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Total: 5 records, 1 pages

Global Submount (Heatspreader) Supply, Demand and Key Producers, 2024-2030

date 28 Apr 2024

date Electronics & Semiconductor

new_biaoQian Submount (Heatspreader)

A submount is used in electronics that provides mechanical support, electrical connections, and thermal management for electronic components such as LEDs, laser diodes, and photodiodes. Submounts are typically made from materials with high thermal conductivity and low coefficient of thermal expansion to help dissipate heat generated during operation and minimize the risk of warping or cracking. Common materials used for submounts include ceramics, metal, and diamond. In addition to providing thermal management, submounts also provide electrical connectivity between the electronic component and external circuitry. They often contain wires, pads, or other features to facilitate electrical connections, and their design can be optimized to minimize electrical resistance and improve performance. Overall, submounts play a critical role in the performance and reliability of electronic components by providing mechanical support, electrical connections, and thermal management.

USD4480.00

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Global Submount (Heatspreader) Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 28 Apr 2024

date Electronics & Semiconductor

new_biaoQian Submount (Heatspreader)

A submount is used in electronics that provides mechanical support, electrical connections, and thermal management for electronic components such as LEDs, laser diodes, and photodiodes. Submounts are typically made from materials with high thermal conductivity and low coefficient of thermal expansion to help dissipate heat generated during operation and minimize the risk of warping or cracking. Common materials used for submounts include ceramics, metal, and diamond. In addition to providing thermal management, submounts also provide electrical connectivity between the electronic component and external circuitry. They often contain wires, pads, or other features to facilitate electrical connections, and their design can be optimized to minimize electrical resistance and improve performance. Overall, submounts play a critical role in the performance and reliability of electronic components by providing mechanical support, electrical connections, and thermal management.

USD3480.00

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Global Submount (Heatspreader) Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

date 21 Jul 2023

date Electronics & Semiconductor

new_biaoQian Submount (Heatspreader)

According to our (Global Info Research) latest study, the global Submount (Heatspreader) market size was valued at USD 293.9 million in 2022 and is forecast to a readjusted size of USD 366.3 million by 2029 with a CAGR of 3.2% during review period.

USD3480.00

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Global Submount (Heatspreader) Supply, Demand and Key Producers, 2023-2029

date 21 Jul 2023

date Electronics & Semiconductor

new_biaoQian Submount (Heatspreader)

The global Submount (Heatspreader) market size is expected to reach $ 366.3 million by 2029, rising at a market growth of 3.2% CAGR during the forecast period (2023-2029).

USD4480.00

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Global Submount (Heatspreader) Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

date 16 Jun 2022

date Chemical & Material

new_biaoQian submount heatspreader

The Submount (Heatspreader) market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

USD3480.00

Add To Cart

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industry 28 Apr 2024

industry Electronics & Semiconductor

new_biaoQian Submount (Heatspreader)

A submount is used in electronics that provides mechanical support, electrical connections, and thermal management for electronic components such as LEDs, laser diodes, and photodiodes. Submounts are typically made from materials with high thermal conductivity and low coefficient of thermal expansion to help dissipate heat generated during operation and minimize the risk of warping or cracking. Common materials used for submounts include ceramics, metal, and diamond. In addition to providing thermal management, submounts also provide electrical connectivity between the electronic component and external circuitry. They often contain wires, pads, or other features to facilitate electrical connections, and their design can be optimized to minimize electrical resistance and improve performance. Overall, submounts play a critical role in the performance and reliability of electronic components by providing mechanical support, electrical connections, and thermal management.

USD4480.00

addToCart

Add To Cart

industry 28 Apr 2024

industry Electronics & Semiconductor

new_biaoQian Submount (Heatspreader)

A submount is used in electronics that provides mechanical support, electrical connections, and thermal management for electronic components such as LEDs, laser diodes, and photodiodes. Submounts are typically made from materials with high thermal conductivity and low coefficient of thermal expansion to help dissipate heat generated during operation and minimize the risk of warping or cracking. Common materials used for submounts include ceramics, metal, and diamond. In addition to providing thermal management, submounts also provide electrical connectivity between the electronic component and external circuitry. They often contain wires, pads, or other features to facilitate electrical connections, and their design can be optimized to minimize electrical resistance and improve performance. Overall, submounts play a critical role in the performance and reliability of electronic components by providing mechanical support, electrical connections, and thermal management.

USD3480.00

addToCart

Add To Cart

industry 21 Jul 2023

industry Electronics & Semiconductor

new_biaoQian Submount (Heatspreader)

According to our (Global Info Research) latest study, the global Submount (Heatspreader) market size was valued at USD 293.9 million in 2022 and is forecast to a readjusted size of USD 366.3 million by 2029 with a CAGR of 3.2% during review period.

USD3480.00

addToCart

Add To Cart

industry 21 Jul 2023

industry Electronics & Semiconductor

new_biaoQian Submount (Heatspreader)

The global Submount (Heatspreader) market size is expected to reach $ 366.3 million by 2029, rising at a market growth of 3.2% CAGR during the forecast period (2023-2029).

USD4480.00

addToCart

Add To Cart

industry 16 Jun 2022

industry Chemical & Material

new_biaoQian submount heatspreader

The Submount (Heatspreader) market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

USD3480.00

addToCart

Add To Cart