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Total: 4 records, 1 pages
Search For: Micro Solder Ball
Global Micro Solder Ball Supply, Demand and Key Producers, 2024-2030
28 Mar 2024
Electronics & Semiconductor
Micro solder bumps/balls are used in surface mount components for interconnection between chips and substrates, which significantly reduces the size of electronics and also increases the speed of signal propagation and performance of electronics.
USD4480.00
Add To Cart
Global Micro Solder Ball Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
28 Mar 2024
Electronics & Semiconductor
Micro solder bumps/balls are used in surface mount components for interconnection between chips and substrates, which significantly reduces the size of electronics and also increases the speed of signal propagation and performance of electronics.
USD3480.00
Add To Cart
Global Lead-free Micro Solder Ball Supply, Demand and Key Producers, 2024-2030
28 Mar 2024
Electronics & Semiconductor
One of the typical uses of micro ball is to make an electrical connect between semiconductor package and circuit board. Lead-free micro balls have superior fatigue resistance and mountability and are suitable for various packages from BGA and CSP to flip chip.
USD4480.00
Add To Cart
Global Lead-free Micro Solder Ball Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
28 Mar 2024
Electronics & Semiconductor
One of the typical uses of micro ball is to make an electrical connect between semiconductor package and circuit board. Lead-free micro balls have superior fatigue resistance and mountability and are suitable for various packages from BGA and CSP to flip chip.
USD3480.00
Add To Cart
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With better results and higher quality products,Our professional reports can achieve four things:
Insight into the industry market information
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Prospects for future development
Develop industry investment strategy
Search For: Micro Solder Ball
Total: 4 records, 1 pages
Micro solder bumps/balls are used in surface mount components for interconnection between chips and substrates, which significantly reduces the size of electronics and also increases the speed of signal propagation and performance of electronics.
USD4480.00
Add To Cart
Micro solder bumps/balls are used in surface mount components for interconnection between chips and substrates, which significantly reduces the size of electronics and also increases the speed of signal propagation and performance of electronics.
USD3480.00
Add To Cart
One of the typical uses of micro ball is to make an electrical connect between semiconductor package and circuit board. Lead-free micro balls have superior fatigue resistance and mountability and are suitable for various packages from BGA and CSP to flip chip.
USD4480.00
Add To Cart
One of the typical uses of micro ball is to make an electrical connect between semiconductor package and circuit board. Lead-free micro balls have superior fatigue resistance and mountability and are suitable for various packages from BGA and CSP to flip chip.
USD3480.00
Add To Cart
Popular Product Keywords
- We Provide Professional, Accurate Market Analysis to Help You Stay Ahead of Your Competition.Speak to our analyst >>
Our Clients
What We Can Provide?
With better results and higher quality products,Our professional reports can achieve four things:
-
Insight into the industry market information
-
Analyze market development needs
-
Prospects for future development
-
Develop industry investment strategy
- Digging deeper into global industry information and providing market strategies.Contact Us >>