & (K Sqm)
    Table 50. World IC Packaging Substrate Production Value by Type (2018-2023) & (USD Million)
    Table 51. World IC Packaging Substrate Production Value by Type (2024-2029) & (USD Million)
    Table 52. World IC Packaging Substrate Average Price by Type (2018-2023) & (US$/Sqm)
    Table 53. World IC Packaging Substrate Average Price by Type (2024-2029) & (US$/Sqm)
    Table 54. World IC Packaging Substrate Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Table 55. World IC Packaging Substrate Production by Application (2018-2023) & (K Sqm)
    Table 56. World IC Packaging Substrate Production by Application (2024-2029) & (K Sqm)
    Table 57. World IC Packaging Substrate Production Value by Application (2018-2023) & (USD Million)
    Table 58. World IC Packaging Substrate Production Value by Application (2024-2029) & (USD Million)
    Table 59. World IC Packaging Substrate Average Price by Application (2018-2023) & (US$/Sqm)
    Table 60. World IC Packaging Substrate Average Price by Application (2024-2029) & (US$/Sqm)
    Table 61. Ibiden Basic Information, Manufacturing Base and Competitors
    Table 62. Ibiden Major Business
    Table 63. Ibiden IC Packaging Substrate Product and Services
    Table 64. Ibiden IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 65. Ibiden Recent Developments/Updates
    Table 66. Ibiden Competitive Strengths & Weaknesses
    Table 67. Kinsus Interconnect Technology Basic Information, Manufacturing Base and Competitors
    Table 68. Kinsus Interconnect Technology Major Business
    Table 69. Kinsus Interconnect Technology IC Packaging Substrate Product and Services
    Table 70. Kinsus Interconnect Technology IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 71. Kinsus Interconnect Technology Recent Developments/Updates
    Table 72. Kinsus Interconnect Technology Competitive Strengths & Weaknesses
    Table 73. Unimicron Basic Information, Manufacturing Base and Competitors
    Table 74. Unimicron Major Business
    Table 75. Unimicron IC Packaging Substrate Product and Services
    Table 76. Unimicron IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 77. Unimicron Recent Developments/Updates
    Table 78. Unimicron Competitive Strengths & Weaknesses
    Table 79. Shinko Electric Industries Basic Information, Manufacturing Base and Competitors
    Table 80. Shinko Electric Industries Major Business
    Table 81. Shinko Electric Industries IC Packaging Substrate Product and Services
    Table 82. Shinko Electric Industries IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 83. Shinko Electric Industries Recent Developments/Updates
    Table 84. Shinko Electric Industries Competitive Strengths & Weaknesses
    Table 85. Semco Basic Information, Manufacturing Base and Competitors
    Table 86. Semco Major Business
    Table 87. Semco IC Packaging Substrate Product and Services
    Table 88. Semco IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 89. Semco Recent Developments/Updates
    Table 90. Semco Competitive Strengths & Weaknesses
    Table 91. Simmtech Basic Information, Manufacturing Base and Competitors
    Table 92. Simmtech Major Business
    Table 93. Simmtech IC Packaging Substrate Product and Services
    Table 94. Simmtech IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 95. Simmtech Recent Developments/Updates
    Table 96. Simmtech Competitive Strengths & Weaknesses
    Table 97. Nanya Basic Information, Manufacturing Base and Competitors
    Table 98. Nanya Major Business
    Table 99. Nanya IC Packaging Substrate Product and Services
    Table 100. Nanya IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 101. Nanya Recent Developments/Updates
    Table 102. Nanya Competitive Strengths & Weaknesses
    Table 103. Kyocera Basic Information, Manufacturing Base and Competitors
    Table 104. Kyocera Major Business
    Table 105. Kyocera IC Packaging Substrate Product and Services
    Table 106. Kyocera IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 107. Kyocera Recent Developments/Updates
    Table 108. Kyocera Competitive Strengths & Weaknesses
    Table 109. LG Innotek Basic Information, Manufacturing Base and Competitors
    Table 110. LG Innotek Major Business
    Table 111. LG Innotek IC Packaging Substrate Product and Services
    Table 112. LG Innotek IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 113. LG Innotek Recent Developments/Updates
    Table 114. LG Innotek Competitive Strengths & Weaknesses
    Table 115. AT&S Basic Information, Manufacturing Base and Competitors
    Table 116. AT&S Major Business
    Table 117. AT&S IC Packaging Substrate Product and Services
    Table 118. AT&S IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 119. AT&S Recent Developments/Updates
    Table 120. AT&S Competitive Strengths & Weaknesses
    Table 121. ASE Basic Information, Manufacturing Base and Competitors
    Table 122. ASE Major Business
    Table 123. ASE IC Packaging Substrate Product and Services
    Table 124. ASE IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 125. ASE Recent Developments/Updates
    Table 126. ASE Competitive Strengths & Weaknesses
    Table 127. Daeduck Basic Information, Manufacturing Base and Competitors
    Table 128. Daeduck Major Business
    Table 129. Daeduck IC Packaging Substrate Product and Services
    Table 130. Daeduck IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 131. Daeduck Recent Developments/Updates
    Table 132. Daeduck Competitive Strengths & Weaknesses
    Table 133. Shennan Circuit Basic Information, Manufacturing Base and Competitors
    Table 134. Shennan Circuit Major Business
    Table 135. Shennan Circuit IC Packaging Substrate Product and Services
    Table 136. Shennan Circuit IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 137. Shennan Circuit Recent Developments/Updates
    Table 138. Shennan Circuit Competitive Strengths & Weaknesses
    Table 139. Zhen Ding Technology Basic Information, Manufacturing Base and Competitors
    Table 140. Zhen Ding Technology Major Business
    Table 141. Zhen Ding Technology IC Packaging Substrate Product and Services
    Table 142. Zhen Ding Technology IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 143. Zhen Ding Technology Recent Developments/Updates
    Table 144. Zhen Ding Technology Competitive Strengths & Weaknesses
    Table 145. KCC (Korea Circuit Company) Basic Information, Manufacturing Base and Competitors
    Table 146. KCC (Korea Circuit Company) Major Business
    Table 147. KCC (Korea Circuit Company) IC Packaging Substrate Product and Services
    Table 148. KCC (Korea Circuit Company) IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 149. KCC (Korea Circuit Company) Recent Developments/Updates
    Table 150. KCC (Korea Circuit Company) Competitive Strengths & Weaknesses
    Table 151. ACCESS Basic Information, Manufacturing Base and Competitors
    Table 152. ACCESS Major Business
    Table 153. ACCESS IC Packaging Substrate Product and Services
    Table 154. ACCESS IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 155. ACCESS Recent Developments/Updates
    Table 156. ACCESS Competitive Strengths & Weaknesses
    Table 157. Shenzhen Fastprint Circuit Tech Basic Information, Manufacturing Base and Competitors
    Table 158. Shenzhen Fastprint Circuit Tech Major Business
    Table 159. Shenzhen Fastprint Circuit Tech IC Packaging Substrate Product and Services
    Table 160. Shenzhen Fastprint Circuit Tech IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 161. Shenzhen Fastprint Circuit Tech Recent Developments/Updates
    Table 162. Shenzhen Fastprint Circuit Tech Competitive Strengths & Weaknesses
    Table 163. AKM Meadville Basic Information, Manufacturing Base and Competitors
    Table 164. AKM Meadville Major Business
    Table 165. AKM Meadville IC Packaging Substrate Product and Services
    Table 166. AKM Meadville IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 167. AKM Meadville Recent Developments/Updates
    Table 168. Toppan Printing Basic Information, Manufacturing Base and Competitors
    Table 169. Toppan Printing Major Business
    Table 170. Toppan Printing IC Packaging Substrate Product and Services
    Table 171. Toppan Printing IC Packaging Substrate Production (K Sqm), Price (US$/Sqm), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 172. Global Key Players of IC Packaging Substrate Upstream (Raw Materials)
    Table 173. IC Packaging Substrate Typical Customers
    Table 174. IC Packaging Substrate Typical Distributors
List of Figure
    Figure 1. IC Packaging Substrate Picture
    Figure 2. World IC Packaging Substrate Production Value: 2018 & 2022 & 2029, (USD Million)
    Figure 3. World IC Packaging Substrate Production Value and Forecast (2018-2029) & (USD Million)
    Figure 4. World IC Packaging Substrate Production (2018-2029) & (K Sqm)
    Figure 5. World IC Packaging Substrate Average Price (2018-2029) & (US$/Sqm)
    Figure 6. World IC Packaging Substrate Production Value Market Share by Region (2018-2029)
    Figure 7. World IC Packaging Substrate Production Market Share by Region (2018-2029)
    Figure 8. North America IC Packaging Substrate Production (2018-2029) & (K Sqm)
    Figure 9. Europe IC Packaging Substrate Production (2018-2029) & (K Sqm)
    Figure 10. China IC Packaging Substrate Production (2018-2029) & (K Sqm)
    Figure 11. Japan IC Packaging Substrate Production (2018-2029) & (K Sqm)
    Figure 12. South Korea IC Packaging Substrate Production (2018-2029) & (K Sqm)
    Figure 13. IC Packaging Substrate Market Drivers
    Figure 14. Factors Affecting Demand
    Figure 15. World IC Packaging Substrate Consumption (2018-2029) & (K Sqm)
    Figure 16. World IC Packaging Substrate Consumption Market Share by Region (2018-2029)
    Figure 17. United States IC Packaging Substrate Consumption (2018-2029) & (K Sqm)
    Figure 18. China IC Packaging Substrate Consumption (2018-2029) & (K Sqm)
    Figure 19. Europe IC Packaging Substrate Consumption (2018-2029) & (K Sqm)
    Figure 20. Japan IC Packaging Substrate Consumption (2018-2029) & (K Sqm)
    Figure 21. South Korea IC Packaging Substrate Consumption (2018-2029) & (K Sqm)
    Figure 22. ASEAN IC Packaging Substrate Consumption (2018-2029) & (K Sqm)
    Figure 23. India IC Packaging Substrate Consumption (2018-2029) & (K Sqm)
    Figure 24. Producer Shipments of IC Packaging Substrate by Manufacturer Revenue ($MM) and Market Share (%): 2022
    Figure 25. Global Four-firm Concentration Ratios (CR4) for IC Packaging Substrate Markets in 2022
    Figure 26. Global Four-firm Concentration Ratios (CR8) for IC Packaging Substrate Markets in 2022
    Figure 27. United States VS China: IC Packaging Substrate Production Value Market Share Comparison (2018 & 2022 & 2029)
    Figure 28. United States VS China: IC Packaging Substrate Production Market Share Comparison (2018 & 2022 & 2029)
    Figure 29. United States VS China: IC Packaging Substrate Consumption Market Share Comparison (2018 & 2022 & 2029)
    Figure 30. United States Based Manufacturers IC Packaging Substrate Production Market Share 2022
    Figure 31. China Based Manufacturers IC Packaging Substrate Production Market Share 2022
    Figure 32. Rest of World Based Manufacturers IC Packaging Substrate Production Market Share 2022
    Figure 33. World IC Packaging Substrate Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Figure 34. World IC Packaging Substrate Production Value Market Share by Type in 2022
    Figure 35. WB CSP
    Figure 36. FC BGA
    Figure 37. FC CSP
    Figure 38. PBGA
    Figure 39. SiP
    Figure 40. BOC
    Figure 41. Other
    Figure 42. World IC Packaging Substrate Production Market Share by Type (2018-2029)
    Figure 43. World IC Packaging Substrate Production Value Market Share by Type (2018-2029)
    Figure 44. World IC Packaging Substrate Average Price by Type (2018-2029) & (US$/Sqm)
    Figure 45. World IC Packaging Substrate Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Figure 46. World IC Packaging Substrate Production Value Market Share by Application in 2022
    Figure 47. Smart Phones
    Figure 48. PC (Tablet, Laptop)
    Figure 49. Wearable Devices
    Figure 50. Others
    Figure 51. World IC Packaging Substrate Production Market Share by Application (2018-2029)
    Figure 52. World IC Packaging Substrate Production Value Market Share by Application (2018-2029)
    Figure 53. World IC Packaging Substrate Average Price by Application (2018-2029) & (US$/Sqm)
    Figure 54. IC Packaging Substrate Industry Chain
    Figure 55. IC Packaging Substrate Procurement Model
    Figure 56. IC Packaging Substrate Sales Model
    Figure 57. IC Packaging Substrate Sales Channels, Direct Sales, and Distribution
    Figure 58. Methodology
    Figure 59. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Ibiden
Kinsus Interconnect Technology
Unimicron
Shinko Electric Industries
Semco
Simmtech
Nanya
Kyocera
LG Innotek
AT&S
ASE
Daeduck
Shennan Circuit
Zhen Ding Technology
KCC (Korea Circuit Company)
ACCESS
Shenzhen Fastprint Circuit Tech
AKM Meadville
Toppan Printing

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Product Tags

ic packaging substrate sub

ic packaging substrate

IC Packaging Substrate (SUB)

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