Global 3D IC and 2.5D IC Packaging Supply, Demand and Key Producers, 2023-2029

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Published Date: 20 Apr 2023

Category: Electronics & Semiconductor

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags

Description

The global 3D IC and 2.5D IC Packaging market size is expected to reach $ 263040 million by 2029, rising at a market growth of 14.3% CAGR during the forecast period (2023-2029).

This report studies the global 3D IC and 2.5D IC Packaging production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for 3D IC and 2.5D IC Packaging, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of 3D IC and 2.5D IC Packaging that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global 3D IC and 2.5D IC Packaging total production and demand, 2018-2029, (K Units)
Global 3D IC and 2.5D IC Packaging total production value, 2018-2029, (USD Million)
Global 3D IC and 2.5D IC Packaging production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (K Units)
Global 3D IC and 2.5D IC Packaging consumption by region & country, CAGR, 2018-2029 & (K Units)
U.S. VS China: 3D IC and 2.5D IC Packaging domestic production, consumption, key domestic manufacturers and share
Global 3D IC and 2.5D IC Packaging production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (K Units)
Global 3D IC and 2.5D IC Packaging production by Type, production, value, CAGR, 2018-2029, (USD Million) & (K Units)
Global 3D IC and 2.5D IC Packaging production by Application production, value, CAGR, 2018-2029, (USD Million) & (K Units)
This reports profiles key players in the global 3D IC and 2.5D IC Packaging market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Taiwan Semiconductor, Samsung Electronics, Toshiba Corp, Advanced Semiconductor Engineering and Amkor Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World 3D IC and 2.5D IC Packaging market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Units) and average price (K USD/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global 3D IC and 2.5D IC Packaging Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global 3D IC and 2.5D IC Packaging Market, Segmentation by Type
    3D Wafer-level Chip-scale Packaging
    3D TSV
    2.5D

Global 3D IC and 2.5D IC Packaging Market, Segmentation by Application
    Logic
    Imaging & Optoelectronics
    Memory
    MEMS/Sensors
    LED
    Power

Companies Profiled:
    Taiwan Semiconductor
    Samsung Electronics
    Toshiba Corp
    Advanced Semiconductor Engineering
    Amkor Technology

Key Questions Answered
1. How big is the global 3D IC and 2.5D IC Packaging market?
2. What is the demand of the global 3D IC and 2.5D IC Packaging market?
3. What is the year over year growth of the global 3D IC and 2.5D IC Packaging market?
4. What is the production and production value of the global 3D IC and 2.5D IC Packaging market?
5. Who are the key producers in the global 3D IC and 2.5D IC Packaging market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 3D IC and 2.5D IC Packaging Introduction
    1.2 World 3D IC and 2.5D IC Packaging Supply & Forecast
        1.2.1 World 3D IC and 2.5D IC Packaging Production Value (2018 & 2022 & 2029)
        1.2.2 World 3D IC and 2.5D IC Packaging Production (2018-2029)
        1.2.3 World 3D IC and 2.5D IC Packaging Pricing Trends (2018-2029)
    1.3 World 3D IC and 2.5D IC Packaging Production by Region (Based on Production Site)
        1.3.1 World 3D IC and 2.5D IC Packaging Production Value by Region (2018-2029)
        1.3.2 World 3D IC and 2.5D IC Packaging Production by Region (2018-2029)
        1.3.3 World 3D IC and 2.5D IC Packaging Average Price by Region (2018-2029)
        1.3.4 North America 3D IC and 2.5D IC Packaging Production (2018-2029)
        1.3.5 Europe 3D IC and 2.5D IC Packaging Production (2018-2029)
        1.3.6 China 3D IC and 2.5D IC Packaging Production (2018-2029)
        1.3.7 Japan 3D IC and 2.5D IC Packaging Production (2018-2029)
        1.3.8 South Korea 3D IC and 2.5D IC Packaging Production (2018-2029)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 3D IC and 2.5D IC Packaging Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 3D IC and 2.5D IC Packaging Major Market Trends
    1.5 Influence of COVID-19 and Russia-Ukraine War
        1.5.1 Influence of COVID-19
        1.5.2 Influence of Russia-Ukraine War

2 Demand Summary
    2.1 World 3D IC and 2.5D IC Packaging Demand (2018-2029)
    2.2 World 3D IC and 2.5D IC Packaging Consumption by Region
        2.2.1 World 3D IC and 2.5D IC Packaging Consumption by Region (2018-2023)
        2.2.2 World 3D IC and 2.5D IC Packaging Consumption Forecast by Region (2024-2029)
    2.3 United States 3D IC and 2.5D IC Packaging Consumption (2018-2029)
    2.4 China 3D IC and 2.5D IC Packaging Consumption (2018-2029)
    2.5 Europe 3D IC and 2.5D IC Packaging Consumption (2018-2029)
    2.6 Japan 3D IC and 2.5D IC Packaging Consumption (2018-2029)
    2.7 South Korea 3D IC and 2.5D IC Packaging Consumption (2018-2029)
    2.8 ASEAN 3D IC and 2.5D IC Packaging Consumption (2018-2029)
    2.9 India 3D IC and 2.5D IC Packaging Consumption (2018-2029)

3 World 3D IC and 2.5D IC Packaging Manufacturers Competitive Analysis
    3.1 World 3D IC and 2.5D IC Packaging Production Value by Manufacturer (2018-2023)
    3.2 World 3D IC and 2.5D IC Packaging Production by Manufacturer (2018-2023)
    3.3 World 3D IC and 2.5D IC Packaging Average Price by Manufacturer (2018-2023)
    3.4 3D IC and 2.5D IC Packaging Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global 3D IC and 2.5D IC Packaging Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for 3D IC and 2.5D IC Packaging in 2022
        3.5.3 Global Concentration Ratios (CR8) for 3D IC and 2.5D IC Packaging in 2022
    3.6 3D IC and 2.5D IC Packaging Market: Overall Company Footprint Analysis
        3.6.1 3D IC and 2.5D IC Packaging Market: Region Footprint
        3.6.2 3D IC and 2.5D IC Packaging Market: Company Product Type Footprint
        3.6.3 3D IC and 2.5D IC Packaging Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: 3D IC and 2.5D IC Packaging Production Value Comparison
        4.1.1 United States VS China: 3D IC and 2.5D IC Packaging Production Value Comparison (2018 & 2022 & 2029)
        4.1.2 United States VS China: 3D IC and 2.5D IC Packaging Production Value Market Share Comparison (2018 & 2022 & 2029)
    4.2 United States VS China: 3D IC and 2.5D IC Packaging Production Comparison
        4.2.1 United States VS China: 3D IC and 2.5D IC Packaging Production Comparison (2018 & 2022 & 2029)
        4.2.2 United States VS China: 3D IC and 2.5D IC Packaging Production Market Share Comparison (2018 & 2022 & 2029)
    4.3 United States VS China: 3D IC and 2.5D IC Packaging Consumption Comparison
        4.3.1 United States VS China: 3D IC and 2.5D IC Packaging Consumption Comparison (2018 & 2022 & 2029)
        4.3.2 United States VS China: 3D IC and 2.5D IC Packaging Consumption Market Share Comparison (2018 & 2022 & 2029)
    4.4 United States Based 3D IC and 2.5D IC Packaging Manufacturers and Market Share, 2018-2023
        4.4.1 United States Based 3D IC and 2.5D IC Packaging Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers 3D IC and 2.5D IC Packaging Production Value (2018-2023)
        4.4.3 United States Based Manufacturers 3D IC and 2.5D IC Packaging Production (2018-2023)
    4.5 China Based 3D IC and 2.5D IC Packaging Manufacturers and Market Share
        4.5.1 China Based 3D IC and 2.5D IC Packaging Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers 3D IC and 2.5D IC Packaging Production Value (2018-2023)
        4.5.3 China Based Manufacturers 3D IC and 2.5D IC Packaging Production (2018-2023)
    4.6 Rest of World Based 3D IC and 2.5D IC Packaging Manufacturers and Market Share, 2018-2023
        4.6.1 Rest of World Based 3D IC and 2.5D IC Packaging Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers 3D IC and 2.5D IC Packaging Production Value (2018-2023)
        4.6.3 Rest of World Based Manufacturers 3D IC and 2.5D IC Packaging Production (2018-2023)

5 Market Analysis by Type
    5.1 World 3D IC and 2.5D IC Packaging Market Size Overview by Type: 2018 VS 2022 VS 2029
    5.2 Segment Introduction by Type
        5.2.1 3D Wafer-level Chip-scale Packaging
        5.2.2 3D TSV
        5.2.3 2.5D
    5.3 Market Segment by Type
        5.3.1 World 3D IC and 2.5D IC Packaging Production by Type (2018-2029)
        5.3.2 World 3D IC and 2.5D IC Packaging Production Value by Type (2018-2029)
        5.3.3 World 3D IC and 2.5D IC Packaging Average Price by Type (2018-2029)

6 Market Analysis by Application
    6.1 World 3D IC and 2.5D IC Packaging Market Size Overview by Application: 2018 VS 2022 VS 2029
    6.2 Segment Introduction by Application
        6.2.1 Logic
        6.2.2 Imaging & Optoelectronics
        6.2.3 Memory
        6.2.4 MEMS/Sensors
        6.2.5 LED
        6.2.6 Power
    6.3 Market Segment by Application
        6.3.1 World 3D IC and 2.5D IC Packaging Production by Application (2018-2029)
        6.3.2 World 3D IC and 2.5D IC Packaging Production Value by Application (2018-2029)
        6.3.3 World 3D IC and 2.5D IC Packaging Average Price by Application (2018-2029)

7 Company Profiles
    7.1 Taiwan Semiconductor
        7.1.1 Taiwan Semiconductor Details
        7.1.2 Taiwan Semiconductor Major Business
        7.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product and Services
        7.1.4 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.1.5 Taiwan Semiconductor Recent Developments/Updates
        7.1.6 Taiwan Semiconductor Competitive Strengths & Weaknesses
    7.2 Samsung Electronics
        7.2.1 Samsung Electronics Details
        7.2.2 Samsung Electronics Major Business
        7.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Product and Services
        7.2.4 Samsung Electronics 3D IC and 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.2.5 Samsung Electronics Recent Developments/Updates
        7.2.6 Samsung Electronics Competitive Strengths & Weaknesses
    7.3 Toshiba Corp
        7.3.1 Toshiba Corp Details
        7.3.2 Toshiba Corp Major Business
        7.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Product and Services
        7.3.4 Toshiba Corp 3D IC and 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.3.5 Toshiba Corp Recent Developments/Updates
        7.3.6 Toshiba Corp Competitive Strengths & Weaknesses
    7.4 Advanced Semiconductor Engineering
        7.4.1 Advanced Semiconductor Engineering Details
        7.4.2 Advanced Semiconductor Engineering Major Business
        7.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product and Services
        7.4.4 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.4.5 Advanced Semiconductor Engineering Recent Developments/Updates
        7.4.6 Advanced Semiconductor Engineering Competitive Strengths & Weaknesses
    7.5 Amkor Technology
        7.5.1 Amkor Technology Details
        7.5.2 Amkor Technology Major Business
        7.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Product and Services
        7.5.4 Amkor Technology 3D IC and 2.5D IC Packaging Production, Price, Value, Gross Margin and Market Share (2018-2023)
        7.5.5 Amkor Technology Recent Developments/Updates
        7.5.6 Amkor Technology Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 3D IC and 2.5D IC Packaging Industry Chain
    8.2 3D IC and 2.5D IC Packaging Upstream Analysis
        8.2.1 3D IC and 2.5D IC Packaging Core Raw Materials
        8.2.2 Main Manufacturers of 3D IC and 2.5D IC Packaging Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 3D IC and 2.5D IC Packaging Production Mode
    8.6 3D IC and 2.5D IC Packaging Procurement Model
    8.7 3D IC and 2.5D IC Packaging Industry Sales Model and Sales Channels
        8.7.1 3D IC and 2.5D IC Packaging Sales Model
        8.7.2 3D IC and 2.5D IC Packaging Typical Customers

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. World 3D IC and 2.5D IC Packaging Production Value by Region (2018, 2022 and 2029) & (USD Million)
    Table 2. World 3D IC and 2.5D IC Packaging Production Value by Region (2018-2023) & (USD Million)
    Table 3. World 3D IC and 2.5D IC Packaging Production Value by Region (2024-2029) & (USD Million)
    Table 4. World 3D IC and 2.5D IC Packaging Production Value Market Share by Region (2018-2023)
    Table 5. World 3D IC and 2.5D IC Packaging Production Value Market Share by Region (2024-2029)
    Table 6. World 3D IC and 2.5D IC Packaging Production by Region (2018-2023) & (K Units)
    Table 7. World 3D IC and 2.5D IC Packaging Production by Region (2024-2029) & (K Units)
    Table 8. World 3D IC and 2.5D IC Packaging Production Market Share by Region (2018-2023)
    Table 9. World 3D IC and 2.5D IC Packaging Production Market Share by Region (2024-2029)
    Table 10. World 3D IC and 2.5D IC Packaging Average Price by Region (2018-2023) & (K USD/Unit)
    Table 11. World 3D IC and 2.5D IC Packaging Average Price by Region (2024-2029) & (K USD/Unit)
    Table 12. 3D IC and 2.5D IC Packaging Major Market Trends
    Table 13. World 3D IC and 2.5D IC Packaging Consumption Growth Rate Forecast by Region (2018 & 2022 & 2029) & (K Units)
    Table 14. World 3D IC and 2.5D IC Packaging Consumption by Region (2018-2023) & (K Units)
    Table 15. World 3D IC and 2.5D IC Packaging Consumption Forecast by Region (2024-2029) & (K Units)
    Table 16. World 3D IC and 2.5D IC Packaging Production Value by Manufacturer (2018-2023) & (USD Million)
    Table 17. Production Value Market Share of Key 3D IC and 2.5D IC Packaging Producers in 2022
    Table 18. World 3D IC and 2.5D IC Packaging Production by Manufacturer (2018-2023) & (K Units)
    Table 19. Production Market Share of Key 3D IC and 2.5D IC Packaging Producers in 2022
    Table 20. World 3D IC and 2.5D IC Packaging Average Price by Manufacturer (2018-2023) & (K USD/Unit)
    Table 21. Global 3D IC and 2.5D IC Packaging Company Evaluation Quadrant
    Table 22. World 3D IC and 2.5D IC Packaging Industry Rank of Major Manufacturers, Based on Production Value in 2022
    Table 23. Head Office and 3D IC and 2.5D IC Packaging Production Site of Key Manufacturer
    Table 24. 3D IC and 2.5D IC Packaging Market: Company Product Type Footprint
    Table 25. 3D IC and 2.5D IC Packaging Market: Company Product Application Footprint
    Table 26. 3D IC and 2.5D IC Packaging Competitive Factors
    Table 27. 3D IC and 2.5D IC Packaging New Entrant and Capacity Expansion Plans
    Table 28. 3D IC and 2.5D IC Packaging Mergers & Acquisitions Activity
    Table 29. United States VS China 3D IC and 2.5D IC Packaging Production Value Comparison, (2018 & 2022 & 2029) & (USD Million)
    Table 30. United States VS China 3D IC and 2.5D IC Packaging Production Comparison, (2018 & 2022 & 2029) & (K Units)
    Table 31. United States VS China 3D IC and 2.5D IC Packaging Consumption Comparison, (2018 & 2022 & 2029) & (K Units)
    Table 32. United States Based 3D IC and 2.5D IC Packaging Manufacturers, Headquarters and Production Site (States, Country)
    Table 33. United States Based Manufacturers 3D IC and 2.5D IC Packaging Production Value, (2018-2023) & (USD Million)
    Table 34. United States Based Manufacturers 3D IC and 2.5D IC Packaging Production Value Market Share (2018-2023)
    Table 35. United States Based Manufacturers 3D IC and 2.5D IC Packaging Production (2018-2023) & (K Units)
    Table 36. United States Based Manufacturers 3D IC and 2.5D IC Packaging Production Market Share (2018-2023)
    Table 37. China Based 3D IC and 2.5D IC Packaging Manufacturers, Headquarters and Production Site (Province, Country)
    Table 38. China Based Manufacturers 3D IC and 2.5D IC Packaging Production Value, (2018-2023) & (USD Million)
    Table 39. China Based Manufacturers 3D IC and 2.5D IC Packaging Production Value Market Share (2018-2023)
    Table 40. China Based Manufacturers 3D IC and 2.5D IC Packaging Production (2018-2023) & (K Units)
    Table 41. China Based Manufacturers 3D IC and 2.5D IC Packaging Production Market Share (2018-2023)
    Table 42. Rest of World Based 3D IC and 2.5D IC Packaging Manufacturers, Headquarters and Production Site (States, Country)
    Table 43. Rest of World Based Manufacturers 3D IC and 2.5D IC Packaging Production Value, (2018-2023) & (USD Million)
    Table 44. Rest of World Based Manufacturers 3D IC and 2.5D IC Packaging Production Value Market Share (2018-2023)
    Table 45. Rest of World Based Manufacturers 3D IC and 2.5D IC Packaging Production (2018-2023) & (K Units)
    Table 46. Rest of World Based Manufacturers 3D IC and 2.5D IC Packaging Production Market Share (2018-2023)
    Table 47. World 3D IC and 2.5D IC Packaging Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Table 48. World 3D IC and 2.5D IC Packaging Production by Type (2018-2023) & (K Units)
    Table 49. World 3D IC and 2.5D IC Packaging Production by Type (2024-2029) & (K Units)
    Table 50. World 3D IC and 2.5D IC Packaging Production Value by Type (2018-2023) & (USD Million)
    Table 51. World 3D IC and 2.5D IC Packaging Production Value by Type (2024-2029) & (USD Million)
    Table 52. World 3D IC and 2.5D IC Packaging Average Price by Type (2018-2023) & (K USD/Unit)
    Table 53. World 3D IC and 2.5D IC Packaging Average Price by Type (2024-2029) & (K USD/Unit)
    Table 54. World 3D IC and 2.5D IC Packaging Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Table 55. World 3D IC and 2.5D IC Packaging Production by Application (2018-2023) & (K Units)
    Table 56. World 3D IC and 2.5D IC Packaging Production by Application (2024-2029) & (K Units)
    Table 57. World 3D IC and 2.5D IC Packaging Production Value by Application (2018-2023) & (USD Million)
    Table 58. World 3D IC and 2.5D IC Packaging Production Value by Application (2024-2029) & (USD Million)
    Table 59. World 3D IC and 2.5D IC Packaging Average Price by Application (2018-2023) & (K USD/Unit)
    Table 60. World 3D IC and 2.5D IC Packaging Average Price by Application (2024-2029) & (K USD/Unit)
    Table 61. Taiwan Semiconductor Basic Information, Manufacturing Base and Competitors
    Table 62. Taiwan Semiconductor Major Business
    Table 63. Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product and Services
    Table 64. Taiwan Semiconductor 3D IC and 2.5D IC Packaging Production (K Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 65. Taiwan Semiconductor Recent Developments/Updates
    Table 66. Taiwan Semiconductor Competitive Strengths & Weaknesses
    Table 67. Samsung Electronics Basic Information, Manufacturing Base and Competitors
    Table 68. Samsung Electronics Major Business
    Table 69. Samsung Electronics 3D IC and 2.5D IC Packaging Product and Services
    Table 70. Samsung Electronics 3D IC and 2.5D IC Packaging Production (K Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 71. Samsung Electronics Recent Developments/Updates
    Table 72. Samsung Electronics Competitive Strengths & Weaknesses
    Table 73. Toshiba Corp Basic Information, Manufacturing Base and Competitors
    Table 74. Toshiba Corp Major Business
    Table 75. Toshiba Corp 3D IC and 2.5D IC Packaging Product and Services
    Table 76. Toshiba Corp 3D IC and 2.5D IC Packaging Production (K Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 77. Toshiba Corp Recent Developments/Updates
    Table 78. Toshiba Corp Competitive Strengths & Weaknesses
    Table 79. Advanced Semiconductor Engineering Basic Information, Manufacturing Base and Competitors
    Table 80. Advanced Semiconductor Engineering Major Business
    Table 81. Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product and Services
    Table 82. Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Production (K Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 83. Advanced Semiconductor Engineering Recent Developments/Updates
    Table 84. Amkor Technology Basic Information, Manufacturing Base and Competitors
    Table 85. Amkor Technology Major Business
    Table 86. Amkor Technology 3D IC and 2.5D IC Packaging Product and Services
    Table 87. Amkor Technology 3D IC and 2.5D IC Packaging Production (K Units), Price (K USD/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
    Table 88. Global Key Players of 3D IC and 2.5D IC Packaging Upstream (Raw Materials)
    Table 89. 3D IC and 2.5D IC Packaging Typical Customers
    Table 90. 3D IC and 2.5D IC Packaging Typical Distributors
List of Figure
    Figure 1. 3D IC and 2.5D IC Packaging Picture
    Figure 2. World 3D IC and 2.5D IC Packaging Production Value: 2018 & 2022 & 2029, (USD Million)
    Figure 3. World 3D IC and 2.5D IC Packaging Production Value and Forecast (2018-2029) & (USD Million)
    Figure 4. World 3D IC and 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 5. World 3D IC and 2.5D IC Packaging Average Price (2018-2029) & (K USD/Unit)
    Figure 6. World 3D IC and 2.5D IC Packaging Production Value Market Share by Region (2018-2029)
    Figure 7. World 3D IC and 2.5D IC Packaging Production Market Share by Region (2018-2029)
    Figure 8. North America 3D IC and 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 9. Europe 3D IC and 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 10. China 3D IC and 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 11. Japan 3D IC and 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 12. South Korea 3D IC and 2.5D IC Packaging Production (2018-2029) & (K Units)
    Figure 13. 3D IC and 2.5D IC Packaging Market Drivers
    Figure 14. Factors Affecting Demand
    Figure 15. World 3D IC and 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 16. World 3D IC and 2.5D IC Packaging Consumption Market Share by Region (2018-2029)
    Figure 17. United States 3D IC and 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 18. China 3D IC and 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 19. Europe 3D IC and 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 20. Japan 3D IC and 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 21. South Korea 3D IC and 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 22. ASEAN 3D IC and 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 23. India 3D IC and 2.5D IC Packaging Consumption (2018-2029) & (K Units)
    Figure 24. Producer Shipments of 3D IC and 2.5D IC Packaging by Manufacturer Revenue ($MM) and Market Share (%): 2022
    Figure 25. Global Four-firm Concentration Ratios (CR4) for 3D IC and 2.5D IC Packaging Markets in 2022
    Figure 26. Global Four-firm Concentration Ratios (CR8) for 3D IC and 2.5D IC Packaging Markets in 2022
    Figure 27. United States VS China: 3D IC and 2.5D IC Packaging Production Value Market Share Comparison (2018 & 2022 & 2029)
    Figure 28. United States VS China: 3D IC and 2.5D IC Packaging Production Market Share Comparison (2018 & 2022 & 2029)
    Figure 29. United States VS China: 3D IC and 2.5D IC Packaging Consumption Market Share Comparison (2018 & 2022 & 2029)
    Figure 30. United States Based Manufacturers 3D IC and 2.5D IC Packaging Production Market Share 2022
    Figure 31. China Based Manufacturers 3D IC and 2.5D IC Packaging Production Market Share 2022
    Figure 32. Rest of World Based Manufacturers 3D IC and 2.5D IC Packaging Production Market Share 2022
    Figure 33. World 3D IC and 2.5D IC Packaging Production Value by Type, (USD Million), 2018 & 2022 & 2029
    Figure 34. World 3D IC and 2.5D IC Packaging Production Value Market Share by Type in 2022
    Figure 35. 3D Wafer-level Chip-scale Packaging
    Figure 36. 3D TSV
    Figure 37. 2.5D
    Figure 38. World 3D IC and 2.5D IC Packaging Production Market Share by Type (2018-2029)
    Figure 39. World 3D IC and 2.5D IC Packaging Production Value Market Share by Type (2018-2029)
    Figure 40. World 3D IC and 2.5D IC Packaging Average Price by Type (2018-2029) & (K USD/Unit)
    Figure 41. World 3D IC and 2.5D IC Packaging Production Value by Application, (USD Million), 2018 & 2022 & 2029
    Figure 42. World 3D IC and 2.5D IC Packaging Production Value Market Share by Application in 2022
    Figure 43. Logic
    Figure 44. Imaging & Optoelectronics
    Figure 45. Memory
    Figure 46. MEMS/Sensors
    Figure 47. LED
    Figure 48. Power
    Figure 49. World 3D IC and 2.5D IC Packaging Production Market Share by Application (2018-2029)
    Figure 50. World 3D IC and 2.5D IC Packaging Production Value Market Share by Application (2018-2029)
    Figure 51. World 3D IC and 2.5D IC Packaging Average Price by Application (2018-2029) & (K USD/Unit)
    Figure 52. 3D IC and 2.5D IC Packaging Industry Chain
    Figure 53. 3D IC and 2.5D IC Packaging Procurement Model
    Figure 54. 3D IC and 2.5D IC Packaging Sales Model
    Figure 55. 3D IC and 2.5D IC Packaging Sales Channels, Direct Sales, and Distribution
    Figure 56. Methodology
    Figure 57. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology

Related Reports

Global 3D IC and 2.5D IC Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global 3D IC and 2.5D IC Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 02 Jan 2024

date Electronics & Semiconductor

According to our (Global Info Research) latest study, the global 3D IC and 2.5D IC Packaging market size was valued at USD 102920 million in 2023 and is forecast to a readjusted size of USD 263040 million by 2030 with a CAGR of 14.3% during review period.

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