Global IC Packaging Services Supply, Demand and Key Producers, 2024-2030

Description

The global IC Packaging Services market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period (2024-2030).

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

This report studies the global IC Packaging Services demand, key companies, and key regions.

This report is a detailed and comprehensive analysis of the world market for IC Packaging Services, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of IC Packaging Services that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global IC Packaging Services total market, 2019-2030, (USD Million)
Global IC Packaging Services total market by region & country, CAGR, 2019-2030, (USD Million)
U.S. VS China: IC Packaging Services total market, key domestic companies and share, (USD Million)
Global IC Packaging Services revenue by player and market share 2019-2024, (USD Million)
Global IC Packaging Services total market by Type, CAGR, 2019-2030, (USD Million)
Global IC Packaging Services total market by Application, CAGR, 2019-2030, (USD Million).

This reports profiles major players in the global IC Packaging Services market based on the following parameters – company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE, Amkor Technology, JCET, SPIL, Powertech Technology Inc., TongFu Microelectronics, Tianshui Huatian Technology, UTAC and Chipbond Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World IC Packaging Services market.

Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global IC Packaging Services Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global IC Packaging Services Market, Segmentation by Type
    Traditional Packaging
    Advanced Packaging

Global IC Packaging Services Market, Segmentation by Application
    Automotive and Transportation
    Consumer Electronics
    Communication
    Others

Companies Profiled:
    ASE
    Amkor Technology
    JCET
    SPIL
    Powertech Technology Inc.
    TongFu Microelectronics
    Tianshui Huatian Technology
    UTAC
    Chipbond Technology
    Hana Micron
    OSE
    Walton Advanced Engineering
    NEPES
    Unisem
    ChipMOS Technologies
    Signetics
    Carsem
    KYEC

Key Questions Answered
1. How big is the global IC Packaging Services market?
2. What is the demand of the global IC Packaging Services market?
3. What is the year over year growth of the global IC Packaging Services market?
4. What is the total value of the global IC Packaging Services market?
5. Who are the major players in the global IC Packaging Services market?

Table of Contents

1 Supply Summary
    1.1 IC Packaging Services Introduction
    1.2 World IC Packaging Services Market Size & Forecast (2019 & 2023 & 2030)
    1.3 World IC Packaging Services Total Market by Region (by Headquarter Location)
        1.3.1 World IC Packaging Services Market Size by Region (2019-2030), (by Headquarter Location)
        1.3.2 United States IC Packaging Services Market Size (2019-2030)
        1.3.3 China IC Packaging Services Market Size (2019-2030)
        1.3.4 Europe IC Packaging Services Market Size (2019-2030)
        1.3.5 Japan IC Packaging Services Market Size (2019-2030)
        1.3.6 South Korea IC Packaging Services Market Size (2019-2030)
        1.3.7 ASEAN IC Packaging Services Market Size (2019-2030)
        1.3.8 India IC Packaging Services Market Size (2019-2030)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 IC Packaging Services Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 IC Packaging Services Major Market Trends

2 Demand Summary
    2.1 World IC Packaging Services Consumption Value (2019-2030)
    2.2 World IC Packaging Services Consumption Value by Region
        2.2.1 World IC Packaging Services Consumption Value by Region (2019-2024)
        2.2.2 World IC Packaging Services Consumption Value Forecast by Region (2025-2030)
    2.3 United States IC Packaging Services Consumption Value (2019-2030)
    2.4 China IC Packaging Services Consumption Value (2019-2030)
    2.5 Europe IC Packaging Services Consumption Value (2019-2030)
    2.6 Japan IC Packaging Services Consumption Value (2019-2030)
    2.7 South Korea IC Packaging Services Consumption Value (2019-2030)
    2.8 ASEAN IC Packaging Services Consumption Value (2019-2030)
    2.9 India IC Packaging Services Consumption Value (2019-2030)

3 World IC Packaging Services Companies Competitive Analysis
    3.1 World IC Packaging Services Revenue by Player (2019-2024)
    3.2 Industry Rank and Concentration Rate (CR)
        3.2.1 Global IC Packaging Services Industry Rank of Major Players
        3.2.2 Global Concentration Ratios (CR4) for IC Packaging Services in 2023
        3.2.3 Global Concentration Ratios (CR8) for IC Packaging Services in 2023
    3.3 IC Packaging Services Company Evaluation Quadrant
    3.4 IC Packaging Services Market: Overall Company Footprint Analysis
        3.4.1 IC Packaging Services Market: Region Footprint
        3.4.2 IC Packaging Services Market: Company Product Type Footprint
        3.4.3 IC Packaging Services Market: Company Product Application Footprint
    3.5 Competitive Environment
        3.5.1 Historical Structure of the Industry
        3.5.2 Barriers of Market Entry
        3.5.3 Factors of Competition
    3.6 Mergers, Acquisitions Activity

4 United States VS China VS Rest of the World (by Headquarter Location)
    4.1 United States VS China: IC Packaging Services Revenue Comparison (by Headquarter Location)
        4.1.1 United States VS China: IC Packaging Services Market Size Comparison (2019 & 2023 & 2030) (by Headquarter Location)
        4.1.2 United States VS China: IC Packaging Services Revenue Market Share Comparison (2019 & 2023 & 2030)
    4.2 United States Based Companies VS China Based Companies: IC Packaging Services Consumption Value Comparison
        4.2.1 United States VS China: IC Packaging Services Consumption Value Comparison (2019 & 2023 & 2030)
        4.2.2 United States VS China: IC Packaging Services Consumption Value Market Share Comparison (2019 & 2023 & 2030)
    4.3 United States Based IC Packaging Services Companies and Market Share, 2019-2024
        4.3.1 United States Based IC Packaging Services Companies, Headquarters (States, Country)
        4.3.2 United States Based Companies IC Packaging Services Revenue, (2019-2024)
    4.4 China Based Companies IC Packaging Services Revenue and Market Share, 2019-2024
        4.4.1 China Based IC Packaging Services Companies, Company Headquarters (Province, Country)
        4.4.2 China Based Companies IC Packaging Services Revenue, (2019-2024)
    4.5 Rest of World Based IC Packaging Services Companies and Market Share, 2019-2024
        4.5.1 Rest of World Based IC Packaging Services Companies, Headquarters (States, Country)
        4.5.2 Rest of World Based Companies IC Packaging Services Revenue, (2019-2024)

5 Market Analysis by Type
    5.1 World IC Packaging Services Market Size Overview by Type: 2019 VS 2023 VS 2030
    5.2 Segment Introduction by Type
        5.2.1 Traditional Packaging
        5.2.2 Advanced Packaging
    5.3 Market Segment by Type
        5.3.1 World IC Packaging Services Market Size by Type (2019-2024)
        5.3.2 World IC Packaging Services Market Size by Type (2025-2030)
        5.3.3 World IC Packaging Services Market Size Market Share by Type (2019-2030)

6 Market Analysis by Application
    6.1 World IC Packaging Services Market Size Overview by Application: 2019 VS 2023 VS 2030
    6.2 Segment Introduction by Application
        6.2.1 Automotive and Transportation
        6.2.2 Consumer Electronics
        6.2.3 Communication
        6.2.4 Others
        6.2.5 Others
    6.3 Market Segment by Application
        6.3.1 World IC Packaging Services Market Size by Application (2019-2024)
        6.3.2 World IC Packaging Services Market Size by Application (2025-2030)
        6.3.3 World IC Packaging Services Market Size by Application (2019-2030)

7 Company Profiles
    7.1 ASE
        7.1.1 ASE Details
        7.1.2 ASE Major Business
        7.1.3 ASE IC Packaging Services Product and Services
        7.1.4 ASE IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.1.5 ASE Recent Developments/Updates
        7.1.6 ASE Competitive Strengths & Weaknesses
    7.2 Amkor Technology
        7.2.1 Amkor Technology Details
        7.2.2 Amkor Technology Major Business
        7.2.3 Amkor Technology IC Packaging Services Product and Services
        7.2.4 Amkor Technology IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.2.5 Amkor Technology Recent Developments/Updates
        7.2.6 Amkor Technology Competitive Strengths & Weaknesses
    7.3 JCET
        7.3.1 JCET Details
        7.3.2 JCET Major Business
        7.3.3 JCET IC Packaging Services Product and Services
        7.3.4 JCET IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.3.5 JCET Recent Developments/Updates
        7.3.6 JCET Competitive Strengths & Weaknesses
    7.4 SPIL
        7.4.1 SPIL Details
        7.4.2 SPIL Major Business
        7.4.3 SPIL IC Packaging Services Product and Services
        7.4.4 SPIL IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.4.5 SPIL Recent Developments/Updates
        7.4.6 SPIL Competitive Strengths & Weaknesses
    7.5 Powertech Technology Inc.
        7.5.1 Powertech Technology Inc. Details
        7.5.2 Powertech Technology Inc. Major Business
        7.5.3 Powertech Technology Inc. IC Packaging Services Product and Services
        7.5.4 Powertech Technology Inc. IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.5.5 Powertech Technology Inc. Recent Developments/Updates
        7.5.6 Powertech Technology Inc. Competitive Strengths & Weaknesses
    7.6 TongFu Microelectronics
        7.6.1 TongFu Microelectronics Details
        7.6.2 TongFu Microelectronics Major Business
        7.6.3 TongFu Microelectronics IC Packaging Services Product and Services
        7.6.4 TongFu Microelectronics IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.6.5 TongFu Microelectronics Recent Developments/Updates
        7.6.6 TongFu Microelectronics Competitive Strengths & Weaknesses
    7.7 Tianshui Huatian Technology
        7.7.1 Tianshui Huatian Technology Details
        7.7.2 Tianshui Huatian Technology Major Business
        7.7.3 Tianshui Huatian Technology IC Packaging Services Product and Services
        7.7.4 Tianshui Huatian Technology IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.7.5 Tianshui Huatian Technology Recent Developments/Updates
        7.7.6 Tianshui Huatian Technology Competitive Strengths & Weaknesses
    7.8 UTAC
        7.8.1 UTAC Details
        7.8.2 UTAC Major Business
        7.8.3 UTAC IC Packaging Services Product and Services
        7.8.4 UTAC IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.8.5 UTAC Recent Developments/Updates
        7.8.6 UTAC Competitive Strengths & Weaknesses
    7.9 Chipbond Technology
        7.9.1 Chipbond Technology Details
        7.9.2 Chipbond Technology Major Business
        7.9.3 Chipbond Technology IC Packaging Services Product and Services
        7.9.4 Chipbond Technology IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.9.5 Chipbond Technology Recent Developments/Updates
        7.9.6 Chipbond Technology Competitive Strengths & Weaknesses
    7.10 Hana Micron
        7.10.1 Hana Micron Details
        7.10.2 Hana Micron Major Business
        7.10.3 Hana Micron IC Packaging Services Product and Services
        7.10.4 Hana Micron IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.10.5 Hana Micron Recent Developments/Updates
        7.10.6 Hana Micron Competitive Strengths & Weaknesses
    7.11 OSE
        7.11.1 OSE Details
        7.11.2 OSE Major Business
        7.11.3 OSE IC Packaging Services Product and Services
        7.11.4 OSE IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.11.5 OSE Recent Developments/Updates
        7.11.6 OSE Competitive Strengths & Weaknesses
    7.12 Walton Advanced Engineering
        7.12.1 Walton Advanced Engineering Details
        7.12.2 Walton Advanced Engineering Major Business
        7.12.3 Walton Advanced Engineering IC Packaging Services Product and Services
        7.12.4 Walton Advanced Engineering IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.12.5 Walton Advanced Engineering Recent Developments/Updates
        7.12.6 Walton Advanced Engineering Competitive Strengths & Weaknesses
    7.13 NEPES
        7.13.1 NEPES Details
        7.13.2 NEPES Major Business
        7.13.3 NEPES IC Packaging Services Product and Services
        7.13.4 NEPES IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.13.5 NEPES Recent Developments/Updates
        7.13.6 NEPES Competitive Strengths & Weaknesses
    7.14 Unisem
        7.14.1 Unisem Details
        7.14.2 Unisem Major Business
        7.14.3 Unisem IC Packaging Services Product and Services
        7.14.4 Unisem IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.14.5 Unisem Recent Developments/Updates
        7.14.6 Unisem Competitive Strengths & Weaknesses
    7.15 ChipMOS Technologies
        7.15.1 ChipMOS Technologies Details
        7.15.2 ChipMOS Technologies Major Business
        7.15.3 ChipMOS Technologies IC Packaging Services Product and Services
        7.15.4 ChipMOS Technologies IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.15.5 ChipMOS Technologies Recent Developments/Updates
        7.15.6 ChipMOS Technologies Competitive Strengths & Weaknesses
    7.16 Signetics
        7.16.1 Signetics Details
        7.16.2 Signetics Major Business
        7.16.3 Signetics IC Packaging Services Product and Services
        7.16.4 Signetics IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.16.5 Signetics Recent Developments/Updates
        7.16.6 Signetics Competitive Strengths & Weaknesses
    7.17 Carsem
        7.17.1 Carsem Details
        7.17.2 Carsem Major Business
        7.17.3 Carsem IC Packaging Services Product and Services
        7.17.4 Carsem IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.17.5 Carsem Recent Developments/Updates
        7.17.6 Carsem Competitive Strengths & Weaknesses
    7.18 KYEC
        7.18.1 KYEC Details
        7.18.2 KYEC Major Business
        7.18.3 KYEC IC Packaging Services Product and Services
        7.18.4 KYEC IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024)
        7.18.5 KYEC Recent Developments/Updates
        7.18.6 KYEC Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 IC Packaging Services Industry Chain
    8.2 IC Packaging Services Upstream Analysis
    8.3 IC Packaging Services Midstream Analysis
    8.4 IC Packaging Services Downstream Analysis

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. World IC Packaging Services Revenue by Region (2019, 2023 and 2030) & (USD Million), (by Headquarter Location)
    Table 2. World IC Packaging Services Revenue by Region (2019-2024) & (USD Million), (by Headquarter Location)
    Table 3. World IC Packaging Services Revenue by Region (2025-2030) & (USD Million), (by Headquarter Location)
    Table 4. World IC Packaging Services Revenue Market Share by Region (2019-2024), (by Headquarter Location)
    Table 5. World IC Packaging Services Revenue Market Share by Region (2025-2030), (by Headquarter Location)
    Table 6. Major Market Trends
    Table 7. World IC Packaging Services Consumption Value Growth Rate Forecast by Region (2019 & 2023 & 2030) & (USD Million)
    Table 8. World IC Packaging Services Consumption Value by Region (2019-2024) & (USD Million)
    Table 9. World IC Packaging Services Consumption Value Forecast by Region (2025-2030) & (USD Million)
    Table 10. World IC Packaging Services Revenue by Player (2019-2024) & (USD Million)
    Table 11. Revenue Market Share of Key IC Packaging Services Players in 2023
    Table 12. World IC Packaging Services Industry Rank of Major Player, Based on Revenue in 2023
    Table 13. Global IC Packaging Services Company Evaluation Quadrant
    Table 14. Head Office of Key IC Packaging Services Player
    Table 15. IC Packaging Services Market: Company Product Type Footprint
    Table 16. IC Packaging Services Market: Company Product Application Footprint
    Table 17. IC Packaging Services Mergers & Acquisitions Activity
    Table 18. United States VS China IC Packaging Services Market Size Comparison, (2019 & 2023 & 2030) & (USD Million)
    Table 19. United States VS China IC Packaging Services Consumption Value Comparison, (2019 & 2023 & 2030) & (USD Million)
    Table 20. United States Based IC Packaging Services Companies, Headquarters (States, Country)
    Table 21. United States Based Companies IC Packaging Services Revenue, (2019-2024) & (USD Million)
    Table 22. United States Based Companies IC Packaging Services Revenue Market Share (2019-2024)
    Table 23. China Based IC Packaging Services Companies, Headquarters (Province, Country)
    Table 24. China Based Companies IC Packaging Services Revenue, (2019-2024) & (USD Million)
    Table 25. China Based Companies IC Packaging Services Revenue Market Share (2019-2024)
    Table 26. Rest of World Based IC Packaging Services Companies, Headquarters (States, Country)
    Table 27. Rest of World Based Companies IC Packaging Services Revenue, (2019-2024) & (USD Million)
    Table 28. Rest of World Based Companies IC Packaging Services Revenue Market Share (2019-2024)
    Table 29. World IC Packaging Services Market Size by Type, (USD Million), 2019 & 2023 & 2030
    Table 30. World IC Packaging Services Market Size by Type (2019-2024) & (USD Million)
    Table 31. World IC Packaging Services Market Size by Type (2025-2030) & (USD Million)
    Table 32. World IC Packaging Services Market Size by Application, (USD Million), 2019 & 2023 & 2030
    Table 33. World IC Packaging Services Market Size by Application (2019-2024) & (USD Million)
    Table 34. World IC Packaging Services Market Size by Application (2025-2030) & (USD Million)
    Table 35. ASE Basic Information, Area Served and Competitors
    Table 36. ASE Major Business
    Table 37. ASE IC Packaging Services Product and Services
    Table 38. ASE IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 39. ASE Recent Developments/Updates
    Table 40. ASE Competitive Strengths & Weaknesses
    Table 41. Amkor Technology Basic Information, Area Served and Competitors
    Table 42. Amkor Technology Major Business
    Table 43. Amkor Technology IC Packaging Services Product and Services
    Table 44. Amkor Technology IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 45. Amkor Technology Recent Developments/Updates
    Table 46. Amkor Technology Competitive Strengths & Weaknesses
    Table 47. JCET Basic Information, Area Served and Competitors
    Table 48. JCET Major Business
    Table 49. JCET IC Packaging Services Product and Services
    Table 50. JCET IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 51. JCET Recent Developments/Updates
    Table 52. JCET Competitive Strengths & Weaknesses
    Table 53. SPIL Basic Information, Area Served and Competitors
    Table 54. SPIL Major Business
    Table 55. SPIL IC Packaging Services Product and Services
    Table 56. SPIL IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 57. SPIL Recent Developments/Updates
    Table 58. SPIL Competitive Strengths & Weaknesses
    Table 59. Powertech Technology Inc. Basic Information, Area Served and Competitors
    Table 60. Powertech Technology Inc. Major Business
    Table 61. Powertech Technology Inc. IC Packaging Services Product and Services
    Table 62. Powertech Technology Inc. IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 63. Powertech Technology Inc. Recent Developments/Updates
    Table 64. Powertech Technology Inc. Competitive Strengths & Weaknesses
    Table 65. TongFu Microelectronics Basic Information, Area Served and Competitors
    Table 66. TongFu Microelectronics Major Business
    Table 67. TongFu Microelectronics IC Packaging Services Product and Services
    Table 68. TongFu Microelectronics IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 69. TongFu Microelectronics Recent Developments/Updates
    Table 70. TongFu Microelectronics Competitive Strengths & Weaknesses
    Table 71. Tianshui Huatian Technology Basic Information, Area Served and Competitors
    Table 72. Tianshui Huatian Technology Major Business
    Table 73. Tianshui Huatian Technology IC Packaging Services Product and Services
    Table 74. Tianshui Huatian Technology IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 75. Tianshui Huatian Technology Recent Developments/Updates
    Table 76. Tianshui Huatian Technology Competitive Strengths & Weaknesses
    Table 77. UTAC Basic Information, Area Served and Competitors
    Table 78. UTAC Major Business
    Table 79. UTAC IC Packaging Services Product and Services
    Table 80. UTAC IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 81. UTAC Recent Developments/Updates
    Table 82. UTAC Competitive Strengths & Weaknesses
    Table 83. Chipbond Technology Basic Information, Area Served and Competitors
    Table 84. Chipbond Technology Major Business
    Table 85. Chipbond Technology IC Packaging Services Product and Services
    Table 86. Chipbond Technology IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 87. Chipbond Technology Recent Developments/Updates
    Table 88. Chipbond Technology Competitive Strengths & Weaknesses
    Table 89. Hana Micron Basic Information, Area Served and Competitors
    Table 90. Hana Micron Major Business
    Table 91. Hana Micron IC Packaging Services Product and Services
    Table 92. Hana Micron IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 93. Hana Micron Recent Developments/Updates
    Table 94. Hana Micron Competitive Strengths & Weaknesses
    Table 95. OSE Basic Information, Area Served and Competitors
    Table 96. OSE Major Business
    Table 97. OSE IC Packaging Services Product and Services
    Table 98. OSE IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 99. OSE Recent Developments/Updates
    Table 100. OSE Competitive Strengths & Weaknesses
    Table 101. Walton Advanced Engineering Basic Information, Area Served and Competitors
    Table 102. Walton Advanced Engineering Major Business
    Table 103. Walton Advanced Engineering IC Packaging Services Product and Services
    Table 104. Walton Advanced Engineering IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 105. Walton Advanced Engineering Recent Developments/Updates
    Table 106. Walton Advanced Engineering Competitive Strengths & Weaknesses
    Table 107. NEPES Basic Information, Area Served and Competitors
    Table 108. NEPES Major Business
    Table 109. NEPES IC Packaging Services Product and Services
    Table 110. NEPES IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 111. NEPES Recent Developments/Updates
    Table 112. NEPES Competitive Strengths & Weaknesses
    Table 113. Unisem Basic Information, Area Served and Competitors
    Table 114. Unisem Major Business
    Table 115. Unisem IC Packaging Services Product and Services
    Table 116. Unisem IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 117. Unisem Recent Developments/Updates
    Table 118. Unisem Competitive Strengths & Weaknesses
    Table 119. ChipMOS Technologies Basic Information, Area Served and Competitors
    Table 120. ChipMOS Technologies Major Business
    Table 121. ChipMOS Technologies IC Packaging Services Product and Services
    Table 122. ChipMOS Technologies IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 123. ChipMOS Technologies Recent Developments/Updates
    Table 124. ChipMOS Technologies Competitive Strengths & Weaknesses
    Table 125. Signetics Basic Information, Area Served and Competitors
    Table 126. Signetics Major Business
    Table 127. Signetics IC Packaging Services Product and Services
    Table 128. Signetics IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 129. Signetics Recent Developments/Updates
    Table 130. Signetics Competitive Strengths & Weaknesses
    Table 131. Carsem Basic Information, Area Served and Competitors
    Table 132. Carsem Major Business
    Table 133. Carsem IC Packaging Services Product and Services
    Table 134. Carsem IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 135. Carsem Recent Developments/Updates
    Table 136. KYEC Basic Information, Area Served and Competitors
    Table 137. KYEC Major Business
    Table 138. KYEC IC Packaging Services Product and Services
    Table 139. KYEC IC Packaging Services Revenue, Gross Margin and Market Share (2019-2024) & (USD Million)
    Table 140. Global Key Players of IC Packaging Services Upstream (Raw Materials)
    Table 141. IC Packaging Services Typical Customers
List of Figure
    Figure 1. IC Packaging Services Picture
    Figure 2. World IC Packaging Services Total Market Size: 2019 & 2023 & 2030, (USD Million)
    Figure 3. World IC Packaging Services Total Market Size (2019-2030) & (USD Million)
    Figure 4. World IC Packaging Services Revenue Market Share by Region (2019, 2023 and 2030) & (USD Million) , (by Headquarter Location)
    Figure 5. World IC Packaging Services Revenue Market Share by Region (2019-2030), (by Headquarter Location)
    Figure 6. United States Based Company IC Packaging Services Revenue (2019-2030) & (USD Million)
    Figure 7. China Based Company IC Packaging Services Revenue (2019-2030) & (USD Million)
    Figure 8. Europe Based Company IC Packaging Services Revenue (2019-2030) & (USD Million)
    Figure 9. Japan Based Company IC Packaging Services Revenue (2019-2030) & (USD Million)
    Figure 10. South Korea Based Company IC Packaging Services Revenue (2019-2030) & (USD Million)
    Figure 11. ASEAN Based Company IC Packaging Services Revenue (2019-2030) & (USD Million)
    Figure 12. India Based Company IC Packaging Services Revenue (2019-2030) & (USD Million)
    Figure 13. IC Packaging Services Market Drivers
    Figure 14. Factors Affecting Demand
    Figure 15. World IC Packaging Services Consumption Value (2019-2030) & (USD Million)
    Figure 16. World IC Packaging Services Consumption Value Market Share by Region (2019-2030)
    Figure 17. United States IC Packaging Services Consumption Value (2019-2030) & (USD Million)
    Figure 18. China IC Packaging Services Consumption Value (2019-2030) & (USD Million)
    Figure 19. Europe IC Packaging Services Consumption Value (2019-2030) & (USD Million)
    Figure 20. Japan IC Packaging Services Consumption Value (2019-2030) & (USD Million)
    Figure 21. South Korea IC Packaging Services Consumption Value (2019-2030) & (USD Million)
    Figure 22. ASEAN IC Packaging Services Consumption Value (2019-2030) & (USD Million)
    Figure 23. India IC Packaging Services Consumption Value (2019-2030) & (USD Million)
    Figure 24. Producer Shipments of IC Packaging Services by Player Revenue ($MM) and Market Share (%): 2023
    Figure 25. Global Four-firm Concentration Ratios (CR4) for IC Packaging Services Markets in 2023
    Figure 26. Global Four-firm Concentration Ratios (CR8) for IC Packaging Services Markets in 2023
    Figure 27. United States VS China: IC Packaging Services Revenue Market Share Comparison (2019 & 2023 & 2030)
    Figure 28. United States VS China: IC Packaging Services Consumption Value Market Share Comparison (2019 & 2023 & 2030)
    Figure 29. World IC Packaging Services Market Size by Type, (USD Million), 2019 & 2023 & 2030
    Figure 30. World IC Packaging Services Market Size Market Share by Type in 2023
    Figure 31. Traditional Packaging
    Figure 32. Advanced Packaging
    Figure 33. World IC Packaging Services Market Size Market Share by Type (2019-2030)
    Figure 34. World IC Packaging Services Market Size by Application, (USD Million), 2019 & 2023 & 2030
    Figure 35. World IC Packaging Services Market Size Market Share by Application in 2023
    Figure 36. Automotive and Transportation
    Figure 37. Consumer Electronics
    Figure 38. Communication
    Figure 39. Others
    Figure 40. IC Packaging Services Industrial Chain
    Figure 41. Methodology
    Figure 42. Research Process and Data Source

Companies Mentioned

ASE
Amkor Technology
JCET
SPIL
Powertech Technology Inc.
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC