Global Precision Wafer Dicing Blade Supply, Demand and Key Producers, 2023-2029
Page: 112
Published Date: 17 Jun 2023
Category: Electronics & Semiconductor
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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Related Reports
Product Tags
Description
The global Precision Wafer Dicing Blade market size is expected to reach $ 443.1 million by 2029, rising at a market growth of 6.5% CAGR during the forecast period (2023-2029).
This report studies the global Precision Wafer Dicing Blade production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Precision Wafer Dicing Blade, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Precision Wafer Dicing Blade that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Precision Wafer Dicing Blade total production and demand, 2018-2029, (K Units)
Global Precision Wafer Dicing Blade total production value, 2018-2029, (USD Million)
Global Precision Wafer Dicing Blade production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (K Units)
Global Precision Wafer Dicing Blade consumption by region & country, CAGR, 2018-2029 & (K Units)
U.S. VS China: Precision Wafer Dicing Blade domestic production, consumption, key domestic manufacturers and share
Global Precision Wafer Dicing Blade production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (K Units)
Global Precision Wafer Dicing Blade production by Type, production, value, CAGR, 2018-2029, (USD Million) & (K Units)
Global Precision Wafer Dicing Blade production by Application production, value, CAGR, 2018-2029, (USD Million) & (K Units)
This reports profiles key players in the global Precision Wafer Dicing Blade market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO Corporation, Thermocarbon Inc., Kulicke and Soffa, ADT, Shanghai Sinyang Semiconductor Materials, Shenzhen West Technology Co., Ltd., UKAM, Ceiba and Shanghai Xiyue Machinery Technology Co., Ltd., etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Precision Wafer Dicing Blade market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.
Global Precision Wafer Dicing Blade Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Precision Wafer Dicing Blade Market, Segmentation by Type
Metal Wafer Dicing Blade
Resin Wafer Dicing Blade
Electroplated Wafer Dicing Blade
Global Precision Wafer Dicing Blade Market, Segmentation by Application
IC
Discrete Devices
Others
Companies Profiled:
DISCO Corporation
Thermocarbon Inc.
Kulicke and Soffa
ADT
Shanghai Sinyang Semiconductor Materials
Shenzhen West Technology Co., Ltd.
UKAM
Ceiba
Shanghai Xiyue Machinery Technology Co., Ltd.
Zhengzhou Qisheng Precision Manufacturing Co., Ltd.
Key Questions Answered
1. How big is the global Precision Wafer Dicing Blade market?
2. What is the demand of the global Precision Wafer Dicing Blade market?
3. What is the year over year growth of the global Precision Wafer Dicing Blade market?
4. What is the production and production value of the global Precision Wafer Dicing Blade market?
5. Who are the key producers in the global Precision Wafer Dicing Blade market?
6. What are the growth factors driving the market demand?
Table of Contents
1 Supply Summary
1.1 Precision Wafer Dicing Blade Introduction
1.2 World Precision Wafer Dicing Blade Supply & Forecast
1.2.1 World Precision Wafer Dicing Blade Production Value (2018 & 2022 & 2029)
1.2.2 World Precision Wafer Dicing Blade Production (2018-2029)
1.2.3 World Precision Wafer Dicing Blade Pricing Trends (2018-2029)
1.3 World Precision Wafer Dicing Blade Production by Region (Based on Production Site)
1.3.1 World Precision Wafer Dicing Blade Production Value by Region (2018-2029)
1.3.2 World Precision Wafer Dicing Blade Production by Region (2018-2029)
1.3.3 World Precision Wafer Dicing Blade Average Price by Region (2018-2029)
1.3.4 North America Precision Wafer Dicing Blade Production (2018-2029)
1.3.5 Europe Precision Wafer Dicing Blade Production (2018-2029)
1.3.6 China Precision Wafer Dicing Blade Production (2018-2029)
1.3.7 Japan Precision Wafer Dicing Blade Production (2018-2029)
1.3.8 South Korea Precision Wafer Dicing Blade Production (2018-2029)
1.4 Market Drivers, Restraints and Trends
1.4.1 Precision Wafer Dicing Blade Market Drivers
1.4.2 Factors Affecting Demand
1.4.3 Precision Wafer Dicing Blade Major Market Trends
1.5 Influence of COVID-19 and Russia-Ukraine War
1.5.1 Influence of COVID-19
1.5.2 Influence of Russia-Ukraine War
2.1 World Precision Wafer Dicing Blade Demand (2018-2029)
2.2 World Precision Wafer Dicing Blade Consumption by Region
2.2.1 World Precision Wafer Dicing Blade Consumption by Region (2018-2023)
2.2.2 World Precision Wafer Dicing Blade Consumption Forecast by Region (2024-2029)
2.3 United States Precision Wafer Dicing Blade Consumption (2018-2029)
2.4 China Precision Wafer Dicing Blade Consumption (2018-2029)
2.5 Europe Precision Wafer Dicing Blade Consumption (2018-2029)
2.6 Japan Precision Wafer Dicing Blade Consumption (2018-2029)
2.7 South Korea Precision Wafer Dicing Blade Consumption (2018-2029)
2.8 ASEAN Precision Wafer Dicing Blade Consumption (2018-2029)
2.9 India Precision Wafer Dicing Blade Consumption (2018-2029)
3.1 World Precision Wafer Dicing Blade Production Value by Manufacturer (2018-2023)
3.2 World Precision Wafer Dicing Blade Production by Manufacturer (2018-2023)
3.3 World Precision Wafer Dicing Blade Average Price by Manufacturer (2018-2023)
3.4 Precision Wafer Dicing Blade Company Evaluation Quadrant
3.5 Industry Rank and Concentration Rate (CR)
3.5.1 Global Precision Wafer Dicing Blade Industry Rank of Major Manufacturers
3.5.2 Global Concentration Ratios (CR4) for Precision Wafer Dicing Blade in 2022
3.5.3 Global Concentration Ratios (CR8) for Precision Wafer Dicing Blade in 2022
3.6 Precision Wafer Dicing Blade Market: Overall Company Footprint Analysis
3.6.1 Precision Wafer Dicing Blade Market: Region Footprint
3.6.2 Precision Wafer Dicing Blade Market: Company Product Type Footprint
3.6.3 Precision Wafer Dicing Blade Market: Company Product Application Footprint
3.7 Competitive Environment
3.7.1 Historical Structure of the Industry
3.7.2 Barriers of Market Entry
3.7.3 Factors of Competition
3.8 New Entrant and Capacity Expansion Plans
3.9 Mergers, Acquisition, Agreements, and Collaborations
4.1 United States VS China: Precision Wafer Dicing Blade Production Value Comparison
4.1.1 United States VS China: Precision Wafer Dicing Blade Production Value Comparison (2018 & 2022 & 2029)
4.1.2 United States VS China: Precision Wafer Dicing Blade Production Value Market Share Comparison (2018 & 2022 & 2029)
4.2 United States VS China: Precision Wafer Dicing Blade Production Comparison
4.2.1 United States VS China: Precision Wafer Dicing Blade Production Comparison (2018 & 2022 & 2029)
4.2.2 United States VS China: Precision Wafer Dicing Blade Production Market Share Comparison (2018 & 2022 & 2029)
4.3 United States VS China: Precision Wafer Dicing Blade Consumption Comparison
4.3.1 United States VS China: Precision Wafer Dicing Blade Consumption Comparison (2018 & 2022 & 2029)
4.3.2 United States VS China: Precision Wafer Dicing Blade Consumption Market Share Comparison (2018 & 2022 & 2029)
4.4 United States Based Precision Wafer Dicing Blade Manufacturers and Market Share, 2018-2023
4.4.1 United States Based Precision Wafer Dicing Blade Manufacturers, Headquarters and Production Site (States, Country)
4.4.2 United States Based Manufacturers Precision Wafer Dicing Blade Production Value (2018-2023)
4.4.3 United States Based Manufacturers Precision Wafer Dicing Blade Production (2018-2023)
4.5 China Based Precision Wafer Dicing Blade Manufacturers and Market Share
4.5.1 China Based Precision Wafer Dicing Blade Manufacturers, Headquarters and Production Site (Province, Country)
4.5.2 China Based Manufacturers Precision Wafer Dicing Blade Production Value (2018-2023)
4.5.3 China Based Manufacturers Precision Wafer Dicing Blade Production (2018-2023)
4.6 Rest of World Based Precision Wafer Dicing Blade Manufacturers and Market Share, 2018-2023
4.6.1 Rest of World Based Precision Wafer Dicing Blade Manufacturers, Headquarters and Production Site (State, Country)
4.6.2 Rest of World Based Manufacturers Precision Wafer Dicing Blade Production Value (2018-2023)
4.6.3 Rest of World Based Manufacturers Precision Wafer Dicing Blade Production (2018-2023)
5.1 World Precision Wafer Dicing Blade Market Size Overview by Type: 2018 VS 2022 VS 2029
5.2 Segment Introduction by Type
5.2.1 Metal Wafer Dicing Blade
5.2.2 Resin Wafer Dicing Blade
5.2.3 Electroplated Wafer Dicing Blade
5.3 Market Segment by Type
5.3.1 World Precision Wafer Dicing Blade Production by Type (2018-2029)
5.3.2 World Precision Wafer Dicing Blade Production Value by Type (2018-2029)
5.3.3 World Precision Wafer Dicing Blade Average Price by Type (2018-2029)
6.1 World Precision Wafer Dicing Blade Market Size Overview by Application: 2018 VS 2022 VS 2029
6.2 Segment Introduction by Application
6.2.1 IC
6.2.2 Discrete Devices
6.2.3 Others
6.3 Market Segment by Application
6.3.1 World Precision Wafer Dicing Blade Production by Application (2018-2029)
6.3.2 World Precision Wafer Dicing Blade Production Value by Application (2018-2029)
6.3.3 World Precision Wafer Dicing Blade Average Price by Application (2018-2029)
7.1 DISCO Corporation
7.1.1 DISCO Corporation Details
7.1.2 DISCO Corporation Major Business
7.1.3 DISCO Corporation Precision Wafer Dicing Blade Product and Services
7.1.4 DISCO Corporation Precision Wafer Dicing Blade Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.1.5 DISCO Corporation Recent Developments/Updates
7.1.6 DISCO Corporation Competitive Strengths & Weaknesses
7.2 Thermocarbon Inc.
7.2.1 Thermocarbon Inc. Details
7.2.2 Thermocarbon Inc. Major Business
7.2.3 Thermocarbon Inc. Precision Wafer Dicing Blade Product and Services
7.2.4 Thermocarbon Inc. Precision Wafer Dicing Blade Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.2.5 Thermocarbon Inc. Recent Developments/Updates
7.2.6 Thermocarbon Inc. Competitive Strengths & Weaknesses
7.3 Kulicke and Soffa
7.3.1 Kulicke and Soffa Details
7.3.2 Kulicke and Soffa Major Business
7.3.3 Kulicke and Soffa Precision Wafer Dicing Blade Product and Services
7.3.4 Kulicke and Soffa Precision Wafer Dicing Blade Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.3.5 Kulicke and Soffa Recent Developments/Updates
7.3.6 Kulicke and Soffa Competitive Strengths & Weaknesses
7.4 ADT
7.4.1 ADT Details
7.4.2 ADT Major Business
7.4.3 ADT Precision Wafer Dicing Blade Product and Services
7.4.4 ADT Precision Wafer Dicing Blade Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.4.5 ADT Recent Developments/Updates
7.4.6 ADT Competitive Strengths & Weaknesses
7.5 Shanghai Sinyang Semiconductor Materials
7.5.1 Shanghai Sinyang Semiconductor Materials Details
7.5.2 Shanghai Sinyang Semiconductor Materials Major Business
7.5.3 Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Product and Services
7.5.4 Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.5.5 Shanghai Sinyang Semiconductor Materials Recent Developments/Updates
7.5.6 Shanghai Sinyang Semiconductor Materials Competitive Strengths & Weaknesses
7.6 Shenzhen West Technology Co., Ltd.
7.6.1 Shenzhen West Technology Co., Ltd. Details
7.6.2 Shenzhen West Technology Co., Ltd. Major Business
7.6.3 Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Product and Services
7.6.4 Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.6.5 Shenzhen West Technology Co., Ltd. Recent Developments/Updates
7.6.6 Shenzhen West Technology Co., Ltd. Competitive Strengths & Weaknesses
7.7 UKAM
7.7.1 UKAM Details
7.7.2 UKAM Major Business
7.7.3 UKAM Precision Wafer Dicing Blade Product and Services
7.7.4 UKAM Precision Wafer Dicing Blade Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.7.5 UKAM Recent Developments/Updates
7.7.6 UKAM Competitive Strengths & Weaknesses
7.8 Ceiba
7.8.1 Ceiba Details
7.8.2 Ceiba Major Business
7.8.3 Ceiba Precision Wafer Dicing Blade Product and Services
7.8.4 Ceiba Precision Wafer Dicing Blade Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.8.5 Ceiba Recent Developments/Updates
7.8.6 Ceiba Competitive Strengths & Weaknesses
7.9 Shanghai Xiyue Machinery Technology Co., Ltd.
7.9.1 Shanghai Xiyue Machinery Technology Co., Ltd. Details
7.9.2 Shanghai Xiyue Machinery Technology Co., Ltd. Major Business
7.9.3 Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Product and Services
7.9.4 Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.9.5 Shanghai Xiyue Machinery Technology Co., Ltd. Recent Developments/Updates
7.9.6 Shanghai Xiyue Machinery Technology Co., Ltd. Competitive Strengths & Weaknesses
7.10 Zhengzhou Qisheng Precision Manufacturing Co., Ltd.
7.10.1 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Details
7.10.2 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Major Business
7.10.3 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Product and Services
7.10.4 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Production, Price, Value, Gross Margin and Market Share (2018-2023)
7.10.5 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Recent Developments/Updates
7.10.6 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Competitive Strengths & Weaknesses
8.1 Precision Wafer Dicing Blade Industry Chain
8.2 Precision Wafer Dicing Blade Upstream Analysis
8.2.1 Precision Wafer Dicing Blade Core Raw Materials
8.2.2 Main Manufacturers of Precision Wafer Dicing Blade Core Raw Materials
8.3 Midstream Analysis
8.4 Downstream Analysis
8.5 Precision Wafer Dicing Blade Production Mode
8.6 Precision Wafer Dicing Blade Procurement Model
8.7 Precision Wafer Dicing Blade Industry Sales Model and Sales Channels
8.7.1 Precision Wafer Dicing Blade Sales Model
8.7.2 Precision Wafer Dicing Blade Typical Customers
10.1 Methodology
10.2 Research Process and Data Source
10.3 Disclaimer
Table of Figures
List of Tables
Table 1. World Precision Wafer Dicing Blade Production Value by Region (2018, 2022 and 2029) & (USD Million)
Table 2. World Precision Wafer Dicing Blade Production Value by Region (2018-2023) & (USD Million)
Table 3. World Precision Wafer Dicing Blade Production Value by Region (2024-2029) & (USD Million)
Table 4. World Precision Wafer Dicing Blade Production Value Market Share by Region (2018-2023)
Table 5. World Precision Wafer Dicing Blade Production Value Market Share by Region (2024-2029)
Table 6. World Precision Wafer Dicing Blade Production by Region (2018-2023) & (K Units)
Table 7. World Precision Wafer Dicing Blade Production by Region (2024-2029) & (K Units)
Table 8. World Precision Wafer Dicing Blade Production Market Share by Region (2018-2023)
Table 9. World Precision Wafer Dicing Blade Production Market Share by Region (2024-2029)
Table 10. World Precision Wafer Dicing Blade Average Price by Region (2018-2023) & (US$/Unit)
Table 11. World Precision Wafer Dicing Blade Average Price by Region (2024-2029) & (US$/Unit)
Table 12. Precision Wafer Dicing Blade Major Market Trends
Table 13. World Precision Wafer Dicing Blade Consumption Growth Rate Forecast by Region (2018 & 2022 & 2029) & (K Units)
Table 14. World Precision Wafer Dicing Blade Consumption by Region (2018-2023) & (K Units)
Table 15. World Precision Wafer Dicing Blade Consumption Forecast by Region (2024-2029) & (K Units)
Table 16. World Precision Wafer Dicing Blade Production Value by Manufacturer (2018-2023) & (USD Million)
Table 17. Production Value Market Share of Key Precision Wafer Dicing Blade Producers in 2022
Table 18. World Precision Wafer Dicing Blade Production by Manufacturer (2018-2023) & (K Units)
Table 19. Production Market Share of Key Precision Wafer Dicing Blade Producers in 2022
Table 20. World Precision Wafer Dicing Blade Average Price by Manufacturer (2018-2023) & (US$/Unit)
Table 21. Global Precision Wafer Dicing Blade Company Evaluation Quadrant
Table 22. World Precision Wafer Dicing Blade Industry Rank of Major Manufacturers, Based on Production Value in 2022
Table 23. Head Office and Precision Wafer Dicing Blade Production Site of Key Manufacturer
Table 24. Precision Wafer Dicing Blade Market: Company Product Type Footprint
Table 25. Precision Wafer Dicing Blade Market: Company Product Application Footprint
Table 26. Precision Wafer Dicing Blade Competitive Factors
Table 27. Precision Wafer Dicing Blade New Entrant and Capacity Expansion Plans
Table 28. Precision Wafer Dicing Blade Mergers & Acquisitions Activity
Table 29. United States VS China Precision Wafer Dicing Blade Production Value Comparison, (2018 & 2022 & 2029) & (USD Million)
Table 30. United States VS China Precision Wafer Dicing Blade Production Comparison, (2018 & 2022 & 2029) & (K Units)
Table 31. United States VS China Precision Wafer Dicing Blade Consumption Comparison, (2018 & 2022 & 2029) & (K Units)
Table 32. United States Based Precision Wafer Dicing Blade Manufacturers, Headquarters and Production Site (States, Country)
Table 33. United States Based Manufacturers Precision Wafer Dicing Blade Production Value, (2018-2023) & (USD Million)
Table 34. United States Based Manufacturers Precision Wafer Dicing Blade Production Value Market Share (2018-2023)
Table 35. United States Based Manufacturers Precision Wafer Dicing Blade Production (2018-2023) & (K Units)
Table 36. United States Based Manufacturers Precision Wafer Dicing Blade Production Market Share (2018-2023)
Table 37. China Based Precision Wafer Dicing Blade Manufacturers, Headquarters and Production Site (Province, Country)
Table 38. China Based Manufacturers Precision Wafer Dicing Blade Production Value, (2018-2023) & (USD Million)
Table 39. China Based Manufacturers Precision Wafer Dicing Blade Production Value Market Share (2018-2023)
Table 40. China Based Manufacturers Precision Wafer Dicing Blade Production (2018-2023) & (K Units)
Table 41. China Based Manufacturers Precision Wafer Dicing Blade Production Market Share (2018-2023)
Table 42. Rest of World Based Precision Wafer Dicing Blade Manufacturers, Headquarters and Production Site (States, Country)
Table 43. Rest of World Based Manufacturers Precision Wafer Dicing Blade Production Value, (2018-2023) & (USD Million)
Table 44. Rest of World Based Manufacturers Precision Wafer Dicing Blade Production Value Market Share (2018-2023)
Table 45. Rest of World Based Manufacturers Precision Wafer Dicing Blade Production (2018-2023) & (K Units)
Table 46. Rest of World Based Manufacturers Precision Wafer Dicing Blade Production Market Share (2018-2023)
Table 47. World Precision Wafer Dicing Blade Production Value by Type, (USD Million), 2018 & 2022 & 2029
Table 48. World Precision Wafer Dicing Blade Production by Type (2018-2023) & (K Units)
Table 49. World Precision Wafer Dicing Blade Production by Type (2024-2029) & (K Units)
Table 50. World Precision Wafer Dicing Blade Production Value by Type (2018-2023) & (USD Million)
Table 51. World Precision Wafer Dicing Blade Production Value by Type (2024-2029) & (USD Million)
Table 52. World Precision Wafer Dicing Blade Average Price by Type (2018-2023) & (US$/Unit)
Table 53. World Precision Wafer Dicing Blade Average Price by Type (2024-2029) & (US$/Unit)
Table 54. World Precision Wafer Dicing Blade Production Value by Application, (USD Million), 2018 & 2022 & 2029
Table 55. World Precision Wafer Dicing Blade Production by Application (2018-2023) & (K Units)
Table 56. World Precision Wafer Dicing Blade Production by Application (2024-2029) & (K Units)
Table 57. World Precision Wafer Dicing Blade Production Value by Application (2018-2023) & (USD Million)
Table 58. World Precision Wafer Dicing Blade Production Value by Application (2024-2029) & (USD Million)
Table 59. World Precision Wafer Dicing Blade Average Price by Application (2018-2023) & (US$/Unit)
Table 60. World Precision Wafer Dicing Blade Average Price by Application (2024-2029) & (US$/Unit)
Table 61. DISCO Corporation Basic Information, Manufacturing Base and Competitors
Table 62. DISCO Corporation Major Business
Table 63. DISCO Corporation Precision Wafer Dicing Blade Product and Services
Table 64. DISCO Corporation Precision Wafer Dicing Blade Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 65. DISCO Corporation Recent Developments/Updates
Table 66. DISCO Corporation Competitive Strengths & Weaknesses
Table 67. Thermocarbon Inc. Basic Information, Manufacturing Base and Competitors
Table 68. Thermocarbon Inc. Major Business
Table 69. Thermocarbon Inc. Precision Wafer Dicing Blade Product and Services
Table 70. Thermocarbon Inc. Precision Wafer Dicing Blade Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 71. Thermocarbon Inc. Recent Developments/Updates
Table 72. Thermocarbon Inc. Competitive Strengths & Weaknesses
Table 73. Kulicke and Soffa Basic Information, Manufacturing Base and Competitors
Table 74. Kulicke and Soffa Major Business
Table 75. Kulicke and Soffa Precision Wafer Dicing Blade Product and Services
Table 76. Kulicke and Soffa Precision Wafer Dicing Blade Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 77. Kulicke and Soffa Recent Developments/Updates
Table 78. Kulicke and Soffa Competitive Strengths & Weaknesses
Table 79. ADT Basic Information, Manufacturing Base and Competitors
Table 80. ADT Major Business
Table 81. ADT Precision Wafer Dicing Blade Product and Services
Table 82. ADT Precision Wafer Dicing Blade Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 83. ADT Recent Developments/Updates
Table 84. ADT Competitive Strengths & Weaknesses
Table 85. Shanghai Sinyang Semiconductor Materials Basic Information, Manufacturing Base and Competitors
Table 86. Shanghai Sinyang Semiconductor Materials Major Business
Table 87. Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Product and Services
Table 88. Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 89. Shanghai Sinyang Semiconductor Materials Recent Developments/Updates
Table 90. Shanghai Sinyang Semiconductor Materials Competitive Strengths & Weaknesses
Table 91. Shenzhen West Technology Co., Ltd. Basic Information, Manufacturing Base and Competitors
Table 92. Shenzhen West Technology Co., Ltd. Major Business
Table 93. Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Product and Services
Table 94. Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 95. Shenzhen West Technology Co., Ltd. Recent Developments/Updates
Table 96. Shenzhen West Technology Co., Ltd. Competitive Strengths & Weaknesses
Table 97. UKAM Basic Information, Manufacturing Base and Competitors
Table 98. UKAM Major Business
Table 99. UKAM Precision Wafer Dicing Blade Product and Services
Table 100. UKAM Precision Wafer Dicing Blade Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 101. UKAM Recent Developments/Updates
Table 102. UKAM Competitive Strengths & Weaknesses
Table 103. Ceiba Basic Information, Manufacturing Base and Competitors
Table 104. Ceiba Major Business
Table 105. Ceiba Precision Wafer Dicing Blade Product and Services
Table 106. Ceiba Precision Wafer Dicing Blade Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 107. Ceiba Recent Developments/Updates
Table 108. Ceiba Competitive Strengths & Weaknesses
Table 109. Shanghai Xiyue Machinery Technology Co., Ltd. Basic Information, Manufacturing Base and Competitors
Table 110. Shanghai Xiyue Machinery Technology Co., Ltd. Major Business
Table 111. Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Product and Services
Table 112. Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 113. Shanghai Xiyue Machinery Technology Co., Ltd. Recent Developments/Updates
Table 114. Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Basic Information, Manufacturing Base and Competitors
Table 115. Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Major Business
Table 116. Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Product and Services
Table 117. Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Production (K Units), Price (US$/Unit), Production Value (USD Million), Gross Margin and Market Share (2018-2023)
Table 118. Global Key Players of Precision Wafer Dicing Blade Upstream (Raw Materials)
Table 119. Precision Wafer Dicing Blade Typical Customers
Table 120. Precision Wafer Dicing Blade Typical Distributors
List of Figure
Figure 1. Precision Wafer Dicing Blade Picture
Figure 2. World Precision Wafer Dicing Blade Production Value: 2018 & 2022 & 2029, (USD Million)
Figure 3. World Precision Wafer Dicing Blade Production Value and Forecast (2018-2029) & (USD Million)
Figure 4. World Precision Wafer Dicing Blade Production (2018-2029) & (K Units)
Figure 5. World Precision Wafer Dicing Blade Average Price (2018-2029) & (US$/Unit)
Figure 6. World Precision Wafer Dicing Blade Production Value Market Share by Region (2018-2029)
Figure 7. World Precision Wafer Dicing Blade Production Market Share by Region (2018-2029)
Figure 8. North America Precision Wafer Dicing Blade Production (2018-2029) & (K Units)
Figure 9. Europe Precision Wafer Dicing Blade Production (2018-2029) & (K Units)
Figure 10. China Precision Wafer Dicing Blade Production (2018-2029) & (K Units)
Figure 11. Japan Precision Wafer Dicing Blade Production (2018-2029) & (K Units)
Figure 12. South Korea Precision Wafer Dicing Blade Production (2018-2029) & (K Units)
Figure 13. Precision Wafer Dicing Blade Market Drivers
Figure 14. Factors Affecting Demand
Figure 15. World Precision Wafer Dicing Blade Consumption (2018-2029) & (K Units)
Figure 16. World Precision Wafer Dicing Blade Consumption Market Share by Region (2018-2029)
Figure 17. United States Precision Wafer Dicing Blade Consumption (2018-2029) & (K Units)
Figure 18. China Precision Wafer Dicing Blade Consumption (2018-2029) & (K Units)
Figure 19. Europe Precision Wafer Dicing Blade Consumption (2018-2029) & (K Units)
Figure 20. Japan Precision Wafer Dicing Blade Consumption (2018-2029) & (K Units)
Figure 21. South Korea Precision Wafer Dicing Blade Consumption (2018-2029) & (K Units)
Figure 22. ASEAN Precision Wafer Dicing Blade Consumption (2018-2029) & (K Units)
Figure 23. India Precision Wafer Dicing Blade Consumption (2018-2029) & (K Units)
Figure 24. Producer Shipments of Precision Wafer Dicing Blade by Manufacturer Revenue ($MM) and Market Share (%): 2022
Figure 25. Global Four-firm Concentration Ratios (CR4) for Precision Wafer Dicing Blade Markets in 2022
Figure 26. Global Four-firm Concentration Ratios (CR8) for Precision Wafer Dicing Blade Markets in 2022
Figure 27. United States VS China: Precision Wafer Dicing Blade Production Value Market Share Comparison (2018 & 2022 & 2029)
Figure 28. United States VS China: Precision Wafer Dicing Blade Production Market Share Comparison (2018 & 2022 & 2029)
Figure 29. United States VS China: Precision Wafer Dicing Blade Consumption Market Share Comparison (2018 & 2022 & 2029)
Figure 30. United States Based Manufacturers Precision Wafer Dicing Blade Production Market Share 2022
Figure 31. China Based Manufacturers Precision Wafer Dicing Blade Production Market Share 2022
Figure 32. Rest of World Based Manufacturers Precision Wafer Dicing Blade Production Market Share 2022
Figure 33. World Precision Wafer Dicing Blade Production Value by Type, (USD Million), 2018 & 2022 & 2029
Figure 34. World Precision Wafer Dicing Blade Production Value Market Share by Type in 2022
Figure 35. Metal Wafer Dicing Blade
Figure 36. Resin Wafer Dicing Blade
Figure 37. Electroplated Wafer Dicing Blade
Figure 38. World Precision Wafer Dicing Blade Production Market Share by Type (2018-2029)
Figure 39. World Precision Wafer Dicing Blade Production Value Market Share by Type (2018-2029)
Figure 40. World Precision Wafer Dicing Blade Average Price by Type (2018-2029) & (US$/Unit)
Figure 41. World Precision Wafer Dicing Blade Production Value by Application, (USD Million), 2018 & 2022 & 2029
Figure 42. World Precision Wafer Dicing Blade Production Value Market Share by Application in 2022
Figure 43. IC
Figure 44. Discrete Devices
Figure 45. Others
Figure 46. World Precision Wafer Dicing Blade Production Market Share by Application (2018-2029)
Figure 47. World Precision Wafer Dicing Blade Production Value Market Share by Application (2018-2029)
Figure 48. World Precision Wafer Dicing Blade Average Price by Application (2018-2029) & (US$/Unit)
Figure 49. Precision Wafer Dicing Blade Industry Chain
Figure 50. Precision Wafer Dicing Blade Procurement Model
Figure 51. Precision Wafer Dicing Blade Sales Model
Figure 52. Precision Wafer Dicing Blade Sales Channels, Direct Sales, and Distribution
Figure 53. Methodology
Figure 54. Research Process and Data Source
Research Methodology
Client Requirements
Review and analyze client requirements
Discussion of all the project requirements and queries
Flexibility Check
Project Feasibility Analysis
Finalizing tentative research programme
Structuring project proposal with scope, timeline, and costs
Analyzing Market Dynamics
Determination of key drivers, restraints, challenge, and opportunity
Identifies market needs and trends
Market Size Estimation & Forecast
Estimation of historical data based on secondary and primary data
Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)
Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies
Consideration of geography, region-specific product/service demand for region segments
Consideration of product utilization rates, product demand outlook for segments by application or end-user.
Data Source
Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports,
paid database, press releases, blogs, newsletters,and GIR repositories.
Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts
to verify insights.
Validation
and
triangulation of
secondary and primary source.
Collection of data
Cumulating and collating the essential qualitative and quantitative data
Generation of report in client requested format by research analysts
Reviews by expert analysts
Final quality check
Clarifying queries
Receiving feedback
Ensuring satisfaction
01 Identification of data
This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
-
02 Evaluation of Market Dynamic
This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
-
03 Collection of Data
This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
-
04 Collaboration of Data
This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis
This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.
Companies Mentioned
DISCO Corporation Thermocarbon Inc. Kulicke and Soffa ADT Shanghai Sinyang Semiconductor Materials Shenzhen West Technology Co., Ltd. UKAM Ceiba Shanghai Xiyue Machinery Technology Co., Ltd. Zhengzhou Qisheng Precision Manufacturing Co., Ltd.
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17 Jun 2023
Electronics & Semiconductor
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