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Vacuum coating refers to using various physical or chemical methods to vaporize or ionize the target surface under high vacuum conditions, and then deposit it onto the substrate surface to form a thin film. Vacuum coating technology is divided into physical vapor deposition (PVD) and chemical vapor deposition (CVD). Physical vapor deposition methods are mainly divided into vacuum evaporation coating, vacuum sputtering coating, and vacuum ion plating. In the preparation of perovskite layers, the mainstream method used is evaporation coating, referred to as evaporation method. Evaporation coating: Under vacuum conditions, the plating target is heated and evaporated through resistance heating, electron beam bombardment and other methods. The target molecules escape, migrate from the plating material to the surface of the substrate, and deposit to form a thin film. The preparation of perovskite films by vacuum evaporation includes co-evaporation method and step-by-step continuous evaporation method. The co-evaporation method is to evaporate multiple raw materials onto the substrate at the same time, and adjust the proportion of reactants by controlling the evaporation rate of different raw materials; the distributed continuous evaporation method is to deposit a certain raw material on the substrate first, and then deposit another material. The ratio of reactants is controlled by controlling the thickness of the two materials deposited.

USD4480.00

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Vacuum coating refers to using various physical or chemical methods to vaporize or ionize the target surface under high vacuum conditions, and then deposit it onto the substrate surface to form a thin film. Vacuum coating technology is divided into physical vapor deposition (PVD) and chemical vapor deposition (CVD). Physical vapor deposition methods are mainly divided into vacuum evaporation coating, vacuum sputtering coating, and vacuum ion plating. In the preparation of perovskite layers, the mainstream method used is evaporation coating, referred to as evaporation method. Evaporation coating: Under vacuum conditions, the plating target is heated and evaporated through resistance heating, electron beam bombardment and other methods. The target molecules escape, migrate from the plating material to the surface of the substrate, and deposit to form a thin film. The preparation of perovskite films by vacuum evaporation includes co-evaporation method and step-by-step continuous evaporation method. The co-evaporation method is to evaporate multiple raw materials onto the substrate at the same time, and adjust the proportion of reactants by controlling the evaporation rate of different raw materials; the distributed continuous evaporation method is to deposit a certain raw material on the substrate first, and then deposit another material. The ratio of reactants is controlled by controlling the thickness of the two materials deposited.

USD3480.00

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