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Global FPC Polyimide (PI) Coverlay Production, Demand and Key Producers, 2022-2028

date 28 Oct 2022

date Chemical & Material

new_biaoQian fpc polyimide pi coverlay production demand producers

PI coverlay is an insulating and heat-resistant adhesive film formed by polyimide film coated with high-performance adhesive, release paper as an isolation layer, and high-temperature curing. The material is widely used in the manufacture of FPC flexible circuit boards for circuit protection and insulation.

USD4480.00

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PI coverlay is an insulating and heat-resistant adhesive film formed by polyimide film coated with high-performance adhesive, release paper as an isolation layer, and high-temperature curing. The material is widely used in the manufacture of FPC flexible circuit boards for circuit protection and insulation.

USD4480.00

addToCart

Add To Cart