Global IC Packaging Supply, Demand and Key Producers, 2024-2030

Description

The global IC Packaging market size is expected to reach $ 50150 million by 2030, rising at a market growth of 3.6% CAGR during the forecast period (2024-2030).

Global IC Packaging key players include ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, etc. Global top five manufacturers hold a share over 45%.

China Taiwan is the largest market, with a share over 40%, followed by China and South Korea, both have a share over 45%.

IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.

This report studies the global IC Packaging production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for IC Packaging, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2023 as the base year. This report explores demand trends and competition, as well as details the characteristics of IC Packaging that contribute to its increasing demand across many markets.

Highlights and key features of the study
Global IC Packaging total production and demand, 2019-2030, (M Pcs)
Global IC Packaging total production value, 2019-2030, (USD Million)
Global IC Packaging production by region & country, production, value, CAGR, 2019-2030, (USD Million) & (M Pcs)
Global IC Packaging consumption by region & country, CAGR, 2019-2030 & (M Pcs)
U.S. VS China: IC Packaging domestic production, consumption, key domestic manufacturers and share
Global IC Packaging production by manufacturer, production, price, value and market share 2019-2024, (USD Million) & (M Pcs)
Global IC Packaging production by Type, production, value, CAGR, 2019-2030, (USD Million) & (M Pcs)
Global IC Packaging production by Application production, value, CAGR, 2019-2030, (USD Million) & (M Pcs).

This reports profiles key players in the global IC Packaging market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, J-devices, UTAC, JECT and ChipMOS, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World IC Packaging market.

Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (M Pcs) and average price (USD/Pcs) by manufacturer, by Type, and by Application. Data is given for the years 2019-2030 by year with 2023 as the base year, 2024 as the estimate year, and 2025-2030 as the forecast year.

Global IC Packaging Market, By Region:
    United States
    China
    Europe
    Japan
    South Korea
    ASEAN
    India
    Rest of World

Global IC Packaging Market, Segmentation by Type
    DIP
    SOP
    QFP
    QFN
    BGA
    CSP
    LGA
    WLP
    FC
    Others

Global IC Packaging Market, Segmentation by Application
    CIS
    MEMS
    Others

Companies Profiled:
    ASE
    Amkor
    SPIL
    STATS ChipPac
    Powertech Technology
    J-devices
    UTAC
    JECT
    ChipMOS
    Chipbond
    KYEC
    STS Semiconductor
    Huatian
    MPl(Carsem)
    Nepes
    FATC
    Walton
    Unisem
    NantongFujitsu Microelectronics
    Hana Micron
    Signetics
    LINGSEN

Key Questions Answered
1. How big is the global IC Packaging market?
2. What is the demand of the global IC Packaging market?
3. What is the year over year growth of the global IC Packaging market?
4. What is the production and production value of the global IC Packaging market?
5. Who are the key producers in the global IC Packaging market?

Table of Contents

1 Supply Summary
    1.1 IC Packaging Introduction
    1.2 World IC Packaging Supply & Forecast
        1.2.1 World IC Packaging Production Value (2019 & 2023 & 2030)
        1.2.2 World IC Packaging Production (2019-2030)
        1.2.3 World IC Packaging Pricing Trends (2019-2030)
    1.3 World IC Packaging Production by Region (Based on Production Site)
        1.3.1 World IC Packaging Production Value by Region (2019-2030)
        1.3.2 World IC Packaging Production by Region (2019-2030)
        1.3.3 World IC Packaging Average Price by Region (2019-2030)
        1.3.4 North America IC Packaging Production (2019-2030)
        1.3.5 Europe IC Packaging Production (2019-2030)
        1.3.6 China IC Packaging Production (2019-2030)
        1.3.7 China Taiwan IC Packaging Production (2019-2030)
        1.3.8 Japan IC Packaging Production (2019-2030)
        1.3.9 South Korea IC Packaging Production (2019-2030)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 IC Packaging Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 IC Packaging Major Market Trends

2 Demand Summary
    2.1 World IC Packaging Demand (2019-2030)
    2.2 World IC Packaging Consumption by Region
        2.2.1 World IC Packaging Consumption by Region (2019-2024)
        2.2.2 World IC Packaging Consumption Forecast by Region (2025-2030)
    2.3 United States IC Packaging Consumption (2019-2030)
    2.4 China IC Packaging Consumption (2019-2030)
    2.5 Europe IC Packaging Consumption (2019-2030)
    2.6 Japan IC Packaging Consumption (2019-2030)
    2.7 South Korea IC Packaging Consumption (2019-2030)
    2.8 ASEAN IC Packaging Consumption (2019-2030)
    2.9 India IC Packaging Consumption (2019-2030)

3 World IC Packaging Manufacturers Competitive Analysis
    3.1 World IC Packaging Production Value by Manufacturer (2019-2024)
    3.2 World IC Packaging Production by Manufacturer (2019-2024)
    3.3 World IC Packaging Average Price by Manufacturer (2019-2024)
    3.4 IC Packaging Company Evaluation Quadrant
    3.5 Industry Rank and Concentration Rate (CR)
        3.5.1 Global IC Packaging Industry Rank of Major Manufacturers
        3.5.2 Global Concentration Ratios (CR4) for IC Packaging in 2023
        3.5.3 Global Concentration Ratios (CR8) for IC Packaging in 2023
    3.6 IC Packaging Market: Overall Company Footprint Analysis
        3.6.1 IC Packaging Market: Region Footprint
        3.6.2 IC Packaging Market: Company Product Type Footprint
        3.6.3 IC Packaging Market: Company Product Application Footprint
    3.7 Competitive Environment
        3.7.1 Historical Structure of the Industry
        3.7.2 Barriers of Market Entry
        3.7.3 Factors of Competition
    3.8 New Entrant and Capacity Expansion Plans
    3.9 Mergers, Acquisition, Agreements, and Collaborations

4 United States VS China VS Rest of the World
    4.1 United States VS China: IC Packaging Production Value Comparison
        4.1.1 United States VS China: IC Packaging Production Value Comparison (2019 & 2023 & 2030)
        4.1.2 United States VS China: IC Packaging Production Value Market Share Comparison (2019 & 2023 & 2030)
    4.2 United States VS China: IC Packaging Production Comparison
        4.2.1 United States VS China: IC Packaging Production Comparison (2019 & 2023 & 2030)
        4.2.2 United States VS China: IC Packaging Production Market Share Comparison (2019 & 2023 & 2030)
    4.3 United States VS China: IC Packaging Consumption Comparison
        4.3.1 United States VS China: IC Packaging Consumption Comparison (2019 & 2023 & 2030)
        4.3.2 United States VS China: IC Packaging Consumption Market Share Comparison (2019 & 2023 & 2030)
    4.4 United States Based IC Packaging Manufacturers and Market Share, 2019-2024
        4.4.1 United States Based IC Packaging Manufacturers, Headquarters and Production Site (States, Country)
        4.4.2 United States Based Manufacturers IC Packaging Production Value (2019-2024)
        4.4.3 United States Based Manufacturers IC Packaging Production (2019-2024)
    4.5 China Based IC Packaging Manufacturers and Market Share
        4.5.1 China Based IC Packaging Manufacturers, Headquarters and Production Site (Province, Country)
        4.5.2 China Based Manufacturers IC Packaging Production Value (2019-2024)
        4.5.3 China Based Manufacturers IC Packaging Production (2019-2024)
    4.6 Rest of World Based IC Packaging Manufacturers and Market Share, 2019-2024
        4.6.1 Rest of World Based IC Packaging Manufacturers, Headquarters and Production Site (State, Country)
        4.6.2 Rest of World Based Manufacturers IC Packaging Production Value (2019-2024)
        4.6.3 Rest of World Based Manufacturers IC Packaging Production (2019-2024)

5 Market Analysis by Type
    5.1 World IC Packaging Market Size Overview by Type: 2019 VS 2023 VS 2030
    5.2 Segment Introduction by Type
        5.2.1 DIP
        5.2.2 SOP
        5.2.3 QFP
        5.2.4 QFN
        5.2.5 BGA
        5.2.6 CSP
        5.2.7 LGA
        5.2.8 WLP
        5.2.9 FC
        5.2.10 Others
    5.3 Market Segment by Type
        5.3.1 World IC Packaging Production by Type (2019-2030)
        5.3.2 World IC Packaging Production Value by Type (2019-2030)
        5.3.3 World IC Packaging Average Price by Type (2019-2030)

6 Market Analysis by Application
    6.1 World IC Packaging Market Size Overview by Application: 2019 VS 2023 VS 2030
    6.2 Segment Introduction by Application
        6.2.1 CIS
        6.2.2 MEMS
        6.2.3 Others
    6.3 Market Segment by Application
        6.3.1 World IC Packaging Production by Application (2019-2030)
        6.3.2 World IC Packaging Production Value by Application (2019-2030)
        6.3.3 World IC Packaging Average Price by Application (2019-2030)

7 Company Profiles
    7.1 ASE
        7.1.1 ASE Details
        7.1.2 ASE Major Business
        7.1.3 ASE IC Packaging Product and Services
        7.1.4 ASE IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.1.5 ASE Recent Developments/Updates
        7.1.6 ASE Competitive Strengths & Weaknesses
    7.2 Amkor
        7.2.1 Amkor Details
        7.2.2 Amkor Major Business
        7.2.3 Amkor IC Packaging Product and Services
        7.2.4 Amkor IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.2.5 Amkor Recent Developments/Updates
        7.2.6 Amkor Competitive Strengths & Weaknesses
    7.3 SPIL
        7.3.1 SPIL Details
        7.3.2 SPIL Major Business
        7.3.3 SPIL IC Packaging Product and Services
        7.3.4 SPIL IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.3.5 SPIL Recent Developments/Updates
        7.3.6 SPIL Competitive Strengths & Weaknesses
    7.4 STATS ChipPac
        7.4.1 STATS ChipPac Details
        7.4.2 STATS ChipPac Major Business
        7.4.3 STATS ChipPac IC Packaging Product and Services
        7.4.4 STATS ChipPac IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.4.5 STATS ChipPac Recent Developments/Updates
        7.4.6 STATS ChipPac Competitive Strengths & Weaknesses
    7.5 Powertech Technology
        7.5.1 Powertech Technology Details
        7.5.2 Powertech Technology Major Business
        7.5.3 Powertech Technology IC Packaging Product and Services
        7.5.4 Powertech Technology IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.5.5 Powertech Technology Recent Developments/Updates
        7.5.6 Powertech Technology Competitive Strengths & Weaknesses
    7.6 J-devices
        7.6.1 J-devices Details
        7.6.2 J-devices Major Business
        7.6.3 J-devices IC Packaging Product and Services
        7.6.4 J-devices IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.6.5 J-devices Recent Developments/Updates
        7.6.6 J-devices Competitive Strengths & Weaknesses
    7.7 UTAC
        7.7.1 UTAC Details
        7.7.2 UTAC Major Business
        7.7.3 UTAC IC Packaging Product and Services
        7.7.4 UTAC IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.7.5 UTAC Recent Developments/Updates
        7.7.6 UTAC Competitive Strengths & Weaknesses
    7.8 JECT
        7.8.1 JECT Details
        7.8.2 JECT Major Business
        7.8.3 JECT IC Packaging Product and Services
        7.8.4 JECT IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.8.5 JECT Recent Developments/Updates
        7.8.6 JECT Competitive Strengths & Weaknesses
    7.9 ChipMOS
        7.9.1 ChipMOS Details
        7.9.2 ChipMOS Major Business
        7.9.3 ChipMOS IC Packaging Product and Services
        7.9.4 ChipMOS IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.9.5 ChipMOS Recent Developments/Updates
        7.9.6 ChipMOS Competitive Strengths & Weaknesses
    7.10 Chipbond
        7.10.1 Chipbond Details
        7.10.2 Chipbond Major Business
        7.10.3 Chipbond IC Packaging Product and Services
        7.10.4 Chipbond IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.10.5 Chipbond Recent Developments/Updates
        7.10.6 Chipbond Competitive Strengths & Weaknesses
    7.11 KYEC
        7.11.1 KYEC Details
        7.11.2 KYEC Major Business
        7.11.3 KYEC IC Packaging Product and Services
        7.11.4 KYEC IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.11.5 KYEC Recent Developments/Updates
        7.11.6 KYEC Competitive Strengths & Weaknesses
    7.12 STS Semiconductor
        7.12.1 STS Semiconductor Details
        7.12.2 STS Semiconductor Major Business
        7.12.3 STS Semiconductor IC Packaging Product and Services
        7.12.4 STS Semiconductor IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.12.5 STS Semiconductor Recent Developments/Updates
        7.12.6 STS Semiconductor Competitive Strengths & Weaknesses
    7.13 Huatian
        7.13.1 Huatian Details
        7.13.2 Huatian Major Business
        7.13.3 Huatian IC Packaging Product and Services
        7.13.4 Huatian IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.13.5 Huatian Recent Developments/Updates
        7.13.6 Huatian Competitive Strengths & Weaknesses
    7.14 MPl(Carsem)
        7.14.1 MPl(Carsem) Details
        7.14.2 MPl(Carsem) Major Business
        7.14.3 MPl(Carsem) IC Packaging Product and Services
        7.14.4 MPl(Carsem) IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.14.5 MPl(Carsem) Recent Developments/Updates
        7.14.6 MPl(Carsem) Competitive Strengths & Weaknesses
    7.15 Nepes
        7.15.1 Nepes Details
        7.15.2 Nepes Major Business
        7.15.3 Nepes IC Packaging Product and Services
        7.15.4 Nepes IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.15.5 Nepes Recent Developments/Updates
        7.15.6 Nepes Competitive Strengths & Weaknesses
    7.16 FATC
        7.16.1 FATC Details
        7.16.2 FATC Major Business
        7.16.3 FATC IC Packaging Product and Services
        7.16.4 FATC IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.16.5 FATC Recent Developments/Updates
        7.16.6 FATC Competitive Strengths & Weaknesses
    7.17 Walton
        7.17.1 Walton Details
        7.17.2 Walton Major Business
        7.17.3 Walton IC Packaging Product and Services
        7.17.4 Walton IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.17.5 Walton Recent Developments/Updates
        7.17.6 Walton Competitive Strengths & Weaknesses
    7.18 Unisem
        7.18.1 Unisem Details
        7.18.2 Unisem Major Business
        7.18.3 Unisem IC Packaging Product and Services
        7.18.4 Unisem IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.18.5 Unisem Recent Developments/Updates
        7.18.6 Unisem Competitive Strengths & Weaknesses
    7.19 NantongFujitsu Microelectronics
        7.19.1 NantongFujitsu Microelectronics Details
        7.19.2 NantongFujitsu Microelectronics Major Business
        7.19.3 NantongFujitsu Microelectronics IC Packaging Product and Services
        7.19.4 NantongFujitsu Microelectronics IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.19.5 NantongFujitsu Microelectronics Recent Developments/Updates
        7.19.6 NantongFujitsu Microelectronics Competitive Strengths & Weaknesses
    7.20 Hana Micron
        7.20.1 Hana Micron Details
        7.20.2 Hana Micron Major Business
        7.20.3 Hana Micron IC Packaging Product and Services
        7.20.4 Hana Micron IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.20.5 Hana Micron Recent Developments/Updates
        7.20.6 Hana Micron Competitive Strengths & Weaknesses
    7.21 Signetics
        7.21.1 Signetics Details
        7.21.2 Signetics Major Business
        7.21.3 Signetics IC Packaging Product and Services
        7.21.4 Signetics IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.21.5 Signetics Recent Developments/Updates
        7.21.6 Signetics Competitive Strengths & Weaknesses
    7.22 LINGSEN
        7.22.1 LINGSEN Details
        7.22.2 LINGSEN Major Business
        7.22.3 LINGSEN IC Packaging Product and Services
        7.22.4 LINGSEN IC Packaging Production, Price, Value, Gross Margin and Market Share (2019-2024)
        7.22.5 LINGSEN Recent Developments/Updates
        7.22.6 LINGSEN Competitive Strengths & Weaknesses

8 Industry Chain Analysis
    8.1 IC Packaging Industry Chain
    8.2 IC Packaging Upstream Analysis
        8.2.1 IC Packaging Core Raw Materials
        8.2.2 Main Manufacturers of IC Packaging Core Raw Materials
    8.3 Midstream Analysis
    8.4 Downstream Analysis
    8.5 IC Packaging Production Mode
    8.6 IC Packaging Procurement Model
    8.7 IC Packaging Industry Sales Model and Sales Channels
        8.7.1 IC Packaging Sales Model
        8.7.2 IC Packaging Typical Customers

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. World IC Packaging Production Value by Region (2019, 2023 and 2030) & (USD Million)
    Table 2. World IC Packaging Production Value by Region (2019-2024) & (USD Million)
    Table 3. World IC Packaging Production Value by Region (2025-2030) & (USD Million)
    Table 4. World IC Packaging Production Value Market Share by Region (2019-2024)
    Table 5. World IC Packaging Production Value Market Share by Region (2025-2030)
    Table 6. World IC Packaging Production by Region (2019-2024) & (M Pcs)
    Table 7. World IC Packaging Production by Region (2025-2030) & (M Pcs)
    Table 8. World IC Packaging Production Market Share by Region (2019-2024)
    Table 9. World IC Packaging Production Market Share by Region (2025-2030)
    Table 10. World IC Packaging Average Price by Region (2019-2024) & (USD/Pcs)
    Table 11. World IC Packaging Average Price by Region (2025-2030) & (USD/Pcs)
    Table 12. IC Packaging Major Market Trends
    Table 13. World IC Packaging Consumption Growth Rate Forecast by Region (2019 & 2023 & 2030) & (M Pcs)
    Table 14. World IC Packaging Consumption by Region (2019-2024) & (M Pcs)
    Table 15. World IC Packaging Consumption Forecast by Region (2025-2030) & (M Pcs)
    Table 16. World IC Packaging Production Value by Manufacturer (2019-2024) & (USD Million)
    Table 17. Production Value Market Share of Key IC Packaging Producers in 2023
    Table 18. World IC Packaging Production by Manufacturer (2019-2024) & (M Pcs)
    Table 19. Production Market Share of Key IC Packaging Producers in 2023
    Table 20. World IC Packaging Average Price by Manufacturer (2019-2024) & (USD/Pcs)
    Table 21. Global IC Packaging Company Evaluation Quadrant
    Table 22. World IC Packaging Industry Rank of Major Manufacturers, Based on Production Value in 2023
    Table 23. Head Office and IC Packaging Production Site of Key Manufacturer
    Table 24. IC Packaging Market: Company Product Type Footprint
    Table 25. IC Packaging Market: Company Product Application Footprint
    Table 26. IC Packaging Competitive Factors
    Table 27. IC Packaging New Entrant and Capacity Expansion Plans
    Table 28. IC Packaging Mergers & Acquisitions Activity
    Table 29. United States VS China IC Packaging Production Value Comparison, (2019 & 2023 & 2030) & (USD Million)
    Table 30. United States VS China IC Packaging Production Comparison, (2019 & 2023 & 2030) & (M Pcs)
    Table 31. United States VS China IC Packaging Consumption Comparison, (2019 & 2023 & 2030) & (M Pcs)
    Table 32. United States Based IC Packaging Manufacturers, Headquarters and Production Site (States, Country)
    Table 33. United States Based Manufacturers IC Packaging Production Value, (2019-2024) & (USD Million)
    Table 34. United States Based Manufacturers IC Packaging Production Value Market Share (2019-2024)
    Table 35. United States Based Manufacturers IC Packaging Production (2019-2024) & (M Pcs)
    Table 36. United States Based Manufacturers IC Packaging Production Market Share (2019-2024)
    Table 37. China Based IC Packaging Manufacturers, Headquarters and Production Site (Province, Country)
    Table 38. China Based Manufacturers IC Packaging Production Value, (2019-2024) & (USD Million)
    Table 39. China Based Manufacturers IC Packaging Production Value Market Share (2019-2024)
    Table 40. China Based Manufacturers IC Packaging Production (2019-2024) & (M Pcs)
    Table 41. China Based Manufacturers IC Packaging Production Market Share (2019-2024)
    Table 42. Rest of World Based IC Packaging Manufacturers, Headquarters and Production Site (States, Country)
    Table 43. Rest of World Based Manufacturers IC Packaging Production Value, (2019-2024) & (USD Million)
    Table 44. Rest of World Based Manufacturers IC Packaging Production Value Market Share (2019-2024)
    Table 45. Rest of World Based Manufacturers IC Packaging Production (2019-2024) & (M Pcs)
    Table 46. Rest of World Based Manufacturers IC Packaging Production Market Share (2019-2024)
    Table 47. World IC Packaging Production Value by Type, (USD Million), 2019 & 2023 & 2030
    Table 48. World IC Packaging Production by Type (2019-2024) & (M Pcs)
    Table 49. World IC Packaging Production by Type (2025-2030) & (M Pcs)
    Table 50. World IC Packaging Production Value by Type (2019-2024) & (USD Million)
    Table 51. World IC Packaging Production Value by Type (2025-2030) & (USD Million)
    Table 52. World IC Packaging Average Price by Type (2019-2024) & (USD/Pcs)
    Table 53. World IC Packaging Average Price by Type (2025-2030) & (USD/Pcs)
    Table 54. World IC Packaging Production Value by Application, (USD Million), 2019 & 2023 & 2030
    Table 55. World IC Packaging Production by Application (2019-2024) & (M Pcs)
    Table 56. World IC Packaging Production by Application (2025-2030) & (M Pcs)
    Table 57. World IC Packaging Production Value by Application (2019-2024) & (USD Million)
    Table 58. World IC Packaging Production Value by Application (2025-2030) & (USD Million)
    Table 59. World IC Packaging Average Price by Application (2019-2024) & (USD/Pcs)
    Table 60. World IC Packaging Average Price by Application (2025-2030) & (USD/Pcs)
    Table 61. ASE Basic Information, Manufacturing Base and Competitors
    Table 62. ASE Major Business
    Table 63. ASE IC Packaging Product and Services
    Table 64. ASE IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 65. ASE Recent Developments/Updates
    Table 66. ASE Competitive Strengths & Weaknesses
    Table 67. Amkor Basic Information, Manufacturing Base and Competitors
    Table 68. Amkor Major Business
    Table 69. Amkor IC Packaging Product and Services
    Table 70. Amkor IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 71. Amkor Recent Developments/Updates
    Table 72. Amkor Competitive Strengths & Weaknesses
    Table 73. SPIL Basic Information, Manufacturing Base and Competitors
    Table 74. SPIL Major Business
    Table 75. SPIL IC Packaging Product and Services
    Table 76. SPIL IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 77. SPIL Recent Developments/Updates
    Table 78. SPIL Competitive Strengths & Weaknesses
    Table 79. STATS ChipPac Basic Information, Manufacturing Base and Competitors
    Table 80. STATS ChipPac Major Business
    Table 81. STATS ChipPac IC Packaging Product and Services
    Table 82. STATS ChipPac IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 83. STATS ChipPac Recent Developments/Updates
    Table 84. STATS ChipPac Competitive Strengths & Weaknesses
    Table 85. Powertech Technology Basic Information, Manufacturing Base and Competitors
    Table 86. Powertech Technology Major Business
    Table 87. Powertech Technology IC Packaging Product and Services
    Table 88. Powertech Technology IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 89. Powertech Technology Recent Developments/Updates
    Table 90. Powertech Technology Competitive Strengths & Weaknesses
    Table 91. J-devices Basic Information, Manufacturing Base and Competitors
    Table 92. J-devices Major Business
    Table 93. J-devices IC Packaging Product and Services
    Table 94. J-devices IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 95. J-devices Recent Developments/Updates
    Table 96. J-devices Competitive Strengths & Weaknesses
    Table 97. UTAC Basic Information, Manufacturing Base and Competitors
    Table 98. UTAC Major Business
    Table 99. UTAC IC Packaging Product and Services
    Table 100. UTAC IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 101. UTAC Recent Developments/Updates
    Table 102. UTAC Competitive Strengths & Weaknesses
    Table 103. JECT Basic Information, Manufacturing Base and Competitors
    Table 104. JECT Major Business
    Table 105. JECT IC Packaging Product and Services
    Table 106. JECT IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 107. JECT Recent Developments/Updates
    Table 108. JECT Competitive Strengths & Weaknesses
    Table 109. ChipMOS Basic Information, Manufacturing Base and Competitors
    Table 110. ChipMOS Major Business
    Table 111. ChipMOS IC Packaging Product and Services
    Table 112. ChipMOS IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 113. ChipMOS Recent Developments/Updates
    Table 114. ChipMOS Competitive Strengths & Weaknesses
    Table 115. Chipbond Basic Information, Manufacturing Base and Competitors
    Table 116. Chipbond Major Business
    Table 117. Chipbond IC Packaging Product and Services
    Table 118. Chipbond IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 119. Chipbond Recent Developments/Updates
    Table 120. Chipbond Competitive Strengths & Weaknesses
    Table 121. KYEC Basic Information, Manufacturing Base and Competitors
    Table 122. KYEC Major Business
    Table 123. KYEC IC Packaging Product and Services
    Table 124. KYEC IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 125. KYEC Recent Developments/Updates
    Table 126. KYEC Competitive Strengths & Weaknesses
    Table 127. STS Semiconductor Basic Information, Manufacturing Base and Competitors
    Table 128. STS Semiconductor Major Business
    Table 129. STS Semiconductor IC Packaging Product and Services
    Table 130. STS Semiconductor IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 131. STS Semiconductor Recent Developments/Updates
    Table 132. STS Semiconductor Competitive Strengths & Weaknesses
    Table 133. Huatian Basic Information, Manufacturing Base and Competitors
    Table 134. Huatian Major Business
    Table 135. Huatian IC Packaging Product and Services
    Table 136. Huatian IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 137. Huatian Recent Developments/Updates
    Table 138. Huatian Competitive Strengths & Weaknesses
    Table 139. MPl(Carsem) Basic Information, Manufacturing Base and Competitors
    Table 140. MPl(Carsem) Major Business
    Table 141. MPl(Carsem) IC Packaging Product and Services
    Table 142. MPl(Carsem) IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 143. MPl(Carsem) Recent Developments/Updates
    Table 144. MPl(Carsem) Competitive Strengths & Weaknesses
    Table 145. Nepes Basic Information, Manufacturing Base and Competitors
    Table 146. Nepes Major Business
    Table 147. Nepes IC Packaging Product and Services
    Table 148. Nepes IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 149. Nepes Recent Developments/Updates
    Table 150. Nepes Competitive Strengths & Weaknesses
    Table 151. FATC Basic Information, Manufacturing Base and Competitors
    Table 152. FATC Major Business
    Table 153. FATC IC Packaging Product and Services
    Table 154. FATC IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 155. FATC Recent Developments/Updates
    Table 156. FATC Competitive Strengths & Weaknesses
    Table 157. Walton Basic Information, Manufacturing Base and Competitors
    Table 158. Walton Major Business
    Table 159. Walton IC Packaging Product and Services
    Table 160. Walton IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 161. Walton Recent Developments/Updates
    Table 162. Walton Competitive Strengths & Weaknesses
    Table 163. Unisem Basic Information, Manufacturing Base and Competitors
    Table 164. Unisem Major Business
    Table 165. Unisem IC Packaging Product and Services
    Table 166. Unisem IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 167. Unisem Recent Developments/Updates
    Table 168. Unisem Competitive Strengths & Weaknesses
    Table 169. NantongFujitsu Microelectronics Basic Information, Manufacturing Base and Competitors
    Table 170. NantongFujitsu Microelectronics Major Business
    Table 171. NantongFujitsu Microelectronics IC Packaging Product and Services
    Table 172. NantongFujitsu Microelectronics IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 173. NantongFujitsu Microelectronics Recent Developments/Updates
    Table 174. NantongFujitsu Microelectronics Competitive Strengths & Weaknesses
    Table 175. Hana Micron Basic Information, Manufacturing Base and Competitors
    Table 176. Hana Micron Major Business
    Table 177. Hana Micron IC Packaging Product and Services
    Table 178. Hana Micron IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 179. Hana Micron Recent Developments/Updates
    Table 180. Hana Micron Competitive Strengths & Weaknesses
    Table 181. Signetics Basic Information, Manufacturing Base and Competitors
    Table 182. Signetics Major Business
    Table 183. Signetics IC Packaging Product and Services
    Table 184. Signetics IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 185. Signetics Recent Developments/Updates
    Table 186. LINGSEN Basic Information, Manufacturing Base and Competitors
    Table 187. LINGSEN Major Business
    Table 188. LINGSEN IC Packaging Product and Services
    Table 189. LINGSEN IC Packaging Production (M Pcs), Price (USD/Pcs), Production Value (USD Million), Gross Margin and Market Share (2019-2024)
    Table 190. Global Key Players of IC Packaging Upstream (Raw Materials)
    Table 191. IC Packaging Typical Customers
    Table 192. IC Packaging Typical Distributors
List of Figure
    Figure 1. IC Packaging Picture
    Figure 2. World IC Packaging Production Value: 2019 & 2023 & 2030, (USD Million)
    Figure 3. World IC Packaging Production Value and Forecast (2019-2030) & (USD Million)
    Figure 4. World IC Packaging Production (2019-2030) & (M Pcs)
    Figure 5. World IC Packaging Average Price (2019-2030) & (USD/Pcs)
    Figure 6. World IC Packaging Production Value Market Share by Region (2019-2030)
    Figure 7. World IC Packaging Production Market Share by Region (2019-2030)
    Figure 8. North America IC Packaging Production (2019-2030) & (M Pcs)
    Figure 9. Europe IC Packaging Production (2019-2030) & (M Pcs)
    Figure 10. China IC Packaging Production (2019-2030) & (M Pcs)
    Figure 11. China Taiwan IC Packaging Production (2019-2030) & (M Pcs)
    Figure 12. Japan IC Packaging Production (2019-2030) & (M Pcs)
    Figure 13. South Korea IC Packaging Production (2019-2030) & (M Pcs)
    Figure 14. IC Packaging Market Drivers
    Figure 15. Factors Affecting Demand
    Figure 16. World IC Packaging Consumption (2019-2030) & (M Pcs)
    Figure 17. World IC Packaging Consumption Market Share by Region (2019-2030)
    Figure 18. United States IC Packaging Consumption (2019-2030) & (M Pcs)
    Figure 19. China IC Packaging Consumption (2019-2030) & (M Pcs)
    Figure 20. Europe IC Packaging Consumption (2019-2030) & (M Pcs)
    Figure 21. Japan IC Packaging Consumption (2019-2030) & (M Pcs)
    Figure 22. South Korea IC Packaging Consumption (2019-2030) & (M Pcs)
    Figure 23. ASEAN IC Packaging Consumption (2019-2030) & (M Pcs)
    Figure 24. India IC Packaging Consumption (2019-2030) & (M Pcs)
    Figure 25. Producer Shipments of IC Packaging by Manufacturer Revenue ($MM) and Market Share (%): 2023
    Figure 26. Global Four-firm Concentration Ratios (CR4) for IC Packaging Markets in 2023
    Figure 27. Global Four-firm Concentration Ratios (CR8) for IC Packaging Markets in 2023
    Figure 28. United States VS China: IC Packaging Production Value Market Share Comparison (2019 & 2023 & 2030)
    Figure 29. United States VS China: IC Packaging Production Market Share Comparison (2019 & 2023 & 2030)
    Figure 30. United States VS China: IC Packaging Consumption Market Share Comparison (2019 & 2023 & 2030)
    Figure 31. United States Based Manufacturers IC Packaging Production Market Share 2023
    Figure 32. China Based Manufacturers IC Packaging Production Market Share 2023
    Figure 33. Rest of World Based Manufacturers IC Packaging Production Market Share 2023
    Figure 34. World IC Packaging Production Value by Type, (USD Million), 2019 & 2023 & 2030
    Figure 35. World IC Packaging Production Value Market Share by Type in 2023
    Figure 36. DIP
    Figure 37. SOP
    Figure 38. QFP
    Figure 39. QFN
    Figure 40. BGA
    Figure 41. CSP
    Figure 42. LGA
    Figure 43. WLP
    Figure 44. FC
    Figure 45. Others
    Figure 46. World IC Packaging Production Market Share by Type (2019-2030)
    Figure 47. World IC Packaging Production Value Market Share by Type (2019-2030)
    Figure 48. World IC Packaging Average Price by Type (2019-2030) & (USD/Pcs)
    Figure 49. World IC Packaging Production Value by Application, (USD Million), 2019 & 2023 & 2030
    Figure 50. World IC Packaging Production Value Market Share by Application in 2023
    Figure 51. CIS
    Figure 52. MEMS
    Figure 53. Others
    Figure 54. World IC Packaging Production Market Share by Application (2019-2030)
    Figure 55. World IC Packaging Production Value Market Share by Application (2019-2030)
    Figure 56. World IC Packaging Average Price by Application (2019-2030) & (USD/Pcs)
    Figure 57. IC Packaging Industry Chain
    Figure 58. IC Packaging Procurement Model
    Figure 59. IC Packaging Sales Model
    Figure 60. IC Packaging Sales Channels, Direct Sales, and Distribution
    Figure 61. Methodology
    Figure 62. Research Process and Data Source

Companies Mentioned

ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Unisem
NantongFujitsu Microelectronics
Hana Micron
Signetics
LINGSEN