Global IC Packaging and Testing Service Production, Demand and Key Producers, 2022-2028

Page: 128

Published Date: 18 Nov 2022

Category: Electronics & Semiconductor

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Description
Table of Contents
Table of Figures
Research Methodology
Companies Mentioned
Product Tags

Description

This report studies the global IC Packaging and Testing Service demand, key companies, and key regions.

This report is a detailed and comprehensive analysis of the world market for IC Packaging and Testing Service, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2021 as the base year. This report explores demand trends and competition, as well as details the characteristics of IC Packaging and Testing Service that contribute to its increasing demand across many markets.

The global IC Packaging and Testing Service market size is expected to reach $ million by 2028, rising at a market growth of % CAGR during the forecast period (2022-2028).

Highlights and key features of the study
Global IC Packaging and Testing Service total market, 2017-2028, (USD Million)
Global IC Packaging and Testing Service total market by region & country, CAGR, 2017-2028, (USD Million)
U.S. VS China: IC Packaging and Testing Service total market, key domestic companies and share, (USD Million)
Global IC Packaging and Testing Service revenue by player and market share 2017-2022, (USD Million)
Global IC Packaging and Testing Service total market by Type, CAGR, 2017-2028, (USD Million)
Global IC Packaging and Testing Service total market by Application, CAGR, 2017-2028, (USD Million)
This reports profiles major players in the global IC Packaging and Testing Service market based on the following parameters – company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Intel, Samsung, SK Hynix, Micron, ASE Group, Amkor Technology, Inc., Huatian Technology, Powertech Technology, Inc. and Chipbond, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World IC Packaging and Testing Service market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Application. Data is given for the years 2017-2028 by year with 2021 as the base year, 2022 as the estimate year, and 2028 as the forecast year.

Global IC Packaging and Testing Service Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global IC Packaging and Testing Service Market, Segmentation by Type
IDM
OSAT

Global IC Packaging and Testing Service Market, Segmentation by Application
Communication
Automotive Electronics
Industrial
Consumer Electronics
Computing and Networking
Other

Companies Profiled:
Intel
Samsung
SK Hynix
Micron
ASE Group
Amkor Technology, Inc.
Huatian Technology
Powertech Technology, Inc.
Chipbond
Presto Engineering
JECT
Siliconware Precision Industries Co., Ltd.
Tongfu Microelectronics
Tower Semiconductor
Qualcomm
MediaTek
UMC
Apple
IBM
Graphcore
ADLINK
Kioxia
Texas Instruments
TSMC
Analog Devices
Sony
Infineon
Bosch
onsemi
Mitsubishi Electric
Micross
UTAC
KYEC
ChipMOS
China Resources Group

Key Questions Answered
1. How big is the global IC Packaging and Testing Service market?
2. What is the demand of the global IC Packaging and Testing Service market?
3. What is the year over year growth of the global IC Packaging and Testing Service market?
4. What is the total value of the global IC Packaging and Testing Service market?
5. Who are the major players in the global IC Packaging and Testing Service market?
6. What are the growth factors driving the market demand?

Table of Contents

1 Supply Summary
    1.1 IC Packaging and Testing Service Introduction
    1.2 World IC Packaging and Testing Service Market Size & Forecast (2017 & 2021 & 2028)
    1.3 World IC Packaging and Testing Service Total Market by Region
        1.3.1 World IC Packaging and Testing Service Market Size by Region (2017-2028)
        1.3.2 United States IC Packaging and Testing Service Market Size (2017-2028)
        1.3.3 China IC Packaging and Testing Service Market Size (2017-2028)
        1.3.4 Europe IC Packaging and Testing Service Market Size (2017-2028)
        1.3.5 Japan IC Packaging and Testing Service Market Size (2017-2028)
        1.3.6 South Korea IC Packaging and Testing Service Market Size (2017-2028)
        1.3.7 ASEAN IC Packaging and Testing Service Market Size (2017-2028)
        1.3.8 India IC Packaging and Testing Service Market Size (2017-2028)
    1.4 Market Drivers, Restraints and Trends
        1.4.1 IC Packaging and Testing Service Market Drivers
        1.4.2 Factors Affecting Demand
        1.4.3 IC Packaging and Testing Service Major Market Trends
    1.5 Influence of COVID-19 and Russia-Ukraine War
        1.5.1 Influence of COVID-19
        1.5.2 Influence of Russia-Ukraine War

2 World IC Packaging and Testing Service Companies Competitive Analysis
    2.1 World IC Packaging and Testing Service Revenue by Player (2017-2022)
    2.2 Industry Rank and Concentration Rate (CR)
        2.2.1 Global IC Packaging and Testing Service Industry Rank of Major Players
        2.2.2 Global Concentration Ratios (CR4) for IC Packaging and Testing Service in 2021
        2.2.3 Global Concentration Ratios (CR8) for IC Packaging and Testing Service in 2021
    2.3 IC Packaging and Testing Service Company Evaluation Quadrant
    2.4 IC Packaging and Testing Service Market: Overall Company Footprint Analysis
        2.4.1 IC Packaging and Testing Service Market: Region Footprint
        2.4.2 IC Packaging and Testing Service Market: Company Product Type Footprint
        2.4.3 IC Packaging and Testing Service Market: Company Product Application Footprint
    2.5 Competitive Environment
        2.5.1 Historical Structure of the Industry
        2.5.2 Barriers of Market Entry
        2.5.3 Factors of Competition
    2.6 Mergers, Acquisitions Activity

3 United States VS China VS Rest of the World
    3.1 United States VS China: IC Packaging and Testing Service Market Comparison
        3.1.1 United States VS China: IC Packaging and Testing Service Market Size Comparison (2017 & 2021 & 2028)
        3.1.2 United States VS China: IC Packaging and Testing Service Market Size Market Share Comparison (2017 & 2021 & 2028)
    3.2 United States IC Packaging and Testing Service Major Players and Market Share, 2017-2022
        3.2.1 Major Players of IC Packaging and Testing Service in United States, Headquarters (States, Country)
        3.2.2 United States IC Packaging and Testing Service Revenue by Domestic Player, (2017-2022)
    3.3 China IC Packaging and Testing Service Major Players and Market Share, 2017-2022
        3.3.1 Major Players of IC Packaging and Testing Service in China, Headquarters (Province, Country)
        3.3.2 China IC Packaging and Testing Service Revenue by Domestic Player, (2017-2022)
    3.4 Rest of World IC Packaging and Testing Service Major Players and Market Share, 2017-2022
        3.4.1 Major Players of IC Packaging and Testing Service in Rest of World, Headquarters (State, Country)
        3.4.2 Rest of World IC Packaging and Testing Service Revenue by Domestic Player, (2017-2022)

4 Market Analysis by Type
    4.1 World IC Packaging and Testing Service Market Size Overview by Type: 2017 VS 2021 VS 2028
    4.2 Segment Introduction by Type
        4.2.1 IDM
        4.2.2 OSAT
    4.3 Market Segment by Type
        4.3.1 World IC Packaging and Testing Service Market Size by Type (2017-2022)
        4.3.2 World IC Packaging and Testing Service Market Size by Type (2023-2028)
        4.3.3 World IC Packaging and Testing Service Market Size Market Share by Type (2017-2028)

5 Market Analysis by Application
    5.1 World IC Packaging and Testing Service Market Size Overview by Application: 2017 VS 2021 VS 2028
    5.2 Segment Introduction by Application
        5.2.1 Communication
        5.2.2 Automotive Electronics
        5.2.3 Industrial
        5.2.4 Consumer Electronics
        5.2.5 Consumer Electronics
        5.2.6 Other
    5.3 Market Segment by Application
        5.3.1 World IC Packaging and Testing Service Market Size by Application (2017-2022)
        5.3.2 World IC Packaging and Testing Service Market Size by Application (2023-2028)
        5.3.3 World IC Packaging and Testing Service Market Size by Application (2017-2028)

6 Company Profiles
    6.1 Intel
        6.1.1 Intel Details
        6.1.2 Intel Major Business
        6.1.3 Intel IC Packaging and Testing Service Product and Services
        6.1.4 Intel IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.1.5 Intel Recent Developments/Updates
        6.1.6 Intel Competitive Strengths & Weaknesses
    6.2 Samsung
        6.2.1 Samsung Details
        6.2.2 Samsung Major Business
        6.2.3 Samsung IC Packaging and Testing Service Product and Services
        6.2.4 Samsung IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.2.5 Samsung Recent Developments/Updates
        6.2.6 Samsung Competitive Strengths & Weaknesses
    6.3 SK Hynix
        6.3.1 SK Hynix Details
        6.3.2 SK Hynix Major Business
        6.3.3 SK Hynix IC Packaging and Testing Service Product and Services
        6.3.4 SK Hynix IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.3.5 SK Hynix Recent Developments/Updates
        6.3.6 SK Hynix Competitive Strengths & Weaknesses
    6.4 Micron
        6.4.1 Micron Details
        6.4.2 Micron Major Business
        6.4.3 Micron IC Packaging and Testing Service Product and Services
        6.4.4 Micron IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.4.5 Micron Recent Developments/Updates
        6.4.6 Micron Competitive Strengths & Weaknesses
    6.5 ASE Group
        6.5.1 ASE Group Details
        6.5.2 ASE Group Major Business
        6.5.3 ASE Group IC Packaging and Testing Service Product and Services
        6.5.4 ASE Group IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.5.5 ASE Group Recent Developments/Updates
        6.5.6 ASE Group Competitive Strengths & Weaknesses
    6.6 Amkor Technology, Inc.
        6.6.1 Amkor Technology, Inc. Details
        6.6.2 Amkor Technology, Inc. Major Business
        6.6.3 Amkor Technology, Inc. IC Packaging and Testing Service Product and Services
        6.6.4 Amkor Technology, Inc. IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.6.5 Amkor Technology, Inc. Recent Developments/Updates
        6.6.6 Amkor Technology, Inc. Competitive Strengths & Weaknesses
    6.7 Huatian Technology
        6.7.1 Huatian Technology Details
        6.7.2 Huatian Technology Major Business
        6.7.3 Huatian Technology IC Packaging and Testing Service Product and Services
        6.7.4 Huatian Technology IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.7.5 Huatian Technology Recent Developments/Updates
        6.7.6 Huatian Technology Competitive Strengths & Weaknesses
    6.8 Powertech Technology, Inc.
        6.8.1 Powertech Technology, Inc. Details
        6.8.2 Powertech Technology, Inc. Major Business
        6.8.3 Powertech Technology, Inc. IC Packaging and Testing Service Product and Services
        6.8.4 Powertech Technology, Inc. IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.8.5 Powertech Technology, Inc. Recent Developments/Updates
        6.8.6 Powertech Technology, Inc. Competitive Strengths & Weaknesses
    6.9 Chipbond
        6.9.1 Chipbond Details
        6.9.2 Chipbond Major Business
        6.9.3 Chipbond IC Packaging and Testing Service Product and Services
        6.9.4 Chipbond IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.9.5 Chipbond Recent Developments/Updates
        6.9.6 Chipbond Competitive Strengths & Weaknesses
    6.10 Presto Engineering
        6.10.1 Presto Engineering Details
        6.10.2 Presto Engineering Major Business
        6.10.3 Presto Engineering IC Packaging and Testing Service Product and Services
        6.10.4 Presto Engineering IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.10.5 Presto Engineering Recent Developments/Updates
        6.10.6 Presto Engineering Competitive Strengths & Weaknesses
    6.11 JECT
        6.11.1 JECT Details
        6.11.2 JECT Major Business
        6.11.3 JECT IC Packaging and Testing Service Product and Services
        6.11.4 JECT IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.11.5 JECT Recent Developments/Updates
        6.11.6 JECT Competitive Strengths & Weaknesses
    6.12 Siliconware Precision Industries Co., Ltd.
        6.12.1 Siliconware Precision Industries Co., Ltd. Details
        6.12.2 Siliconware Precision Industries Co., Ltd. Major Business
        6.12.3 Siliconware Precision Industries Co., Ltd. IC Packaging and Testing Service Product and Services
        6.12.4 Siliconware Precision Industries Co., Ltd. IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.12.5 Siliconware Precision Industries Co., Ltd. Recent Developments/Updates
        6.12.6 Siliconware Precision Industries Co., Ltd. Competitive Strengths & Weaknesses
    6.13 Tongfu Microelectronics
        6.13.1 Tongfu Microelectronics Details
        6.13.2 Tongfu Microelectronics Major Business
        6.13.3 Tongfu Microelectronics IC Packaging and Testing Service Product and Services
        6.13.4 Tongfu Microelectronics IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.13.5 Tongfu Microelectronics Recent Developments/Updates
        6.13.6 Tongfu Microelectronics Competitive Strengths & Weaknesses
    6.14 Tower Semiconductor
        6.14.1 Tower Semiconductor Details
        6.14.2 Tower Semiconductor Major Business
        6.14.3 Tower Semiconductor IC Packaging and Testing Service Product and Services
        6.14.4 Tower Semiconductor IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.14.5 Tower Semiconductor Recent Developments/Updates
        6.14.6 Tower Semiconductor Competitive Strengths & Weaknesses
    6.15 Qualcomm
        6.15.1 Qualcomm Details
        6.15.2 Qualcomm Major Business
        6.15.3 Qualcomm IC Packaging and Testing Service Product and Services
        6.15.4 Qualcomm IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.15.5 Qualcomm Recent Developments/Updates
        6.15.6 Qualcomm Competitive Strengths & Weaknesses
    6.16 MediaTek
        6.16.1 MediaTek Details
        6.16.2 MediaTek Major Business
        6.16.3 MediaTek IC Packaging and Testing Service Product and Services
        6.16.4 MediaTek IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.16.5 MediaTek Recent Developments/Updates
        6.16.6 MediaTek Competitive Strengths & Weaknesses
    6.17 UMC
        6.17.1 UMC Details
        6.17.2 UMC Major Business
        6.17.3 UMC IC Packaging and Testing Service Product and Services
        6.17.4 UMC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.17.5 UMC Recent Developments/Updates
        6.17.6 UMC Competitive Strengths & Weaknesses
    6.18 Apple
        6.18.1 Apple Details
        6.18.2 Apple Major Business
        6.18.3 Apple IC Packaging and Testing Service Product and Services
        6.18.4 Apple IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.18.5 Apple Recent Developments/Updates
        6.18.6 Apple Competitive Strengths & Weaknesses
    6.19 IBM
        6.19.1 IBM Details
        6.19.2 IBM Major Business
        6.19.3 IBM IC Packaging and Testing Service Product and Services
        6.19.4 IBM IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.19.5 IBM Recent Developments/Updates
        6.19.6 IBM Competitive Strengths & Weaknesses
    6.20 Graphcore
        6.20.1 Graphcore Details
        6.20.2 Graphcore Major Business
        6.20.3 Graphcore IC Packaging and Testing Service Product and Services
        6.20.4 Graphcore IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.20.5 Graphcore Recent Developments/Updates
        6.20.6 Graphcore Competitive Strengths & Weaknesses
    6.21 ADLINK
        6.21.1 ADLINK Details
        6.21.2 ADLINK Major Business
        6.21.3 ADLINK IC Packaging and Testing Service Product and Services
        6.21.4 ADLINK IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.21.5 ADLINK Recent Developments/Updates
        6.21.6 ADLINK Competitive Strengths & Weaknesses
    6.22 Kioxia
        6.22.1 Kioxia Details
        6.22.2 Kioxia Major Business
        6.22.3 Kioxia IC Packaging and Testing Service Product and Services
        6.22.4 Kioxia IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.22.5 Kioxia Recent Developments/Updates
        6.22.6 Kioxia Competitive Strengths & Weaknesses
    6.23 Texas Instruments
        6.23.1 Texas Instruments Details
        6.23.2 Texas Instruments Major Business
        6.23.3 Texas Instruments IC Packaging and Testing Service Product and Services
        6.23.4 Texas Instruments IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.23.5 Texas Instruments Recent Developments/Updates
        6.23.6 Texas Instruments Competitive Strengths & Weaknesses
    6.24 TSMC
        6.24.1 TSMC Details
        6.24.2 TSMC Major Business
        6.24.3 TSMC IC Packaging and Testing Service Product and Services
        6.24.4 TSMC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.24.5 TSMC Recent Developments/Updates
        6.24.6 TSMC Competitive Strengths & Weaknesses
    6.25 Analog Devices
        6.25.1 Analog Devices Details
        6.25.2 Analog Devices Major Business
        6.25.3 Analog Devices IC Packaging and Testing Service Product and Services
        6.25.4 Analog Devices IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.25.5 Analog Devices Recent Developments/Updates
        6.25.6 Analog Devices Competitive Strengths & Weaknesses
    6.26 Sony
        6.26.1 Sony Details
        6.26.2 Sony Major Business
        6.26.3 Sony IC Packaging and Testing Service Product and Services
        6.26.4 Sony IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.26.5 Sony Recent Developments/Updates
        6.26.6 Sony Competitive Strengths & Weaknesses
    6.27 Infineon
        6.27.1 Infineon Details
        6.27.2 Infineon Major Business
        6.27.3 Infineon IC Packaging and Testing Service Product and Services
        6.27.4 Infineon IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.27.5 Infineon Recent Developments/Updates
        6.27.6 Infineon Competitive Strengths & Weaknesses
    6.28 Bosch
        6.28.1 Bosch Details
        6.28.2 Bosch Major Business
        6.28.3 Bosch IC Packaging and Testing Service Product and Services
        6.28.4 Bosch IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.28.5 Bosch Recent Developments/Updates
        6.28.6 Bosch Competitive Strengths & Weaknesses
    6.29 onsemi
        6.29.1 onsemi Details
        6.29.2 onsemi Major Business
        6.29.3 onsemi IC Packaging and Testing Service Product and Services
        6.29.4 onsemi IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.29.5 onsemi Recent Developments/Updates
        6.29.6 onsemi Competitive Strengths & Weaknesses
    6.30 Mitsubishi Electric
        6.30.1 Mitsubishi Electric Details
        6.30.2 Mitsubishi Electric Major Business
        6.30.3 Mitsubishi Electric IC Packaging and Testing Service Product and Services
        6.30.4 Mitsubishi Electric IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.30.5 Mitsubishi Electric Recent Developments/Updates
        6.30.6 Mitsubishi Electric Competitive Strengths & Weaknesses
    6.31 Micross
        6.31.1 Micross Details
        6.31.2 Micross Major Business
        6.31.3 Micross IC Packaging and Testing Service Product and Services
        6.31.4 Micross IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.31.5 Micross Recent Developments/Updates
        6.31.6 Micross Competitive Strengths & Weaknesses
    6.32 UTAC
        6.32.1 UTAC Details
        6.32.2 UTAC Major Business
        6.32.3 UTAC IC Packaging and Testing Service Product and Services
        6.32.4 UTAC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.32.5 UTAC Recent Developments/Updates
        6.32.6 UTAC Competitive Strengths & Weaknesses
    6.33 KYEC
        6.33.1 KYEC Details
        6.33.2 KYEC Major Business
        6.33.3 KYEC IC Packaging and Testing Service Product and Services
        6.33.4 KYEC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.33.5 KYEC Recent Developments/Updates
        6.33.6 KYEC Competitive Strengths & Weaknesses
    6.34 ChipMOS
        6.34.1 ChipMOS Details
        6.34.2 ChipMOS Major Business
        6.34.3 ChipMOS IC Packaging and Testing Service Product and Services
        6.34.4 ChipMOS IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.34.5 ChipMOS Recent Developments/Updates
        6.34.6 ChipMOS Competitive Strengths & Weaknesses
    6.35 China Resources Group
        6.35.1 China Resources Group Details
        6.35.2 China Resources Group Major Business
        6.35.3 China Resources Group IC Packaging and Testing Service Product and Services
        6.35.4 China Resources Group IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022)
        6.35.5 China Resources Group Recent Developments/Updates
        6.35.6 China Resources Group Competitive Strengths & Weaknesses

7 Raw Material and Industry Chain
    7.1 Raw Material of IC Packaging and Testing Service and Key Manufacturers
    7.2 IC Packaging and Testing Service Manufacturing Costs
    7.3 IC Packaging and Testing Service Production Process
    7.4 IC Packaging and Testing Service Industrial Chain

8 Distribution Channel Analysis
    8.1 Distribution Channel Breakdown for IC Packaging and Testing Service Shipments (%): 2017-2028
        8.1.1 Direct Channel
        8.1.2 Indirect Channel
    8.2 IC Packaging and Testing Service Typical Distributors
    8.3 IC Packaging and Testing Service Typical Customers

9 Research Findings and Conclusion

10 Appendix
    10.1 Methodology
    10.2 Research Process and Data Source
    10.3 Disclaimer

Table of Figures

List of Tables
    Table 1. World IC Packaging and Testing Service Market Size by Region (2017, 2022 and 2028) & (USD Million)
    Table 2. World IC Packaging and Testing Service Market Size by Region (2017-2022) & (USD Million)
    Table 3. World IC Packaging and Testing Service Market Size by Region (2023-2028) & (USD Million)
    Table 4. World IC Packaging and Testing Service Market Size Market Share by Region (2017-2022)
    Table 5. World IC Packaging and Testing Service Market Size Market Share by Region (2023-2028)
    Table 6. Major Market Trends
    Table 7. World IC Packaging and Testing Service Revenue by Player (2017-2022) & (USD Million)
    Table 8. Revenue Market Share of Key IC Packaging and Testing Service Players in 2021
    Table 9. World IC Packaging and Testing Service Industry Rank of Major Player, Based on Revenue in 2021
    Table 10. Global IC Packaging and Testing Service Company Evaluation Quadrant
    Table 11. Head Office of Key IC Packaging and Testing Service Player
    Table 12. IC Packaging and Testing Service Market: Company Product Type Footprint
    Table 13. IC Packaging and Testing Service Market: Company Product Application Footprint
    Table 14. IC Packaging and Testing Service Mergers & Acquisitions Activity
    Table 15. United States VS China IC Packaging and Testing Service Market Size Comparison, (2017 & 2021 & 2028) & (USD Million)
    Table 16. Major Player of IC Packaging and Testing Service in United States, Headquarters (States, Country)
    Table 17. United States IC Packaging and Testing Service Revenue by Domestic Player, (2017-2022) & (USD Million)
    Table 18. United States IC Packaging and Testing Service Revenue Market Share by Domestic Player, (2017-2022)
    Table 19. Major Player of IC Packaging and Testing Service in China, Company Headquarters (Province, Country)
    Table 20. China IC Packaging and Testing Service Revenue by Domestic Player, (2017-2022) & (USD Million)
    Table 21. China IC Packaging and Testing Service Revenue Market Share by Domestic Player, (2017-2022)
    Table 22. Major Player of IC Packaging and Testing Service in Rest of World, Company Headquarters (State, Country)
    Table 23. Rest of World IC Packaging and Testing Service Revenue by Domestic Player, (2017-2022) & (USD Million)
    Table 24. Rest of World IC Packaging and Testing Service Revenue Market Share by Domestic Player, (2017-2022)
    Table 25. World IC Packaging and Testing Service Revenue by Type, (USD Million), 2017 & 2021 & 2028
    Table 26. World IC Packaging and Testing Service Revenue by Type (2017-2022) & (USD Million)
    Table 27. World IC Packaging and Testing Service Revenue by Type (2023-2028) & (USD Million)
    Table 28. World IC Packaging and Testing Service Revenue by Application, (USD Million), 2017 & 2021 & 2028
    Table 29. World IC Packaging and Testing Service Revenue by Application (2017-2022) & (USD Million)
    Table 30. World IC Packaging and Testing Service Revenue by Application (2023-2028) & (USD Million)
    Table 31. Intel Basic Information, Area Served and Competitors
    Table 32. Intel Major Business
    Table 33. Intel IC Packaging and Testing Service Product and Services
    Table 34. Intel IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 35. Intel Recent Developments/Updates
    Table 36. Intel Competitive Strengths & Weaknesses
    Table 37. Samsung Basic Information, Area Served and Competitors
    Table 38. Samsung Major Business
    Table 39. Samsung IC Packaging and Testing Service Product and Services
    Table 40. Samsung IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 41. Samsung Recent Developments/Updates
    Table 42. Samsung Competitive Strengths & Weaknesses
    Table 43. SK Hynix Basic Information, Area Served and Competitors
    Table 44. SK Hynix Major Business
    Table 45. SK Hynix IC Packaging and Testing Service Product and Services
    Table 46. SK Hynix IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 47. SK Hynix Recent Developments/Updates
    Table 48. SK Hynix Competitive Strengths & Weaknesses
    Table 49. Micron Basic Information, Area Served and Competitors
    Table 50. Micron Major Business
    Table 51. Micron IC Packaging and Testing Service Product and Services
    Table 52. Micron IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 53. Micron Recent Developments/Updates
    Table 54. Micron Competitive Strengths & Weaknesses
    Table 55. ASE Group Basic Information, Area Served and Competitors
    Table 56. ASE Group Major Business
    Table 57. ASE Group IC Packaging and Testing Service Product and Services
    Table 58. ASE Group IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 59. ASE Group Recent Developments/Updates
    Table 60. ASE Group Competitive Strengths & Weaknesses
    Table 61. Amkor Technology, Inc. Basic Information, Area Served and Competitors
    Table 62. Amkor Technology, Inc. Major Business
    Table 63. Amkor Technology, Inc. IC Packaging and Testing Service Product and Services
    Table 64. Amkor Technology, Inc. IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 65. Amkor Technology, Inc. Recent Developments/Updates
    Table 66. Amkor Technology, Inc. Competitive Strengths & Weaknesses
    Table 67. Huatian Technology Basic Information, Area Served and Competitors
    Table 68. Huatian Technology Major Business
    Table 69. Huatian Technology IC Packaging and Testing Service Product and Services
    Table 70. Huatian Technology IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 71. Huatian Technology Recent Developments/Updates
    Table 72. Huatian Technology Competitive Strengths & Weaknesses
    Table 73. Powertech Technology, Inc. Basic Information, Area Served and Competitors
    Table 74. Powertech Technology, Inc. Major Business
    Table 75. Powertech Technology, Inc. IC Packaging and Testing Service Product and Services
    Table 76. Powertech Technology, Inc. IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 77. Powertech Technology, Inc. Recent Developments/Updates
    Table 78. Powertech Technology, Inc. Competitive Strengths & Weaknesses
    Table 79. Chipbond Basic Information, Area Served and Competitors
    Table 80. Chipbond Major Business
    Table 81. Chipbond IC Packaging and Testing Service Product and Services
    Table 82. Chipbond IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 83. Chipbond Recent Developments/Updates
    Table 84. Chipbond Competitive Strengths & Weaknesses
    Table 85. Presto Engineering Basic Information, Area Served and Competitors
    Table 86. Presto Engineering Major Business
    Table 87. Presto Engineering IC Packaging and Testing Service Product and Services
    Table 88. Presto Engineering IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 89. Presto Engineering Recent Developments/Updates
    Table 90. Presto Engineering Competitive Strengths & Weaknesses
    Table 91. JECT Basic Information, Area Served and Competitors
    Table 92. JECT Major Business
    Table 93. JECT IC Packaging and Testing Service Product and Services
    Table 94. JECT IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 95. JECT Recent Developments/Updates
    Table 96. JECT Competitive Strengths & Weaknesses
    Table 97. Siliconware Precision Industries Co., Ltd. Basic Information, Area Served and Competitors
    Table 98. Siliconware Precision Industries Co., Ltd. Major Business
    Table 99. Siliconware Precision Industries Co., Ltd. IC Packaging and Testing Service Product and Services
    Table 100. Siliconware Precision Industries Co., Ltd. IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 101. Siliconware Precision Industries Co., Ltd. Recent Developments/Updates
    Table 102. Siliconware Precision Industries Co., Ltd. Competitive Strengths & Weaknesses
    Table 103. Tongfu Microelectronics Basic Information, Area Served and Competitors
    Table 104. Tongfu Microelectronics Major Business
    Table 105. Tongfu Microelectronics IC Packaging and Testing Service Product and Services
    Table 106. Tongfu Microelectronics IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 107. Tongfu Microelectronics Recent Developments/Updates
    Table 108. Tongfu Microelectronics Competitive Strengths & Weaknesses
    Table 109. Tower Semiconductor Basic Information, Area Served and Competitors
    Table 110. Tower Semiconductor Major Business
    Table 111. Tower Semiconductor IC Packaging and Testing Service Product and Services
    Table 112. Tower Semiconductor IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 113. Tower Semiconductor Recent Developments/Updates
    Table 114. Tower Semiconductor Competitive Strengths & Weaknesses
    Table 115. Qualcomm Basic Information, Area Served and Competitors
    Table 116. Qualcomm Major Business
    Table 117. Qualcomm IC Packaging and Testing Service Product and Services
    Table 118. Qualcomm IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 119. Qualcomm Recent Developments/Updates
    Table 120. Qualcomm Competitive Strengths & Weaknesses
    Table 121. MediaTek Basic Information, Area Served and Competitors
    Table 122. MediaTek Major Business
    Table 123. MediaTek IC Packaging and Testing Service Product and Services
    Table 124. MediaTek IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 125. MediaTek Recent Developments/Updates
    Table 126. MediaTek Competitive Strengths & Weaknesses
    Table 127. UMC Basic Information, Area Served and Competitors
    Table 128. UMC Major Business
    Table 129. UMC IC Packaging and Testing Service Product and Services
    Table 130. UMC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 131. UMC Recent Developments/Updates
    Table 132. UMC Competitive Strengths & Weaknesses
    Table 133. Apple Basic Information, Area Served and Competitors
    Table 134. Apple Major Business
    Table 135. Apple IC Packaging and Testing Service Product and Services
    Table 136. Apple IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 137. Apple Recent Developments/Updates
    Table 138. Apple Competitive Strengths & Weaknesses
    Table 139. IBM Basic Information, Area Served and Competitors
    Table 140. IBM Major Business
    Table 141. IBM IC Packaging and Testing Service Product and Services
    Table 142. IBM IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 143. IBM Recent Developments/Updates
    Table 144. IBM Competitive Strengths & Weaknesses
    Table 145. Graphcore Basic Information, Area Served and Competitors
    Table 146. Graphcore Major Business
    Table 147. Graphcore IC Packaging and Testing Service Product and Services
    Table 148. Graphcore IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 149. Graphcore Recent Developments/Updates
    Table 150. Graphcore Competitive Strengths & Weaknesses
    Table 151. ADLINK Basic Information, Area Served and Competitors
    Table 152. ADLINK Major Business
    Table 153. ADLINK IC Packaging and Testing Service Product and Services
    Table 154. ADLINK IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 155. ADLINK Recent Developments/Updates
    Table 156. ADLINK Competitive Strengths & Weaknesses
    Table 157. Kioxia Basic Information, Area Served and Competitors
    Table 158. Kioxia Major Business
    Table 159. Kioxia IC Packaging and Testing Service Product and Services
    Table 160. Kioxia IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 161. Kioxia Recent Developments/Updates
    Table 162. Kioxia Competitive Strengths & Weaknesses
    Table 163. Texas Instruments Basic Information, Area Served and Competitors
    Table 164. Texas Instruments Major Business
    Table 165. Texas Instruments IC Packaging and Testing Service Product and Services
    Table 166. Texas Instruments IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 167. Texas Instruments Recent Developments/Updates
    Table 168. Texas Instruments Competitive Strengths & Weaknesses
    Table 169. TSMC Basic Information, Area Served and Competitors
    Table 170. TSMC Major Business
    Table 171. TSMC IC Packaging and Testing Service Product and Services
    Table 172. TSMC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 173. TSMC Recent Developments/Updates
    Table 174. TSMC Competitive Strengths & Weaknesses
    Table 175. Analog Devices Basic Information, Area Served and Competitors
    Table 176. Analog Devices Major Business
    Table 177. Analog Devices IC Packaging and Testing Service Product and Services
    Table 178. Analog Devices IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 179. Analog Devices Recent Developments/Updates
    Table 180. Analog Devices Competitive Strengths & Weaknesses
    Table 181. Sony Basic Information, Area Served and Competitors
    Table 182. Sony Major Business
    Table 183. Sony IC Packaging and Testing Service Product and Services
    Table 184. Sony IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 185. Sony Recent Developments/Updates
    Table 186. Sony Competitive Strengths & Weaknesses
    Table 187. Infineon Basic Information, Area Served and Competitors
    Table 188. Infineon Major Business
    Table 189. Infineon IC Packaging and Testing Service Product and Services
    Table 190. Infineon IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 191. Infineon Recent Developments/Updates
    Table 192. Infineon Competitive Strengths & Weaknesses
    Table 193. Bosch Basic Information, Area Served and Competitors
    Table 194. Bosch Major Business
    Table 195. Bosch IC Packaging and Testing Service Product and Services
    Table 196. Bosch IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 197. Bosch Recent Developments/Updates
    Table 198. Bosch Competitive Strengths & Weaknesses
    Table 199. onsemi Basic Information, Area Served and Competitors
    Table 200. onsemiMajor Business
    Table 201. onsemi IC Packaging and Testing Service Product and Services
    Table 202. onsemi IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 203. onsemi Recent Developments/Updates
    Table 204. onsemi Competitive Strengths & Weaknesses
    Table 205. Mitsubishi Electric Basic Information, Area Served and Competitors
    Table 206. Mitsubishi Electric Major Business
    Table 207. Mitsubishi Electric IC Packaging and Testing Service Product and Services
    Table 208. Mitsubishi Electric IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 209. Mitsubishi Electric Recent Developments/Updates
    Table 210. Mitsubishi Electric Competitive Strengths & Weaknesses
    Table 211. Micross Basic Information, Area Served and Competitors
    Table 212. Micross Major Business
    Table 213. Micross IC Packaging and Testing Service Product and Services
    Table 214. Micross IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 215. Micross Recent Developments/Updates
    Table 216. Micross Competitive Strengths & Weaknesses
    Table 217. UTAC Basic Information, Area Served and Competitors
    Table 218. UTAC Major Business
    Table 219. UTAC IC Packaging and Testing Service Product and Services
    Table 220. UTAC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 221. UTAC Recent Developments/Updates
    Table 222. UTAC Competitive Strengths & Weaknesses
    Table 223. KYEC Basic Information, Area Served and Competitors
    Table 224. KYEC Major Business
    Table 225. KYEC IC Packaging and Testing Service Product and Services
    Table 226. KYEC IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 227. KYEC Recent Developments/Updates
    Table 228. KYEC Competitive Strengths & Weaknesses
    Table 229. ChipMOS Basic Information, Area Served and Competitors
    Table 230. ChipMOS Major Business
    Table 231. ChipMOS IC Packaging and Testing Service Product and Services
    Table 232. ChipMOS IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 233. ChipMOS Recent Developments/Updates
    Table 234. China Resources Group Basic Information, Area Served and Competitors
    Table 235. China Resources Group Major Business
    Table 236. China Resources Group IC Packaging and Testing Service Product and Services
    Table 237. China Resources Group IC Packaging and Testing Service Revenue, Gross Margin and Market Share (2017-2022) & (USD Million)
    Table 238. IC Packaging and Testing Service Raw Material
    Table 239. Key Manufacturers of IC Packaging and Testing Service Raw Materials
    Table 240. IC Packaging and Testing Service Typical Distributors
    Table 241. IC Packaging and Testing Service Typical Customers
List of Figure
    Figure 1. IC Packaging and Testing Service Picture
    Figure 2. World IC Packaging and Testing Service Total Market Size: 2017 & 2021 & 2028, (USD Million)
    Figure 3. World IC Packaging and Testing Service Total Market Size (2017-2028) & (USD Million)
    Figure 4. World IC Packaging and Testing Service Market Size Market Share by Region (2017-2028)
    Figure 5. United States IC Packaging and Testing Service Market Size (2017-2028) & (USD Million)
    Figure 6. China IC Packaging and Testing Service Market Size (2017-2028) & (USD Million)
    Figure 7. Europe IC Packaging and Testing Service Market Size (2017-2028) & (USD Million)
    Figure 8. Japan IC Packaging and Testing Service Market Size (2017-2028) & (USD Million)
    Figure 9. South Korea IC Packaging and Testing Service Market Size (2017-2028) & (USD Million)
    Figure 10. ASEAN IC Packaging and Testing Service Market Size (2017-2028) & (USD Million)
    Figure 11. India IC Packaging and Testing Service Market Size (2017-2028) & (USD Million)
    Figure 12. IC Packaging and Testing Service Market Drivers
    Figure 13. Factors Affecting Demand
    Figure 14. Producer Shipments of IC Packaging and Testing Service by Player Revenue ($MM) and Market Share (%): 2021
    Figure 15. Global Four-firm Concentration Ratios (CR4) for IC Packaging and Testing Service Markets in 2021
    Figure 16. Global Four-firm Concentration Ratios (CR8) for IC Packaging and Testing Service Markets in 2021
    Figure 17. United States VS China: IC Packaging and Testing Service Market Size Market Share Comparison (2017 & 2021 & 2028)
    Figure 18. World IC Packaging and Testing Service Market Size by Type, (USD Million), 2017 & 2021 & 2028
    Figure 19. World IC Packaging and Testing Service Market Size Market Share by Type in 2021
    Figure 20. IDM
    Figure 21. OSAT
    Figure 22. World IC Packaging and Testing Service Market Size Market Share by Type (2017-2028)
    Figure 23. World IC Packaging and Testing Service Market Size by Application, (USD Million), 2017 & 2021 & 2028
    Figure 24. World IC Packaging and Testing Service Market Size Market Share by Application in 2021
    Figure 25. Communication
    Figure 26. Automotive Electronics
    Figure 27. Industrial
    Figure 28. Consumer Electronics
    Figure 29. Computing and Networking
    Figure 30. Other
    Figure 31. World IC Packaging and Testing Service Market Size Market Share by Application (2017-2028)
    Figure 32. Manufacturing Cost Structure Analysis of IC Packaging and Testing Service in 2021
    Figure 33. Manufacturing Process Analysis of IC Packaging and Testing Service
    Figure 34. IC Packaging and Testing Service Industrial Chain
    Figure 35. Distribution Channel Breakdown for IC Packaging and Testing Service Shipments (%): 2017-2028
    Figure 36. Direct Channel Pros & Cons
    Figure 37. Indirect Channel Pros & Cons
    Figure 38. Methodology
    Figure 39. Research Process and Data Source

Research Methodology

Client Requirements

Review and analyze client requirements

Discussion of all the project requirements and queries

Flexibility Check

Project Feasibility Analysis

Finalizing tentative research programme

Structuring project proposal with scope, timeline, and costs

Analyzing Market Dynamics

Determination of key drivers, restraints, challenge, and opportunity

Identifies market needs and trends

Market Size Estimation & Forecast

Estimation of historical data based on secondary and primary data

Anticipating market recast by assigning weightage to market forces (drivers, restraints, opportunities)

Freezing historical and forecast market size estimations based on evolution, trends, outlook, and strategies

Consideration of geography, region-specific product/service demand for region segments

Consideration of product utilization rates, product demand outlook for segments by application or end-user.

Data Source

Secondary Source
Data collections from annual reports, presentations,associations, journals, analyst reports, paid database, press releases, blogs, newsletters,and GIR repositories.

Primary Source
Research discussion with manufacturers, distributors, suppliers, end user, industry experts to verify insights.

Validation and
triangulation of
secondary and primary source.

Collection of data

Cumulating and collating the essential qualitative and quantitative data

Generation of report in client requested format by research analysts

Reviews by expert analysts

Final quality check

Clarifying queries

Receiving feedback

Ensuring satisfaction

01 Identification of data

This step involves identification of several primary and secondary data research sources, including Global Info Research's internal data sources. The primary sources consist of in-depth discussions and interviews with policy makers, industry experts, and data evaluators, whereas secondary sources include a thorough study of market journals, press releases, annual reports, and government and non-government agencies websites.
02 Evaluation of Market Dynamic

This phase includes a detailed evaluation of several factors that are likely to affect the market dynamics. It involves a comprehensive assessment of major market pain points, drivers, and trends. It also comprises a detailed study of research plans and methodology.
03 Collection of Data

This process consists of gathering data, accessing proprietary databases, and reaching out to key industry participants that operate in the market across the value chain. It also involves studying several patterns in the historical data and comparing it with the current scenario.
04 Collaboration of Data

This stage involves the validation of data and arrival at actual statistics, and evolution of the market over the years. It entails the study and analyzes various segments and verticals of the market. An impact analysis is also performed to observe which factors will affect the market in the next few years.
05 Verification and Analysis

This is the final stage, which involves both quantity and quality checks. Although the process of data verification is an integral part of the research process, all data points and statistics and figures are re-checked to uphold their authenticity and validity.

Companies Mentioned

Intel
Samsung
SK Hynix
Micron
ASE Group
Amkor Technology, Inc.
Huatian Technology
Powertech Technology, Inc.
Chipbond
Presto Engineering
JECT
Siliconware Precision Industries Co., Ltd.
Tongfu Microelectronics
Tower Semiconductor
Qualcomm
MediaTek
UMC
Apple
IBM
Graphcore
ADLINK
Kioxia
Texas Instruments
TSMC
Analog Devices
Sony
Infineon
Bosch
onsemi
Mitsubishi Electric
Micross
UTAC
KYEC
ChipMOS
China Resources Group

Product Tags

ic packaging testing service production demand producers

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Low Response Time Display Supply

Hi-Fi Stereo Power Amplifiers

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