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Total: 4 records, 1 pages

Global Metal Shell for Microelectronic Packages Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

date 02 Jan 2024

date Packaging

new_biaoQian Metal Shell for Microelectronic Packages

According to our (Global Info Research) latest study, the global Metal Shell for Microelectronic Packages market size was valued at USD 2051.9 million in 2023 and is forecast to a readjusted size of USD 2038.2 million by 2030 with a CAGR of -0.1% during review period.

USD3480.00

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Global Metal Shell for Microelectronic Packages Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

date 18 Mar 2023

date Packaging

new_biaoQian Metal Shell for Microelectronic Packages

Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.

USD3480.00

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Global Metal Shell for Microelectronic Packages Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

date 04 Jan 2022

date Packaging

new_biaoQian metal shell for microelectronic packages

The Metal Shell for Microelectronic Packages market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

USD3480.00

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Global Metal Shell for Microelectronic Packages Market 2021 by Manufacturers, Regions, Type and Application, Forecast to 2026

date 05 Jun 2021

date Packaging

new_biaoQian metal shell for microelectronic packages

The Metal Shell for Microelectronic Packages market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

USD3480.00

Add To Cart

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According to our (Global Info Research) latest study, the global Metal Shell for Microelectronic Packages market size was valued at USD 2051.9 million in 2023 and is forecast to a readjusted size of USD 2038.2 million by 2030 with a CAGR of -0.1% during review period.

USD3480.00

addToCart

Add To Cart

Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.

USD3480.00

addToCart

Add To Cart

The Metal Shell for Microelectronic Packages market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

USD3480.00

addToCart

Add To Cart

The Metal Shell for Microelectronic Packages market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

USD3480.00

addToCart

Add To Cart